| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/26/2001 | CN1314701A Semiconductor substrate and its producing process |
| 09/26/2001 | CN1314686A Laminated ceramic electronic device |
| 09/26/2001 | CN1314618A Method for preparing multiple layer inner connection circuit |
| 09/26/2001 | CN1314225A Structure and method for copper plating layer integrated circuit welding spot |
| 09/25/2001 | US6295209 Semiconductor device including combed bond pad opening, assemblies and methods |
| 09/25/2001 | US6295205 Explosion protection for semiconductor modules |
| 09/25/2001 | US6295203 Heat sink clip assembly |
| 09/25/2001 | US6295202 Heatsink for actively cooled daughterboard system |
| 09/25/2001 | US6295200 Carrier assembly and method |
| 09/25/2001 | US6295199 Electronics module and a method of manufacturing such a module |
| 09/25/2001 | US6294966 Interconnection device |
| 09/25/2001 | US6294909 Electro-magnetic lithographic alignment method |
| 09/25/2001 | US6294841 Integrated semiconductor circuit having dummy structures |
| 09/25/2001 | US6294839 Apparatus and methods of packaging and testing die |
| 09/25/2001 | US6294837 Semiconductor interconnect having laser machined contacts |
| 09/25/2001 | US6294836 Microelectronic integrated circuit device fabrication |
| 09/25/2001 | US6294835 Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof |
| 09/25/2001 | US6294834 Structure of combined passive elements and logic circuit on a silicon on insulator wafer |
| 09/25/2001 | US6294833 Semiconductor device and fabrication process thereof |
| 09/25/2001 | US6294832 Semiconductor device having structure of copper interconnect/barrier dielectric liner/low-k dielectric trench and its fabrication method |
| 09/25/2001 | US6294831 Electronic package with bonded structure and method of making |
| 09/25/2001 | US6294830 Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer |
| 09/25/2001 | US6294828 Semiconductor chip package |
| 09/25/2001 | US6294827 Hybrid microwave-frequency integrated circuit |
| 09/25/2001 | US6294825 Asymmetrical mold of multiple-part matrixes |
| 09/25/2001 | US6294824 Bonding support for leads-over-chip process |
| 09/25/2001 | US6294816 Secure integrated circuit |
| 09/25/2001 | US6294799 Semiconductor device and method of fabricating same |
| 09/25/2001 | US6294741 Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive |
| 09/25/2001 | US6294731 Apparatus for multichip packaging |
| 09/25/2001 | US6294484 Method of forming TEOS oxide films |
| 09/25/2001 | US6294474 Process for controlling oxide thickness over a fusible link using transient etch stops |
| 09/25/2001 | US6294465 Method for making integrated circuits having features with reduced critical dimensions |
| 09/25/2001 | US6294462 Manufacturing method of interconnection layer for semiconductor device |
| 09/25/2001 | US6294458 Semiconductor device adhesive layer structure and process for forming structure |
| 09/25/2001 | US6294456 Method of prefilling of keyhole at the top metal level with photoresist to prevent passivation damage even for a severe top metal rule |
| 09/25/2001 | US6294455 Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry |
| 09/25/2001 | US6294454 Method for manufacturing a bed structure underlying electrode pad of semiconductor device |
| 09/25/2001 | US6294453 Micro fusible link for semiconductor devices and method of manufacture |
| 09/25/2001 | US6294451 Semiconductor device and method for manufacturing the same |
| 09/25/2001 | US6294411 Method for molding a semiconductor device utilizing a satin finish |
| 09/25/2001 | US6294410 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/25/2001 | US6294409 Method of forming a constricted-mouth dimple structure on a leadframe die pad |
| 09/25/2001 | US6294408 Method for controlling thermal interface gap distance |
| 09/25/2001 | US6294406 Highly integrated chip-on-chip packaging |
| 09/25/2001 | US6294405 Method of forming semiconductor device having a sub-chip-scale package structure |
| 09/25/2001 | US6294403 High performance flip chip package |
| 09/25/2001 | US6294397 Drop-in test structure and abbreviated integrated circuit process flow for characterizing production integrated circuit process flow, topography, and equipment |
| 09/25/2001 | US6294275 Has both high thermal conductivity and high mechanical strength; average grain diameter of 2 mum or less; and a half width of the diffraction peak on the (302) plane, obtained by x-ray diffraction, of 0.24 deg. or less. |
| 09/25/2001 | US6294271 Liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin |
