| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/18/2001 | US6291322 Method for modeling noises in an integrated circuit |
| 09/18/2001 | US6291316 Method for fabricating passivated semiconductor devices |
| 09/18/2001 | US6291309 Semiconductor device and method for manufacturing the same |
| 09/18/2001 | US6291305 Method for implementing resistance, capacitance and/or inductance in an integrated circuit |
| 09/18/2001 | US6291285 Method for protecting gate oxide layer and monitoring damage |
| 09/18/2001 | US6291277 Method of manufacturing a semiconductor device including etching of a stack of layers by means of photolithography |
| 09/18/2001 | US6291274 Resin molded semiconductor device and method for manufacturing the same |
| 09/18/2001 | US6291273 Plastic molded type semiconductor device and fabrication process thereof |
| 09/18/2001 | US6291271 Method of making semiconductor chip package |
| 09/18/2001 | US6291270 Revealing localized cutting line patterns in a semiconductor device |
| 09/18/2001 | US6291269 Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip |
| 09/18/2001 | US6291267 Process for underfilling chip-under-chip semiconductor modules |
| 09/18/2001 | US6291265 Method of manufacturing an interposer |
| 09/18/2001 | US6291263 Method of fabricating an integrated circuit package having a core-hollowed encapsulation body |
| 09/18/2001 | US6291262 Surface mount TO-220 package and process for the manufacture thereof |
| 09/18/2001 | US6291260 Crack-preventive substrate and process for fabricating solder mask |
| 09/18/2001 | US6291259 Stackable ball grid array semiconductor package and fabrication method thereof |
| 09/18/2001 | US6291254 Methods for determining on-chip interconnect process parameters |
| 09/18/2001 | US6291250 Method for manufacturing semiconductor memory device |
| 09/18/2001 | US6291082 Method of electroless ag layer formation for cu interconnects |
| 09/18/2001 | US6291072 Multilayer element with with insulating film of poly alpha, alpha-difluoroparaxylene |
| 09/18/2001 | US6290822 Sputtering high dielectric constant film onto a substrate to incorporate carbon into high dielectric constant film in addition to those elements included in formulation in ambiant gas comprisng argona nd carbon dioxide, removing carbon |
| 09/18/2001 | US6290631 Method for restoring an alignment mark after planarization of a dielectric layer |
| 09/18/2001 | US6290510 Spring structure with self-aligned release material |
| 09/18/2001 | US6290116 Bondhead lead clamp apparatus and method |
| 09/18/2001 | US6289975 Heat dissipating device |
| 09/18/2001 | CA2202426C Mounting structure for a semiconductor circuit |
| 09/17/2001 | CA2333812A1 Power heatsink for a circuit board |
| 09/13/2001 | WO2001067834A1 Flexible circuits with static discharge protection and process for manufacture |
| 09/13/2001 | WO2001067833A1 A printed circuit board assembly with improved bypass decoupling for bga packages |
| 09/13/2001 | WO2001067832A1 Electrical circuit and substrate therefor |
| 09/13/2001 | WO2001067539A1 Microwave device and method for making same |
| 09/13/2001 | WO2001067522A1 Metal-insulator-metal capacitor and a method for producing same |
| 09/13/2001 | WO2001067513A1 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame |
| 09/13/2001 | WO2001067512A2 Method and apparatus for delivering power to high performance electronic assemblies |
| 09/13/2001 | WO2001067509A1 Semiconductor device and method of manufacture thereof |
| 09/13/2001 | WO2001067504A1 Electronic device packaging |
| 09/13/2001 | WO2001067501A1 Apparatus and method for reducing differential sputter rates |
| 09/13/2001 | WO2001067494A2 Precision electroplated solder bumps and method for manufacturing thereof |
| 09/13/2001 | WO2001067476A1 Electrostatic discharge protection for electrostatically actuated microrelays |
| 09/13/2001 | WO2001067387A1 Reinforced integrated circuit |
| 09/13/2001 | WO2001067019A1 Matrix heat sink with extending fibers |
| 09/13/2001 | WO2001066913A1 Air moving apparatus and method of optimizing performance thereof |
| 09/13/2001 | WO2001066645A1 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
| 09/13/2001 | WO2001066488A1 Ceramic substrate for manufacture/inspection of semiconductor |
| 09/13/2001 | WO2000042231A8 Polycrystalline silicon germanium films for forming micro-electromechanical systems |
| 09/13/2001 | US20010021601 Soket for electric part |
| 09/13/2001 | US20010021590 Directly vaporizing an organosilicon compound and then introducing it to the reaction chamber of the plasma chemical vapor deposition apparatus; residence time of source gas is lengthened by reducing total flow of reaction gas |
| 09/13/2001 | US20010021582 Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices |
| 09/13/2001 | US20010021578 Interconnect structure of semiconductor device and method for manufacturing same |
| 09/13/2001 | US20010021560 Redundancy structure in self-aligned contact process |
| 09/13/2001 | US20010021557 Semiconductor device and method of manufacturing the same |
| 09/13/2001 | US20010021546 Mask, exposure method, line width measuring method, and method for manufacturing semiconductor devices |
