| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/04/2001 | US20010025964 Connecting device for power semiconductor modules with compensation for mechanical stresses |
| 10/04/2001 | US20010025958 Semiconductor device and manufacturing method thereof |
| 10/04/2001 | US20010025797 Nitride layer forming methods |
| 10/04/2001 | US20010025725 Electrically Conductive Apparatuses |
| 10/04/2001 | US20010025723 Mounting structure of electronic component on substrate board |
| 10/04/2001 | US20010025722 Glass-ceramic wiring board |
| 10/04/2001 | US20010025721 Printed wiring board, IC card module using the same, and method for producing IC card module |
| 10/04/2001 | US20010025701 Heat sink |
| 10/04/2001 | EP1145309A3 Use of additional bonding finger rows to improve wire bond density |
| 10/04/2001 | EP1144565A3 Liquid carbon dioxide cleaning utilizing natural solvents |
| 10/04/2001 | EP1139705A1 Printed wiring board and method of producing the same |
| 10/04/2001 | EP1139424A2 Semiconductor device and method of manufacturing the same |
| 10/04/2001 | EP1139423A2 Fuse structure for integrated circuits |
| 10/04/2001 | EP1139422A2 Fuse structure for semiconductor device |
| 10/04/2001 | EP1139421A2 Insulated power multichip package |
| 10/04/2001 | EP1139420A2 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition |
| 10/04/2001 | EP1139418A2 Reduced fluorine contamination for tungsten cvd |
| 10/04/2001 | EP1139413A2 Wire bonding process |
| 10/04/2001 | EP1139412A1 Flip-chip semiconductor device with backside contact |
| 10/04/2001 | EP1139411A1 Flip-chip semiconductor assembly with backside contacts |
| 10/04/2001 | EP1139396A2 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
| 10/04/2001 | EP1139391A1 Method and apparatus for annealing copper films |
| 10/04/2001 | EP1138804A2 Component with at least two contiguous insulating layers and manufacturing method therefor |
| 10/04/2001 | EP1138420A2 Molybdenum-copper composite powder |
| 10/04/2001 | EP1138181A1 Article having an embedded electronic device, and method of making same |
| 10/04/2001 | EP1138091A1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss) |
| 10/04/2001 | EP1138080A1 Monolithic integrated capacitor |
| 10/04/2001 | EP1138078A1 Method for reducing die cracking in integrated circuits |
| 10/04/2001 | EP1138077A1 Die pad crack absorption integrated circuit chip and fabrication process |
| 10/04/2001 | EP1138076A1 Methods and compositions for improving interconnect metallization performance in integrated circuits |
| 10/04/2001 | EP1138072A1 System and method for repairing interconnect links |
| 10/04/2001 | EP1138070A1 Low alpha emissive solder bumps |
| 10/04/2001 | EP1137708A1 Epoxy resin composition and semiconductor device |
| 10/04/2001 | EP0985007A4 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 10/04/2001 | EP0826238B1 Semiconductor body with a substrate glued to a support body |
| 10/04/2001 | EP0767970B1 Electronic multilayer component and method of its manufacture |
| 10/04/2001 | EP0731984B1 Rectifier diode |
| 10/04/2001 | EP0694212B1 Improved thermally conductive interface |
| 10/04/2001 | EP0538457B1 Fabrication of metal matrix composites by vacuum die casting |
| 10/04/2001 | DE10016061A1 Fixture device for heat-sink e.g. for use with CPU, has handle engaging retainer strap and has its two limbs designed to fit one of two clamps |
| 10/04/2001 | DE10014914A1 Verfahren zur Herstellung und Überprüfung von Strukturen elektronischer Schaltungen in einem Halbleitersubstrat Process for the preparation and verification of structures of electronic circuits in a semiconductor substrate, |
| 10/04/2001 | DE10014458A1 Cooling body for electronic component or electric circuit e.g. for fan controller in motor vehicle, has intermediate element for accommodating component or circuit mounted at least partly in base body by reshaping process |
| 10/04/2001 | DE10014380A1 Vorrichtung zum Verpacken von elektronischen Bauteilen Apparatus for packaging electronic components |
| 10/04/2001 | DE10014306A1 System carrier for semiconductor chip with a conductor frame, has many small signal leads extending from frame bondable to chip and surfaces between leads |
| 10/04/2001 | DE10014305A1 Electronic component with many contact bumps for semiconductor chip, has bond channel window which broadens with increasing distance from the neutral point |
| 10/04/2001 | DE10014304A1 Production of semiconductor component uses two stage filling step to seal contact pads |
| 10/04/2001 | DE10014300A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 10/04/2001 | DE10014299A1 Chip structure used in electronic devices comprises a semiconductor chip arranged on a substrate with a surface having connecting surfaces facing away from the substrate |
