| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/02/2001 | US6297079 Method of electrically connecting IGBT transistor chips mounted on an integrated-circuit wafer |
| 10/02/2001 | US6297076 Forming radiation curable adhesive layer on substrate film, joining acrylic adhesive copolymer, radiation polymerizable compound, cutting, radiation, removal and packaging |
| 10/02/2001 | US6297074 Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof |
| 10/02/2001 | US6297073 Semiconductor device |
| 10/02/2001 | US6297072 Method of fabrication of a microstructure having an internal cavity |
| 10/02/2001 | US6297063 In-situ nano-interconnected circuit devices and method for making the same |
| 10/02/2001 | US6296940 Laminate comprising a flame-retardant resin composition |
| 10/02/2001 | US6296778 Method and apparatus for simulating standard test wafers |
| 10/02/2001 | US6296520 Modified structure for preventing electromagnetic interference of central processing unit |
| 10/02/2001 | US6296506 Socket for a pin grid-array package |
| 10/02/2001 | US6296504 Socket for electrical parts |
| 10/02/2001 | US6296048 Heat sink assembly |
| 10/02/2001 | US6295729 Angled flying lead wire bonding process |
| 10/02/2001 | US6295726 Method of manufacturing surface-mountable SIL hybrid circuit |
| 10/02/2001 | US6295724 Apparatus for printed circuit board repair |
| 10/02/2001 | US6295721 Metal fuse in copper dual damascene |
| 10/02/2001 | CA2196268C Package |
| 09/27/2001 | WO2001071908A1 Isolating energy conditioning shield assembly |
| 09/27/2001 | WO2001071809A1 A die attachment surface having pedestals for receiving components and method of using the attachment |
| 09/27/2001 | WO2001071806A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 09/27/2001 | WO2001071805A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 09/27/2001 | WO2001071801A1 Semiconductor device and method of manufacturing same |
| 09/27/2001 | WO2001071799A2 Semiconductor element and method for producing the same |
| 09/27/2001 | WO2001071773A2 Method and device for connecting at least one chip to a rewiring arrangement |
| 09/27/2001 | WO2001070867A2 Flame retardant epoxy molding compositions |
| 09/27/2001 | WO2001070844A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 09/27/2001 | WO2001070843A2 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 09/27/2001 | WO2001070438A1 Device for monitoring and calibrating oxide charge measurement equipment and method therefor |
| 09/27/2001 | WO2001070392A1 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 09/27/2001 | WO2001035006A3 Metal-infiltrated ceramic seal |
| 09/27/2001 | WO2001015508A3 Integrated emi shield utilizing a hybrid edge |
| 09/27/2001 | US20010025365 Semiconductor integrated circuit and wiring method |
| 09/27/2001 | US20010025364 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method |
| 09/27/2001 | US20010024897 Cam retaining means for zif electrical connector |
| 09/27/2001 | US20010024872 Semiconductor integrated circuit device and manufacturing method of that |
| 09/27/2001 | US20010024854 Semiconductor storage device and method of fabricating thereof |
| 09/27/2001 | US20010024840 Adhesion enhanced semiconductor die for mold compound packaging |
| 09/27/2001 | US20010024839 Bumpless flip chip assembly with strips-in-via and plating |
| 09/27/2001 | US20010024838 Semiconductor device having a built-in heat sink and process of manufacturing same |
| 09/27/2001 | US20010024758 Photomask to design pattern |
| 09/27/2001 | US20010024725 Package and method of manufacturing the same |
| 09/27/2001 | US20010024724 Heat sink assembly with overmolded carbon matrix |
| 09/27/2001 | US20010024688 Method for manufacturing a metal interconnection having enhanced filling capability |
| 09/27/2001 | US20010024389 Memory module |
| 09/27/2001 | US20010024259 Tape carrier package film |
| 09/27/2001 | US20010024118 Bondpad attachments having self-limiting properties for penetration of semiconductor die |
| 09/27/2001 | US20010023994 Semiconductor device and the method for manufacturing the same |
| 09/27/2001 | US20010023993 Flip- chip semiconductor device and method of forming the same |
| 09/27/2001 | US20010023991 Semiconductor device and method of its fabrication |
| 09/27/2001 | US20010023990 Semiconductor device and method for fabricating same |
| 09/27/2001 | US20010023989 Semiconductor dielectric structure and method for making the same |
| 09/27/2001 | US20010023988 Semiconductor device |
