| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 10/11/2001 | US20010028070 Compound semiconductor device and method for controlling characteristics of the same |
| 10/11/2001 | US20010028056 Evaluation method of semiconductor chargeup damage and apparatus therefor |
| 10/11/2001 | US20010028053 Wavelength-converting casting composition and light-emitting semiconductor component |
| 10/11/2001 | US20010027989 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 10/11/2001 | US20010027876 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
| 10/11/2001 | US20010027875 Multi-layer printed circuit board and fabrication method thereof and a BGA semiconductor package using the multi-layer printed circuit board |
| 10/11/2001 | US20010027874 Wiring substrate, method of manufacturing the same and semiconductor device |
| 10/11/2001 | US20010027855 Heatsink with integrated blower for improved heat transfer |
| 10/11/2001 | US20010027842 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
| 10/11/2001 | US20010027841 Method and apparatus for application of adhesive tape to semiconductor devices |
| 10/11/2001 | US20010027633 Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product |
| 10/11/2001 | US20010027606 Semiconductor integrated circuit manufacturing method and bonding machine used for it |
| 10/11/2001 | DE10062238A1 Semiconductor device manufacture by selectively forming insulating layer and conducting layers to form vertical connection |
| 10/11/2001 | DE10018043A1 Verfahren zur Kontaktierung eines Hochleistungsdiodenlaserbarrens und eine Hochleistungsdiodenlaserbarren-Kontakt-Anordnung von elektrischen Kontakten thermisch untergeordneter Funktion Method for contacting a high-performance diode laser bar and a high-power diode laser bars contacting arrangement of electrical contacts with minor thermal function |
| 10/11/2001 | DE10016380A1 Gehäuse für ein elektrisches Bauteil Housing for an electrical component |
| 10/11/2001 | DE10016306A1 Inverter type power converter has housing with press plate made of composite material with metal inserts and plastics coating |
| 10/11/2001 | DE10015484A1 Chip or chips in composite wafer with integrated functional logic circuit and self-test circuit has transponder circuitry for contactless testing |
| 10/11/2001 | DE10014379A1 Verfahren und Vorrichtung zum Verbinden mindestens eines Chips mit einer Umverdrahtungsanordnung Method and device for connecting at least one chip having a rewiring |
| 10/11/2001 | DE10012990A1 Cooling device for electronic components has latent heat store for heat from electronic component that can no longer be absorbed by passive cooling element |
| 10/11/2001 | CA2405051A1 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 10/11/2001 | CA2404032A1 Housing assembly for an electronic device |
| 10/10/2001 | EP1143780A1 Electronic component comprising a metallic case provided with a magnetic loss material |
| 10/10/2001 | EP1143779A1 Heat sink, and semiconductor laser and semiconductor laser stacker using the same |
| 10/10/2001 | EP1143778A1 Pumped liquid cooling system using a phase change refrigerant |
| 10/10/2001 | EP1143777A1 Cooling device capable of considerably suppressing a high-frequency current flowing in an electric component |
| 10/10/2001 | EP1143583A2 High power diode laser bar contact system and contacting method for high power diode laser bars |
| 10/10/2001 | EP1143539A2 Desiccation of moisture-sensitive electronic devices |
| 10/10/2001 | EP1143528A2 Interconnect-embedded metal-insulator-metal capacitor and method of fabricating same. |
| 10/10/2001 | EP1143519A2 Apparatus and method for assembling optical devices |
| 10/10/2001 | EP1143518A1 Resin-molded unit including an electronic circuit component covered by a protective magnetic film |
| 10/10/2001 | EP1143517A2 Integrated vertical spiral inductor on semiconductor chip material |
| 10/10/2001 | EP1143516A2 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| 10/10/2001 | EP1143515A2 Wiring substrate, method of manufacturing the same and semiconductor device |
| 10/10/2001 | EP1143514A2 Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon |
| 10/10/2001 | EP1143513A1 Semiconductor device and method of fabricating the same |
| 10/10/2001 | EP1143512A2 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| 10/10/2001 | EP1143511A2 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| 10/10/2001 | EP1143510A2 Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same |
| 10/10/2001 | EP1143509A2 Method of manufacturing the circuit device and circuit device |
| 10/10/2001 | EP1143508A2 Apparatus for packaging electronic components |
| 10/10/2001 | EP1143507A1 Integrated circuit |
| 10/10/2001 | EP1143504A1 Electronic device and method of manufacture thereof |
| 10/10/2001 | EP1143465A2 Chip capacitor, a fabrication method for the same, and a metal mold |
| 10/10/2001 | EP1143278A2 Integrated optoelectronic coupling and connector |
