| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/20/2001 | US20010022397 Hybrid BGA and QFP chip package assembly and process for same |
| 09/20/2001 | US20010022396 Fan-out semiconductor chip assembly |
| 09/20/2001 | US20010022395 Cooling structure for multichip module |
| 09/20/2001 | US20010022393 Semiconductor device including edge bond pads and methods |
| 09/20/2001 | US20010022392 Tented plated through-holes and method for fabrication thereof |
| 09/20/2001 | US20010022391 Substrate for semiconductor device and semiconductor device fabrication using the same |
| 09/20/2001 | US20010022388 Method of fabricating the same |
| 09/20/2001 | US20010022382 Method of and apparatus for sealing an hermetic lid to a semiconductor die |
| 09/20/2001 | US20010022381 Semiconductor raised source-drain structure |
| 09/20/2001 | US20010022370 Transducer module with an optical semiconductor, and method for producing a transducer module |
| 09/20/2001 | US20010022369 Semiconductor integrated circuit device |
| 09/20/2001 | US20010022360 Test structure in an integrated semiconductor |
| 09/20/2001 | US20010022237 Ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries; high coefficient of thermal expansion and a high dielectric constant |
| 09/20/2001 | US20010022236 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 09/20/2001 | US20010022219 Plate type heat pipe and its mounting structure |
| 09/20/2001 | US20010022021 Method of producing chip-type electronic devices |
| 09/20/2001 | DE10110151A1 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode |
| 09/20/2001 | DE10034262C1 Semiconducting device, especially for motor vehicle, has temperature regulation, and control unit causes integrated circuit to perform dummy working cycles if temperature below threshold |
| 09/20/2001 | DE10021098C1 Production of conducting pathways on an integrated chip comprises applying a stacked dielectric layer, carrying out photolithography, etching, applying conducting material and removing, and applying an insulating layer |
| 09/20/2001 | DE10011892A1 Montagesubstrat und Wärmesenke für Hochleistungsdiodenlaserbarren Mounting substrate and heat sink for high power diode laser bars |
| 09/20/2001 | DE10008695A1 Vorrichtung zur Aufnahme von vorzugsweise elektronischen Komponenten An apparatus for receiving electronic components preferably |
| 09/20/2001 | CA2400982A1 High performance cold plate for electronic cooling |
| 09/20/2001 | CA2374008A1 Cooling device for electronic components |
| 09/19/2001 | EP1134806A2 Stress reducing lead-frame for plastic encapsulation |
| 09/19/2001 | EP1134805A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 09/19/2001 | EP1134804A2 Thermally enhanced semiconductor carrier |
| 09/19/2001 | EP1134801A2 Method of fabrication and testing of electronic circuit structures in a semiconducting substrate |
| 09/19/2001 | EP1134800A2 Semiconductor device baking method |
| 09/19/2001 | EP1134300A2 Fe-Ni alloy |
| 09/19/2001 | EP1133904A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 09/19/2001 | EP1133800A1 Electronic component and coating agent |
| 09/19/2001 | EP1133796A1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support |
| 09/19/2001 | EP1133793A1 Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
| 09/19/2001 | EP1133791A1 Heat sink manufacturing device and manufacturing method |
| 09/19/2001 | EP0839078B1 Method of manufacturing Si-Al alloys for electronic packaging |
| 09/19/2001 | CN1314072A High density printed circuit substrate and method of fabrication |
| 09/19/2001 | CN1314005A Semiconductor chip with surface coating |
| 09/19/2001 | CN1313993A Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 09/19/2001 | CN1313882A Paste composition, and protective film and semiconductor device both obtained with the same |
| 09/19/2001 | CN1313871A Epoxy resin composition and process for producing silane-modified epoxy resin |
| 09/19/2001 | CN1313655A Socket for electric component |
| 09/19/2001 | CN1313639A Semiconductor device |
| 09/19/2001 | CN1313638A Aluminium-copper alloy workpiece and manufacture thereof and radiator therewith |
| 09/19/2001 | CN1313637A Chip package with high effective heat transferring structure |
| 09/19/2001 | CN1313636A Improvement of binding faces of tube top |
| 09/19/2001 | CN1313409A Method for forming electric conductive region by ion implanation |
| 09/19/2001 | CN1313360A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 09/19/2001 | CN1071495C Mounting laminates and chip package equipped therewith |
