Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/20/2013CN103403862A Power semiconductor module and method for producing a sintered power semiconductor module having a temperature sensor
11/20/2013CN103403214A Al alloy film for display devices or semiconductor devices, display device or semiconductor device equipped with al alloy film, and sputtering target
11/20/2013CN103403202A Cu-Ni-Si based alloy and process for manufacturing same
11/20/2013CN103403097A Curable composition
11/20/2013CN103403096A Curable composition
11/20/2013CN103402853A Molded module and electric power steering apparatus
11/20/2013CN103402669A Forging method
11/20/2013CN103402342A Cooling material
11/20/2013CN103401531A Multi-mode radio frequency antenna switch
11/20/2013CN103401438A Novel surface-mounted bridge-type rectifier and manufacturing method thereof
11/20/2013CN103401434A Power unit of large-power current transformer
11/20/2013CN103400848A Encapsulating structure for multiply charge-coupled device
11/20/2013CN103400844A 背侧照明的图像传感器 The backside illuminated image sensor
11/20/2013CN103400841A SiGe BiCMOS (Bipolar Complementary Metal Oxide Semiconductor)-based broadband radio frequency chip electrostatic protection circuit
11/20/2013CN103400836A Proximity sensor packaging structure and manufacturing method thereof
11/20/2013CN103400832A Power semiconductor device
11/20/2013CN103400830A Multilayer chip stacking structure and implementation method thereof
11/20/2013CN103400829A Semiconductor package and manufacture method thereof
11/20/2013CN103400828A Inductor and formation method thereof, and integrated passive device and formation method thereof
11/20/2013CN103400827A Static discharge clamping circuit with bias circuit in 90 nanometer CMOS (complementary metal-oxide-semiconductor transistor) process
11/20/2013CN103400826A Semiconductor package and preparation method thereof
11/20/2013CN103400825A Semiconductor wrapper and manufacturing method thereof
11/20/2013CN103400824A Detection piece and wafer
11/20/2013CN103400823A Fine spacing laminated packaging structure containing copper pillar and packaging method
11/20/2013CN103400822A Array substrate and display device
11/20/2013CN103400821A Surface-mounted inductor and wafer-level manufacturing method thereof
11/20/2013CN103400820A Semiconductor device
11/20/2013CN103400819A Lead frame, preparation method of lead frame, and package structure adopting lead frame
11/20/2013CN103400818A Semiconductor device
11/20/2013CN103400817A Semi-conductor chip packaging module, packaging structure and packaging method of semi-conductor chip packaging module
11/20/2013CN103400816A Packaging part and manufacturing method thereof
11/20/2013CN103400815A Novel radiator structure
11/20/2013CN103400814A Flexible substrate packaging structure and filling method thereof
11/20/2013CN103400813A Flexible substrate encapsulating structure and encapsulating and filling method thereof
11/20/2013CN103400812A FCQFN packaging part filled by underfill material and production process thereof
11/20/2013CN103400811A Frame based flat packaging part adopting special dispensing technology and manufacturing process thereof
11/20/2013CN103400810A Semiconductor chip laminating and packaging structure and manufacturing method thereof
11/20/2013CN103400809A Flexible substrate packaging structure and filling process thereof
11/20/2013CN103400808A Wafer-level packaging structure and packaging method of image sensor
11/20/2013CN103400807A Wafer-level packaging structure and packaging method of image sensor
11/20/2013CN103400778A Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400777A Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400776A Packaging-prior-to-etching type three-dimensional system-level chip-flipped packaging structure and process method thereof
11/20/2013CN103400775A Packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and process method thereof
11/20/2013CN103400774A Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400773A Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400772A Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400771A Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400770A Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400769A Packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and process method thereof
11/20/2013CN103400768A Packaging-prior-to-etching type three-dimensional system-level chip-normally-bonded packaging structure and process method thereof
11/20/2013CN103400767A Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103399622A Manufacturing process of radiating module
11/20/2013CN103398613A Vapor chamber and method for manufacturing same
11/20/2013CN103398358A Low-light-degradation and high-power LED street lamp and manufacturing method thereof
11/20/2013CN103396642A Heat radiation sheet and heat radiation device
11/20/2013CN102776405B Preparation method of bonded gold-silver alloy wire
11/20/2013CN102403297B Shock resistant lead frame and packaging body
11/20/2013CN102372924B Organopolysiloxane composition and semiconductor apparatus
11/20/2013CN102324409B Semiconductor package with heat dispersion structure and manufacturing method for semiconductor package
11/20/2013CN102316669B Fixing structure and fixing method of circuit board with embedded electronic parts to cooler
11/20/2013CN102097346B Power semiconductor package
11/20/2013CN101969051B Semiconductor packaging part and manufacturing method thereof
11/20/2013CN101887891B Electronic apparatus, high-voltage power source and printed circuit board
11/20/2013CN101887888B Power semiconductor module including substrates spaced from each other
11/20/2013CN101673742B 半导体集成电路装置 The semiconductor integrated circuit device
11/20/2013CN101593762B Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
11/20/2013CN101552244B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/20/2013CN101276779B Method of forming buried wiring lines, and substrate and display device using the same
11/20/2013CN101153704B Heatsink and illumination system with a heatsink
11/19/2013US8587135 Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing
11/19/2013US8587134 Semiconductor packages
11/19/2013US8587132 Semiconductor package including an organic substrate and interposer having through-semiconductor vias
11/19/2013US8587131 Through-silicon via and fabrication method thereof
11/19/2013US8587129 Integrated circuit packaging system with through silicon via base and method of manufacture thereof
11/19/2013US8587128 Damascene structure
11/19/2013US8587127 Semiconductor structures and methods of forming the same
11/19/2013US8587126 Stacked microelectronic assembly with TSVs formed in stages with plural active chips
11/19/2013US8587125 Method of manufacturing layered chip package
11/19/2013US8587124 Semiconductor device having low dielectric insulating film and manufacturing method of the same
11/19/2013US8587123 Multi-chip and multi-substrate reconstitution based packaging
11/19/2013US8587122 Semiconductor flip-chip system having three-dimensional solder joints
11/19/2013US8587121 Backside dummy plugs for 3D integration
11/19/2013US8587120 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
11/19/2013US8587119 Conductive feature for semiconductor substrate and method of manufacture
11/19/2013US8587118 Light emitting device package and manufacturing method thereof
11/19/2013US8587117 Stacked semiconductor chips having circuit element provided with each of the semiconductor chips
11/19/2013US8587116 Semiconductor module comprising an insert
11/19/2013US8587114 Multichip electronic packages and methods of manufacture
11/19/2013US8587113 Thermal plate with planar thermal zones for semiconductor processing
11/19/2013US8587111 Multi-chip package with thermal frame and method of assembling
11/19/2013US8587109 Stacked microelectronic dies and methods for stacking microelectronic dies
11/19/2013US8587107 Silicon carbide semiconductor
11/19/2013US8587106 Wide band and radio frequency waveguide and hybrid integration in a silicon package
11/19/2013US8587105 Semiconductor device
11/19/2013US8587104 Wiring board and semiconductor package
11/19/2013US8587102 Vertical system integration
11/19/2013US8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
11/19/2013US8587100 Lead frame and semiconductor package using the same
11/19/2013US8587099 Leadframe having selective planishing
1 ... 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 ... 2262