| 10/10/2001 | EP1142952A1 Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| 10/10/2001 | EP1142923A1 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 10/10/2001 | EP1142921A1 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 10/10/2001 | EP1142849A1 Silicon nitride composite substrate |
| 10/10/2001 | EP1142832A1 Ionic additives for extreme low dielectric constant chemical formulations |
| 10/10/2001 | EP1142119A1 On-chip decoupling capacitor system with parallel fuse |
| 10/10/2001 | EP1142019A1 Circuit assembly with at least one nanoelectronic component and method for producing the same |
| 10/10/2001 | EP1142017A1 Method for producing a semiconductor component with wiring partly extending in the substrate and semiconductor component produced according to said method |
| 10/10/2001 | EP1142015A1 Heat sink including heat receiving surface with protruding portion |
| 10/10/2001 | EP1141735A2 Test method and assembly including a test die for testing a semiconductor product die |
| 10/10/2001 | EP1141073A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 10/10/2001 | EP0775369B1 Miniature semiconductor device for surface mounting |
| 10/10/2001 | EP0766870B1 Method of manufacturing a progammable semiconductor device in the form of an anti-fuse |
| 10/10/2001 | CN2453550Y Quick action type CPU cooler |
| 10/10/2001 | CN1317225A Laminates for encapsulating devices |
| 10/10/2001 | CN1317163A Non-circular micro-via |
| 10/10/2001 | CN1316876A Holding for semiconductor component on cooler |
| 10/10/2001 | CN1316872A Panel and its making method and installation method for electronic circuit component |
| 10/10/2001 | CN1316871A Flexible wiring board and making method thereof and display device with flexible wiring board |
| 10/10/2001 | CN1316780A Photoelectronic device and making method thereof |
| 10/10/2001 | CN1316778A Resine moulded unit including electronic circuit component |
| 10/10/2001 | CN1316777A Electromagnetic noise eliminator, semiconductor device using the eliminator and making method thereof |
| 10/10/2001 | CN1316776A Heat sinking unit |
| 10/10/2001 | CN1316775A Radiator capable of notable controlling high frequency current passing through electronic element |
| 10/10/2001 | CN1316683A Computer card and its making method |
| 10/10/2001 | CN1316657A Equipment and method for assembling optical device |
| 10/10/2001 | CN1316639A Heat sink |
| 10/10/2001 | CN1316463A Phasphorus-containing epoxy resin composition, flame-retarded sheet resin composite metal forming, semi-solidified sheet, veneer shect, multiply sheet using the phasphorus-containing epoxy resin |
| 10/10/2001 | CN1316447A Epoxy resin composition for semi-conductor packaging and semi-conductor device using the composition |
| 10/10/2001 | CN1316373A Electric component containing metal box with magnetic loss material |
| 10/10/2001 | CN1072841C Leadframe |
| 10/10/2001 | CN1072840C Method for mounting semiconductor device on substrate |
| 10/09/2001 | US6301690 Method to improve integrated circuit defect limited yield |
| 10/09/2001 | US6301122 Radio frequency module with thermally and electrically coupled metal film on insulating substrate |
| 10/09/2001 | US6301121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process |
| 10/09/2001 | US6301115 Heat sink devices for use in electronic devices |
| 10/09/2001 | US6301114 Multilayered electronic part and electronic circuit module including therein the multilayered electronic part |
| 10/09/2001 | US6301113 Retainer clip for heat sink for electronic components |
| 10/09/2001 | US6301112 Clip mounting a heat sink to an electronic element |
| 10/09/2001 | US6301111 Heat sink and information processor using it |
| 10/09/2001 | US6301110 Electronic component cooling apparatus |
| 10/09/2001 | US6301109 Isothermal heat sink with cross-flow openings between channels |
| 10/09/2001 | US6301097 Inflatable sealing system for low temperature electronic module |
| 10/09/2001 | US6300842 Arrangement for producing electrical oscillations |
| 10/09/2001 | US6300780 High density integrated circuit apparatus, test probe and methods of use thereof |
| 10/09/2001 | US6300688 Bond pad having vias usable with antifuse process technology |
| 10/09/2001 | US6300687 Micro-flex technology in semiconductor packages |
| 10/09/2001 | US6300686 Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection |
| 10/09/2001 | US6300685 Semiconductor package |
| 10/09/2001 | US6300683 Semiconductor device having high density interconnections and method for manufacturing the same |
| 10/09/2001 | US6300680 Semiconductor substrate and manufacturing method thereof |
| 10/09/2001 | US6300679 Flexible substrate for packaging a semiconductor component |
| 10/09/2001 | US6300678 I/O pin having solder dam for connecting substrates |
| 10/09/2001 | US6300677 Electronic assembly having improved power supply bus voltage integrity |
| 10/09/2001 | US6300675 Low-cost tape carrier package and liquid crystal module using the same |
| 10/09/2001 | US6300674 Flat package for semiconductor diodes |