| 09/19/2001 | CN1071494C 半导体器件 Semiconductor devices |
| 09/19/2001 | CN1071493C Semiconductor apparatus |
| 09/19/2001 | CN1071492C Leadframe structure |
| 09/19/2001 | CN1071491C 半导体封装件 Semiconductor package |
| 09/19/2001 | CN1071490C Method for forming tungsten plug |
| 09/18/2001 | US6292927 Reduction of process antenna effects in integrated circuits |
| 09/18/2001 | US6292582 Method and system for identifying defects in a semiconductor |
| 09/18/2001 | US6292368 Electrical power component mounted by brazing on a support and corresponding mounting process |
| 09/18/2001 | US6292367 Thermally efficient semiconductor chip |
| 09/18/2001 | US6292366 Printed circuit board with embedded integrated circuit |
| 09/18/2001 | US6292365 Electronic apparatus |
| 09/18/2001 | US6292362 Self-contained flowable thermal interface material module |
| 09/18/2001 | US6292265 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 09/18/2001 | US6292139 Electronic part and a method of manufacturing the same |
| 09/18/2001 | US6292086 Lateral high-Q inductor for semiconductor devices |
| 09/18/2001 | US6292024 Integrated circuit with a serpentine conductor track for circuit selection |
| 09/18/2001 | US6292009 Reduced terminal testing system |
| 09/18/2001 | US6291907 Magnetically coupled signal isolator using a faraday shielded MR or GMR receiving element |
| 09/18/2001 | US6291899 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 09/18/2001 | US6291898 Ball grid array package |
| 09/18/2001 | US6291897 Carriers including projected contact structures for engaging bumped semiconductor devices |
| 09/18/2001 | US6291896 Functionally symmetric integrated circuit die |
| 09/18/2001 | US6291895 Method of fabricating semiconductor having through hole |
| 09/18/2001 | US6291894 Method and apparatus for a semiconductor package for vertical surface mounting |
| 09/18/2001 | US6291893 Power semiconductor device for “flip-chip” connections |
| 09/18/2001 | US6291892 Semiconductor package that includes a shallow metal basin surrounded by an insulator frame |
| 09/18/2001 | US6291891 Semiconductor device manufacturing method and semiconductor device |
| 09/18/2001 | US6291890 Semiconductor device having a silicide structure |
| 09/18/2001 | US6291889 High temperature resistant thin-film system |
| 09/18/2001 | US6291887 Dual damascene arrangements for metal interconnection with low k dielectric constant materials and nitride middle etch stop layer |
| 09/18/2001 | US6291886 Semiconductor device having wirings with reflection preventing film and method of manufacturing the same |
| 09/18/2001 | US6291885 Thin metal barrier for electrical interconnections |
| 09/18/2001 | US6291884 Chip-size semiconductor packages |
| 09/18/2001 | US6291883 Static random-access memory device having a local interconnect structure |
| 09/18/2001 | US6291881 Dual silicon chip package |
| 09/18/2001 | US6291880 Semiconductor device including an integrally molded lead frame |
| 09/18/2001 | US6291879 Integrated circuit chip with improved locations of overvoltage protection elements |
| 09/18/2001 | US6291878 Package for multiple high power electrical components |
| 09/18/2001 | US6291877 Flexible IC chip between flexible substrates |
| 09/18/2001 | US6291871 Method of jointly forming stacked capacitors and antifuses, method of blowing antifuses, and antifuses and stacked capacitors constituting a part of integrated circuitry |
| 09/18/2001 | US6291864 Gate structure having polysilicon layer with recessed side portions |
| 09/18/2001 | US6291858 Multistack 3-dimensional high density semiconductor device and method for fabrication |
| 09/18/2001 | US6291835 Semiconductor device |
| 09/18/2001 | US6291833 Apparatus for mapping scratches in an oxide film |
| 09/18/2001 | US6291776 Thermal deformation management for chip carriers |
| 09/18/2001 | US6291775 Flip chip bonding land waving prevention pattern |
| 09/18/2001 | US6291627 Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide |
| 09/18/2001 | US6291626 Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured |
| 09/18/2001 | US6291556 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/18/2001 | US6291348 Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed |
| 09/18/2001 | US6291344 Integrated circuit with improved contact barrier |
| 09/18/2001 | US6291333 Method of fabricating dual damascene structure |