| 09/27/2001 | US20010023987 Method for improving adhesion to copper |
| 09/27/2001 | US20010023984 Semiconductor package |
| 09/27/2001 | US20010023983 Semiconductor devices |
| 09/27/2001 | US20010023982 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 09/27/2001 | US20010023981 Semiconductor device having improved electrical characteristic and method of producing the same |
| 09/27/2001 | US20010023980 Stacked semiconductor device and semiconductor system |
| 09/27/2001 | US20010023976 Semiconductor device having capacitor which assures sufficient capacity without requiring large space and method of producing the same |
| 09/27/2001 | US20010023975 Method of and apparatus for cutting off fuse electrode, integrated circuit device, and method of manufacturing same |
| 09/27/2001 | US20010023973 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/27/2001 | US20010023968 Electronic device having fibrous interface |
| 09/27/2001 | US20010023962 Esd protection circuit utilizing floating lateral clamp diodes |
| 09/27/2001 | US20010023958 Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof |
| 09/27/2001 | US20010023782 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| 09/27/2001 | US20010023771 Metal line, method for fabricating the metal line, thin film transistor employing the metal line and display device |
| 09/27/2001 | US20010023762 Heat pipe spreader construction |
| 09/27/2001 | US20010023759 Heat sink and Information processor using heat sink |
| 09/27/2001 | US20010023756 Assembled structure having an enlarged heat transfer area for heat radiation therefrom |
| 09/27/2001 | US20010023533 Method of increasing package reliability using package lids with plane CTE Gradients |
| 09/27/2001 | US20010023532 Method for producing multilayer circuit board |
| 09/27/2001 | DE10107125A1 Process for forming an integrated circuit comprises forming a pair of connecting patterns on a substrate followed by an etch stop and a sacrificial insulation layer, and selectively etching the sacrificial insulation layer |
| 09/27/2001 | DE10018415C1 Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path |
| 09/27/2001 | DE10012883A1 Manufacture of package with at least two memory chips - contacting chips with external lead-frame, and connecting chips to internal lead-frame held with tape pieces |
| 09/27/2001 | CA2402383A1 Flame retardant epoxy molding compositions |
| 09/26/2001 | EP1137332A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 09/26/2001 | EP1137329A2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
| 09/26/2001 | EP1137067A2 Multi-chip ball grid array ic packages |
| 09/26/2001 | EP1137066A2 Semiconductor device and process of production of same |
| 09/26/2001 | EP1137065A2 Semiconductor device and manufacturing method thereof |
| 09/26/2001 | EP1137064A2 Air guiding hood |
| 09/26/2001 | EP1137060A2 Method for producing multilayer circuit board and multilayer circuit board |
| 09/26/2001 | EP1136944A1 Non-contact type ic card and method and apparatus for manufacturing the same |
| 09/26/2001 | EP1135978A1 Heatsink for electronic component, and apparatus and method for manufacturing the same |
| 09/26/2001 | EP1135803A1 Interlayer between titanium nitride and high density plasma oxide |
| 09/26/2001 | EP1135802A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 09/26/2001 | EP1135796A1 Process for forming a sion/teos interlevel dielectric with after-treatment of the cvd silicium oxynitride layer |
| 09/26/2001 | EP1135794A1 A method and apparatus for the transport and tracking of an electronic component |
| 09/26/2001 | EP1135693A1 Probe card for probing wafers with raised contact elements |
| 09/26/2001 | EP1135690A2 Lithographic contact elements |
| 09/26/2001 | CN1315056A Integrated electronic micromodule and method for making same |
| 09/26/2001 | CN1315055A Through hole bump contact |
| 09/26/2001 | CN1315044A Electronic device and manufacture thereof |
| 09/26/2001 | CN1314776A Monolithic ceramic electronic element and its producing method and electronic device |
| 09/26/2001 | CN1314733A Cam holding mechanism of zero inserting force electric connector |
| 09/26/2001 | CN1314710A Method and structure of pole interconnection |
| 09/26/2001 | CN1314709A Stress reduced line guide frame for plastic sealing |
| 09/26/2001 | CN1314708A 半导体装置 Semiconductor device |
| 09/26/2001 | CN1314707A Method for forming integrated circuit device and integrated circuit device by formed said method |
| 09/26/2001 | CN1314705A Buried metal double mosaic board capacitor |