| 10/04/2001 | DE10013863A1 Luftleithaube Airguide |
| 10/03/2001 | CN1316103A Semiconductor device and substrate for semiconductor device |
| 10/03/2001 | CN1315823A Method for manufacturing circuit device and circuit device |
| 10/03/2001 | CN1315742A Semiconductor chip device and its package method |
| 10/03/2001 | CN1072397C Winding automatic-welding spherical-array type integrated circuit packaging method |
| 10/03/2001 | CN1072396C Bead array-type IC package method without substrate and tin bead |
| 10/03/2001 | CN1072395C Dual-modes microwave/mm wave integrated circuit sealing pack |
| 10/03/2001 | CN1072394C Method for IC package |
| 10/02/2001 | US6297964 Semiconductor device, method of fabricating the same film carrier tape, circuit board, and electronic apparatus |
| 10/02/2001 | US6297961 Semiconductor module and heat sink used in such module |
| 10/02/2001 | US6297960 Heat sink with alignment and retaining features |
| 10/02/2001 | US6297959 Radiation structure for heating element |
| 10/02/2001 | US6297700 RF power transistor having cascaded cells with phase matching between cells |
| 10/02/2001 | US6297565 Compatible IC packages and methods for ensuring migration path |
| 10/02/2001 | US6297563 Bonding pad structure of semiconductor device |
| 10/02/2001 | US6297562 Semiconductive chip having a bond pad located on an active device |
| 10/02/2001 | US6297561 Semiconductor chip |
| 10/02/2001 | US6297560 Semiconductor flip-chip assembly with pre-applied encapsulating layers |
| 10/02/2001 | US6297559 Structure, materials, and applications of ball grid array interconnections |
| 10/02/2001 | US6297557 Reliable aluminum interconnect via structures |
| 10/02/2001 | US6297555 Semiconductor with titanium nitride barrier layer |
| 10/02/2001 | US6297554 Dual damascene interconnect structure with reduced parasitic capacitance |
| 10/02/2001 | US6297553 Semiconductor device and process for producing the same |
| 10/02/2001 | US6297552 Commonly housed diverse semiconductor die |
| 10/02/2001 | US6297551 Integrated circuit packages with improved EMI characteristics |
| 10/02/2001 | US6297550 Bondable anodized aluminum heatspreader for semiconductor packages |
| 10/02/2001 | US6297549 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 10/02/2001 | US6297548 Stackable ceramic FBGA for high thermal applications |
| 10/02/2001 | US6297547 Mounting multiple semiconductor dies in a package |
| 10/02/2001 | US6297546 Underfill coating for LOC package |
| 10/02/2001 | US6297545 Semiconductor device |
| 10/02/2001 | US6297544 Semiconductor device and method for manufacturing the same |
| 10/02/2001 | US6297543 Chip scale package |
| 10/02/2001 | US6297542 Connecting a die in an integrated circuit module |
| 10/02/2001 | US6297541 Semiconductor device and method for fabricating the same |
| 10/02/2001 | US6297537 Semiconductor device and method for production thereof |
| 10/02/2001 | US6297532 Semiconductor device and method of manufacturing the same |
| 10/02/2001 | US6297524 Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron CMOS |
| 10/02/2001 | US6297517 Semiconductor device and method of fabricating the same |
| 10/02/2001 | US6297460 Multichip module and method of forming same |
| 10/02/2001 | US6297174 Coating substrate surface with coating solution containing as film-forming solute uniformly dissolved in an organic solvent a nitrogen-containing organic compound to form coating layer, drying coating layer by evaporating, baking |
| 10/02/2001 | US6297164 Method for producing contact structures |
| 10/02/2001 | US6297160 Application of pure aluminum to prevent pad corrosion |
| 10/02/2001 | US6297156 Method for enhanced filling of high aspect ratio dual damascene structures |
| 10/02/2001 | US6297155 Method for forming a copper layer over a semiconductor wafer |
| 10/02/2001 | US6297150 Methods of manufacturing a semiconductor device with pores formed between and over wiring patterns of an interlevel insulating layer |
| 10/02/2001 | US6297146 Low resistivity semiconductor barrier layer manufacturing method |
| 10/02/2001 | US6297145 Method of forming a wiring layer having an air bridge construction |
| 10/02/2001 | US6297142 Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy |
| 10/02/2001 | US6297141 Mounting assembly of integrated circuit device and method for production thereof |
| 10/02/2001 | US6297135 Method for forming silicide regions on an integrated device |
| 10/02/2001 | US6297124 Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors |