Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2001
10/09/2001US6300673 Edge connectable metal package
10/09/2001US6300672 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication
10/09/2001US6300670 Backside bus vias
10/09/2001US6300667 Semiconductor structure with air gaps formed between metal leads
10/09/2001US6300651 Chip layout for symmetrical-critical elements
10/09/2001US6300647 Characteristic-evaluating storage capacitors
10/09/2001US6300590 Laser processing
10/09/2001US6300577 Film carrier and method of burn-in testing
10/09/2001US6300576 Printed-circuit board having projection electrodes and method for producing the same
10/09/2001US6300256 Method and device for producing electrically conductive continuity in semiconductor components
10/09/2001US6300254 Methods of making compliant interfaces and microelectronic packages using same
10/09/2001US6300252 Method for etching fuse windows in IC devices and devices made
10/09/2001US6300244 Semiconductor device and method of manufacturing the same
10/09/2001US6300237 Semiconductor integrated circuit device and method for making the same
10/09/2001US6300236 Copper stud structure with refractory metal liner
10/09/2001US6300234 Process for forming an electrical device
10/09/2001US6300233 Method of making a fuse in a semiconductor device
10/09/2001US6300232 Semiconductor device having protective films surrounding a fuse and method of manufacturing thereof
10/09/2001US6300231 Method for creating a die shrink insensitive semiconductor package and component therefor
10/09/2001US6300204 Semiconductor processing methods of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to a node location, and an electrical interconnection with a transistor source/drain region
10/09/2001US6300170 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry
10/09/2001US6300168 Method of manufacturing a semiconductor device
10/09/2001US6300167 Semiconductor device with flame sprayed heat spreading layer and method
10/09/2001US6300166 Method for packaging a BGA and the structure of a substrate for use with the method
10/09/2001US6300165 Ball grid substrate for lead-on-chip semiconductor package
10/09/2001US6300164 Structure, materials, and methods for socketable ball grid
10/09/2001US6300163 Stacked leads-over-chip multi-chip module
10/09/2001US6300161 Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noise
10/09/2001US6300148 Semiconductor structure with a backside protective layer and backside probes and a method for constructing the structure
10/09/2001US6300146 Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET
10/09/2001US6299932 Lead frame processing method and apparatus
10/09/2001US6299749 Method of fabricating an electrical component
10/09/2001US6299463 Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
10/09/2001US6299460 Spring-loaded backing plate assembly for use with land grid array-type devices
10/09/2001US6299456 Interposer with contact structures for electrical testing
10/09/2001US6299057 Apparatus and method of clamping semiconductor devices using sliding finger supports
10/09/2001US6299053 Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
10/09/2001US6299051 Bonding method of electronic parts employing ultrasonic coupling oscillation
10/09/2001US6298669 Pipe cooler and small-sized temperature controlling apparatus using the same
10/09/2001US6298551 Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
10/09/2001CA2223199C Gate-coupled structure for enhanced esd input/output pad protection in cmos ics
10/05/2001CA2343504A1 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
10/04/2001WO2001073957A2 Battery-operated wireless-communication apparatus and method
10/04/2001WO2001073883A2 Low-temperature fabrication of thin-film energy-storage devices
10/04/2001WO2001073870A2 Integrated capacitor-like battery and associated method
10/04/2001WO2001073868A2 Device enclosures and devices with integrated battery
10/04/2001WO2001073866A2 Method and apparatus for integrated-battery devices
10/04/2001WO2001073865A2 Continuous processing of thin-film batteries and like devices
10/04/2001WO2001073864A2 Thin-film battery having ultra-thin electrolyte and associated method
10/04/2001WO2001073845A1 Integrated circuit with programmable memory element
10/04/2001WO2001073842A1 Housing for an electronic component
10/04/2001WO2001073841A2 Method of preventing bridging between polycrystalline micro-scale features
10/04/2001WO2001072898A1 Thermally degradable epoxy underfills for flip-chip applications
10/04/2001WO2001020669A3 Use of additional bonding finger rows to improve wire bond density
10/04/2001WO2001020668A3 AN INTEGRATED RF MxN SWITCH MATRIX
10/04/2001WO2000077135A3 Liquid carbon dioxide cleaning utilizing natural and modified natural solvents
10/04/2001US20010027011 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
10/04/2001US20010027010 Method to reduce the damages of copper lines
10/04/2001US20010027007 Semiconductor device having bump electrodes and method of manufacturing the same
10/04/2001US20010027006 Semiconductor device and method for fabricating the same
10/04/2001US20010026975 Method of manufacturing semiconductor device
10/04/2001US20010026970 Method and circuit for minimizing the charging effect during manufacture of semiconductor devices
10/04/2001US20010026959 Method for making an encapsulated semiconductor chip module
10/04/2001US20010026958 Semiconductor device and method for manufacturing same
10/04/2001US20010026957 Thermal enhancement approach using solder compositions in the liquid state
10/04/2001US20010026955 Flip chip thermally enhanced ball grid array
10/04/2001US20010026954 Semiconductor device and manufacturing method thereof
10/04/2001US20010026952 Forming conductive copper-containing material over substrate and barrier layer comprising methylated silicon nitride
10/04/2001US20010026906 Process for manufacturing semiconductor device and exposure mask
10/04/2001US20010026864 Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts
10/04/2001US20010026863 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization
10/04/2001US20010026840 Aluminum ion vapor deposition chamber in argon gas voltage
10/04/2001US20010026494 Method of anti-fuse repair
10/04/2001US20010026442 Conductor track layer structure and prestage thereof
10/04/2001US20010026441 Printed wiring board having heat radiating means and method of manufacturing the same
10/04/2001US20010026439 Structure and method for an electronic assembly
10/04/2001US20010026435 Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same
10/04/2001US20010026393 Optical scanning device, image forming apparatus, and optical scanning method
10/04/2001US20010026364 Test structure for metal CMP process control
10/04/2001US20010026185 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice
10/04/2001US20010026022 Method and apparatus for implementing selected functionality on an integrated circuit device
10/04/2001US20010026021 Flip-chip type semiconductor device and method of manufacturing the same
10/04/2001US20010026020 Shielding device and electrical structural part having a shielding device
10/04/2001US20010026019 Interconnect structure and method for forming the same
10/04/2001US20010026018 Pad metallization over active circuitry
10/04/2001US20010026016 Electronic component of a high frequency current suppression type and bonding wire for the same
10/04/2001US20010026014 Semiconductor device
10/04/2001US20010026013 Apparatus and methods of packaging and testing die
10/04/2001US20010026011 Radiation emitter devices and method of making the same
10/04/2001US20010026010 Semiconductor device and process of production of same
10/04/2001US20010026009 Semiconductor devicse, a semicinductor module loaded with said semiconductor device and a method of manufacturing said semicoductor device
10/04/2001US20010026008 Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device
10/04/2001US20010026007 Semiconductor device with light shielding metal film
10/04/2001US20010026005 Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device
10/04/2001US20010025999 Semiconductor device and method of manufacturing the same
10/04/2001US20010025993 Semiconductor device
10/04/2001US20010025990 Semiconductor device and method of manufacturing the same
10/04/2001US20010025976 Method for manufacturing a capacitor of a semiconductor device
10/04/2001US20010025975 Semiconductor device and the method for manufacturing the same
10/04/2001US20010025973 Semiconductor integrated circuit device and process for manufacturing the same
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