| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/12/2001 | EP1133218A2 Multilayered circuit board and method for producing the same |
| 09/12/2001 | EP1133024A2 A header, a method of manufacture thereof and electronic device employing the same |
| 09/12/2001 | EP1132973A1 Metal-insulator-metal capacitor and process for making the same |
| 09/12/2001 | EP1132962A2 Wiring board, semiconductor device and production methods thereof |
| 09/12/2001 | EP1132961A1 Circuit substrate for mounting a semiconductor element |
| 09/12/2001 | EP1131846A1 Cvd nanoporous silica low dielectric constant films |
| 09/12/2001 | EP1131784A1 Self-adhesive electronic circuit |
| 09/12/2001 | EP0719452B1 Bonded wafer process incorporating diamond insulator |
| 09/12/2001 | CN2447939Y Luminium-copper welded radiator |
| 09/12/2001 | CN2447938Y Stacked radiator for electronic element |
| 09/12/2001 | CN2447847Y Fastening device |
| 09/12/2001 | CN1313023A Thermal management device and method of making such device |
| 09/12/2001 | CN1312957A Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
| 09/12/2001 | CN1312956A Process for producing epoxy molding material for packing semiconductor device, and moulding material and semiconductor device thereof |
| 09/12/2001 | CN1312670A Formation of metal interconnection structure |
| 09/12/2001 | CN1312593A Composite Ag-Sn LED lead frame |
| 09/12/2001 | CN1312565A Insulator ceramic composition |
| 09/12/2001 | CN1070743C Process for manufacturing contacts for electronics device, mfg. apparatus and continuous strip material used for punching |
| 09/11/2001 | US6289298 Method and apparatus for quasi full-wave modeling of interactions in circuits |
| 09/11/2001 | US6288905 Contact module, as for a smart card, and method for making same |
| 09/11/2001 | US6288904 Chip module, in particular for implantation in a smart card body |
| 09/11/2001 | US6288900 Warpage compensating heat spreader |
| 09/11/2001 | US6288885 Method and apparatus for electrostatic discharge protection for printed circuit boards |
| 09/11/2001 | US6288851 Optical semiconductor device with convergent lens |
| 09/11/2001 | US6288561 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 09/11/2001 | US6288556 Method of electrical measurement of misregistration of patterns |
| 09/11/2001 | US6288454 Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same |
| 09/11/2001 | US6288453 Alignment of openings in semiconductor fabrication |
| 09/11/2001 | US6288452 Semiconductor device including registration accuracy marks |
| 09/11/2001 | US6288451 Flip-chip package utilizing a printed circuit board having a roughened surface for increasing bond strength |
| 09/11/2001 | US6288450 Wiring structure for semiconductor device |
| 09/11/2001 | US6288449 Integrated circuit device with aspect ratio of up to about 15:1 and a metal stack within made of layers of tantalum, tantalum nitride, titanium nitride and copper; at least one of the layers is formed by chemical vapor deposition |
| 09/11/2001 | US6288448 Semiconductor interconnect barrier of boron silicon nitride and manufacturing method therefor |
| 09/11/2001 | US6288447 Semiconductor device including a plurality of interconnection layers |
| 09/11/2001 | US6288445 Semiconductor device |
| 09/11/2001 | US6288444 Semiconductor device and method of producing the same |
| 09/11/2001 | US6288443 Chip module and manufacture of same |
| 09/11/2001 | US6288442 Integrated circuit with oxidation-resistant polymeric layer |
| 09/11/2001 | US6288441 Die paddle clamping method for wire bond enhancement |
| 09/11/2001 | US6288440 Chip arrangement |
| 09/11/2001 | US6288439 Tape carrier package for a semiconductor device |
| 09/11/2001 | US6288438 Semiconductor device including insulation film and fabrication method thereof |
| 09/11/2001 | US6288437 Antifuse structures methods and applications |
| 09/11/2001 | US6288436 Mixed fuse technologies |
| 09/11/2001 | US6288426 Thermal conductivity enhanced semiconductor structures and fabrication processes |
| 09/11/2001 | US6288418 Multiuse input/output connector arrangement for graphics accelerator integrated circuit |
| 09/11/2001 | US6288411 Defect collecting structures for photolithography |
| 09/11/2001 | US6288405 Method for determining ultra shallow junction dosimetry |
| 09/11/2001 | US6288347 Wiring board for flip-chip-mounting |