| 09/25/2001 | US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 09/25/2001 | US6294244 Sintered product of silicon nitride contains a rare earth element (re) and magnesium; power modules. |
| 09/25/2001 | US6294100 Exposed die leadless plastic chip carrier |
| 09/25/2001 | US6294040 Transferable resilient element for packaging of a semiconductor chip and method therefor |
| 09/25/2001 | US6294018 Alignment techniques for epitaxial growth processes |
| 09/25/2001 | US6293753 Air moving apparatus and method of optimizing performance thereof |
| 09/25/2001 | US6293457 Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization |
| 09/25/2001 | US6293331 Vibration and shock resistant heat sink assembly |
| 09/25/2001 | CA2230419C Planar dielectric integrated circuit |
| 09/20/2001 | WO2001069679A1 Vertical electrical interconnections in a stack |
| 09/20/2001 | WO2001069678A1 Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member |
| 09/20/2001 | WO2001069677A2 Apparatus and method for passive phase change thermal management |
| 09/20/2001 | WO2001069676A2 Method and apparatus for bonding substrates |
| 09/20/2001 | WO2001069675A1 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 09/20/2001 | WO2001069674A1 Aluminum-silicon carbide semiconductor substrate and method for producing the same |
| 09/20/2001 | WO2001069672A1 A method of manufacturing a semiconductor device |
| 09/20/2001 | WO2001069671A1 Method for adjusting an electrical parameter on an integrated electronic component |
| 09/20/2001 | WO2001069670A1 Module with built-in electronic elements and method of manufacture thereof |
| 09/20/2001 | WO2001069360A1 Cooling device for electronic components |
| 09/20/2001 | WO2001069160A1 High performance heat exchange assembly |
| 09/20/2001 | WO2001069159A1 High performance heat exchange assembly |
| 09/20/2001 | WO2001069158A1 High performance cold plate for electronic cooling |
| 09/20/2001 | WO2001068304A2 Flip chip-in-leadframe package and process |
| 09/20/2001 | WO2001050525A8 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 09/20/2001 | WO2001020644A3 Method and apparatus for encapsulating semiconductor chips |
| 09/20/2001 | US20010023139 Center bond flip chip semiconductor carrier and a method of making and using it |
| 09/20/2001 | US20010023138 IC socket and method of assembling the IC socket |
| 09/20/2001 | US20010023128 Semiconductor device having multilevel interconnection structure and method for fabricating the same |
| 09/20/2001 | US20010023126 Spraying tetraethoxysilane and hydrogen peroxide |
| 09/20/2001 | US20010023125 Stress adjustment insulating film |
| 09/20/2001 | US20010023123 Method for forming semiconductor device having low parasite capacitance using air gap and self-aligned contact plug |
| 09/20/2001 | US20010023121 Semiconductor device method of manufacturing same |
| 09/20/2001 | US20010023119 Electrical and thermal contact for use in semiconductor devices |
| 09/20/2001 | US20010023118 Customization of an integrated circuit in packaged form |
| 09/20/2001 | US20010023113 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/20/2001 | US20010023111 Integrated circuit and method of using porous silicon to achieve component isolation in radio frequency applications |
| 09/20/2001 | US20010023096 Semiconductor integrated circuit device having capacitor element |
| 09/20/2001 | US20010023093 Semiconductor memory device employing row repair scheme |
| 09/20/2001 | US20010023088 Stacked semiconductor device including improved lead frame arrangement |
| 09/20/2001 | US20010022720 Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus |
| 09/20/2001 | US20010022488 Package structure for a piezoelectric resonator |
| 09/20/2001 | US20010022416 Manufacturing method for multilayer ceramic device |
| 09/20/2001 | US20010022405 Stepper alignment mark formation with dual field oxide process |
| 09/20/2001 | US20010022404 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
| 09/20/2001 | US20010022403 Bonding pad structure and method for making same |
| 09/20/2001 | US20010022402 Input-output circuit cell and semiconductor integrated circuit apparatus |
| 09/20/2001 | US20010022401 Solid-state image pickup apparatus and manufacturing method thereof |
| 09/20/2001 | US20010022400 Bus line wiring structure in a semiconductor device and method of manufacturing the same |
| 09/20/2001 | US20010022399 Semiconductor integrated circuit device |
| 09/20/2001 | US20010022398 Method and materials for integration of fluorine-containing low-k dielectrics |