| 09/13/2001 | US20010021543 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component |
| 09/13/2001 | US20010021542 Technique for underfilling stacked chips on a cavity MLC module |
| 09/13/2001 | US20010021541 Wafer-level package and methods of fabricating |
| 09/13/2001 | US20010021454 Phosphonium borate |
| 09/13/2001 | US20010021265 Non-lot based method for assembling integrated circuit devices |
| 09/13/2001 | US20010021105 Circuit module |
| 09/13/2001 | US20010020879 Millimeter wave module and radio apparatus |
| 09/13/2001 | US20010020750 Semiconductor wafer and method of specifying crystallographic axis orientation thereof |
| 09/13/2001 | US20010020749 Bond-pad with pad edge strengthening structure |
| 09/13/2001 | US20010020747 Special contact points for accessing internal circuitry of an integrated circuit |
| 09/13/2001 | US20010020746 Flip-chip integrated circuit routing to I/O devices |
| 09/13/2001 | US20010020745 An interconnect component for a semiconductor die including a ruthenium layer and a method for its fabrication |
| 09/13/2001 | US20010020744 Solder circuit |
| 09/13/2001 | US20010020743 Special contact points for accessing internal circuitry of an integrated circuit |
| 09/13/2001 | US20010020741 Semiconductor memory module having double-sided stacked memory chip layout |
| 09/13/2001 | US20010020739 Flip chip type semiconductor device and method for manufacturing the same |
| 09/13/2001 | US20010020738 Solid-state image pickup apparatus and fabricating method thereof |
| 09/13/2001 | US20010020737 Chip scale package |
| 09/13/2001 | US20010020736 Semiconductor package and manufacturing method thereof |
| 09/13/2001 | US20010020735 Semiconductor device |
| 09/13/2001 | US20010020734 Management of a lateral deflection amount of a metal wire in a semiconductor device |
| 09/13/2001 | US20010020728 Metal wire fuse structure with cavity |
| 09/13/2001 | US20010020721 Semiconductor device and wiring method thereof |
| 09/13/2001 | US20010020643 Substrate for device manufacture |
| 09/13/2001 | US20010020549 Wiring board, semiconductor device and production methods thereof |
| 09/13/2001 | US20010020547 Structure capable of preventing damage caused by static electricity |
| 09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020543 Insulator |
| 09/13/2001 | US20010020535 Circuit pack, multilayer printed wiring board, and device |
| 09/13/2001 | US20010020519 Method for dispensing a liquid |
| 09/13/2001 | US20010020408 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/13/2001 | US20010020365 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
| 09/13/2001 | DE10108666A1 Insulating thick film composition calcined with a ceramic blank used in mobile communication devices consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank |
| 09/13/2001 | DE10108557A1 Cooling system for semiconductor laser, has cooling path formed inside heat release body along alignment direction of pumping source such that opening of ends of cooling path is connected to cooler |
| 09/13/2001 | DE10106161A1 Reliable multilayer planar connective structure on integrated circuit chip, combines materials of differing dielectric constant and elasticity |
| 09/13/2001 | DE10104641A1 Halbleiter-Wafer mit einer Punktmarkierung von spezieller Form und Verfahren zum Ausbilden der Punktmarkierung Semiconductor wafer with a point mark of specific shape and method of forming the dot mark |
| 09/13/2001 | DE10054962A1 Power module has insulating substrate with semiconducting power component, control substrate with control IC for controlling power component, conducting bearer plate and housing |
| 09/13/2001 | DE10044837C1 Tampering detection circuit for IC has detection circuit coupled to signal line and at least one line pair extending between separate circuit blocks of IC |
| 09/13/2001 | DE10010979A1 Electrical circuit on substrate e.g. PCB, has component(s) mounted on conducting track layer on substrate and enclosed by recesses in conducting track layer in form of round holes or trenches |
| 09/13/2001 | DE10010637A1 Circuit arrangement especially semiconductor module, power semiconductor module or similar |
| 09/13/2001 | DE10010461A1 Process for packing electronic components comprises injection molding components into ceramic substrate having conducting pathways, contact connection surfaces and pressure contacts |
| 09/13/2001 | DE10010285A1 Teststruktur bei integriertem Halbleiter Test structure for integrated semiconductor |
| 09/13/2001 | DE10008572A1 Power semiconductor module for e.g. vehicular and industrial controls, contains substrate with sleeves connected to it, to grip pins making electrical connection with circuit board |
| 09/13/2001 | DE10006964A1 Elektronisches Bauelement, Verfahren zum Herstellen einer leitenden Verbindung in einem elektronischen Bauelelent und Verfahren zum Herstellen eines elektronischen Bauelements Electronic component, method for producing a conductive connection in an electronic Bauelelent and method for fabricating an electronic device |
| 09/13/2001 | CA2402229A1 Method and apparatus for delivering power to high performance electronic assemblies |
| 09/13/2001 | CA2401702A1 Electronic device packaging |