| 09/11/2001 | US6288344 Integrated EMI shield utilizing a hybrid edge |
| 09/11/2001 | US6288335 Package for at least one semiconductor body |
| 09/11/2001 | US6288169 Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant |
| 09/11/2001 | US6287985 Process for applying a molten droplet coating for integrated circuits |
| 09/11/2001 | US6287977 Method and apparatus for forming improved metal interconnects |
| 09/11/2001 | US6287963 Method for forming a metal contact |
| 09/11/2001 | US6287958 Method of manufacturing a self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device |
| 09/11/2001 | US6287956 Comprising plurality of interconnecting layers formed on semiconductor substrate, fluorine-doped oxide film for burying portions between interconnecting layers, oxide film formed on fluorine-doped oxide film, having planarized surface |
| 09/11/2001 | US6287955 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics |
| 09/11/2001 | US6287952 Method of etching self-aligned vias to metal using a silicon nitride spacer |
| 09/11/2001 | US6287950 Bonding pad structure and manufacturing method thereof |
| 09/11/2001 | US6287949 Multi-chip semiconductor chip module |
| 09/11/2001 | US6287948 Semiconductor device and method for making pattern data |
| 09/11/2001 | US6287942 Hermetic chip and method of manufacture |
| 09/11/2001 | US6287940 Forming thermosensitive and heat resistant microstructures on separate substrates, then joining them with bonding material |
| 09/11/2001 | US6287932 Inductor with magnetic material layers |
| 09/11/2001 | US6287902 Methods of forming etch inhibiting structures on field isolation regions |
| 09/11/2001 | US6287896 Method for manufacturing lead frames and lead frame material for semiconductor device |
| 09/11/2001 | US6287895 Semiconductor package having enhanced ball grid array protective dummy members |
| 09/11/2001 | US6287894 Acoustic device packaged at wafer level |
| 09/11/2001 | US6287893 Method for forming chip scale package |
| 09/11/2001 | US6287890 Low cost decal material used for packaging |
| 09/11/2001 | US6287878 Method of fabricating chip scale package |
| 09/11/2001 | US6287674 Flexible; dimensional stability; heat resistance |
| 09/11/2001 | US6287532 Hydrotalcite compounds of low uranium (U) content and processes for their preparation |
| 09/11/2001 | US6287164 Method and system for manufacturing a molded body |
| 09/11/2001 | US6287137 Inspectable electrical connector for a PGA package |
| 09/11/2001 | US6286586 Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components |
| 09/11/2001 | US6286212 Thermally conductive material and method of using the same |
| 09/11/2001 | US6286208 Interconnector with contact pads having enhanced durability |
| 09/11/2001 | US6286206 Heat-resistant electronic systems and circuit boards |
| 09/11/2001 | US6286204 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/11/2001 | CA2230420C Planar dielectric integrated circuit |
| 09/07/2001 | WO2001065900A1 Liquid cooling device for cooling electronic device |
| 09/07/2001 | WO2001065610A1 Integrated component comprising a metal-insulator-metal capacitor |
| 09/07/2001 | WO2001065605A1 Semiconductor device |
| 09/07/2001 | WO2001065604A2 Functional lid for rf power package |
| 09/07/2001 | WO2001065603A1 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound |
| 09/07/2001 | WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 09/07/2001 | WO2001065601A2 Device for packing electronic components using injection moulding technology |
| 09/07/2001 | WO2001065599A2 Nitride layer forming methods |
| 09/07/2001 | WO2001065598A1 Electrical connection between two surfaces of a substrate and method for producing same |
| 09/07/2001 | WO2001065344A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
| 09/07/2001 | WO2001037288A9 An arrangement for electrically insulating a high voltage component |
| 09/07/2001 | WO2001029890A3 Method relating to anodic bonding |
| 09/07/2001 | CA2400568A1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
| 09/06/2001 | US20010020071 Thermosetting resins |
| 09/06/2001 | US20010019913 Retention mechanism for an electrical assembly |
| 09/06/2001 | US20010019910 Integrated circuit with electrical connection points that can be severed by the action of enegry |
| 09/06/2001 | US20010019905 Lead configurations |
| 09/06/2001 | US20010019892 Process for fabricating a semiconductor device |