| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/16/2001 | US6303950 Field effect transistor including stabilizing circuit |
| 10/16/2001 | US6303948 Pad layout and lead layout in semiconductor device |
| 10/16/2001 | US6303940 Charge injection transistor using high-k dielectric barrier layer |
| 10/16/2001 | US6303899 Method and apparatus for scribing a code in an inactive outer clear out area of a semiconductor wafer |
| 10/16/2001 | US6303879 Laminated ceramic with multilayer electrodes and method of fabrication |
| 10/16/2001 | US6303878 Mounting structure of electronic component on substrate board |
| 10/16/2001 | US6303877 Multilayer thin-film wiring board |
| 10/16/2001 | US6303876 LSI package structure |
| 10/16/2001 | US6303875 IC packages replaceable by IC packages having a smaller pin count and circuit device using the same |
| 10/16/2001 | US6303871 Degassing hole design for olga trace impedance |
| 10/16/2001 | US6303860 Bladder insert for encapsulant displacement |
| 10/16/2001 | US6303733 From bisphenol compounds and difluoro diarylacetylenes and/or ethynylated benzophenones; dielectrics employed with a variety of microelectronic devices, for example, integrated circuits and multichip modules. |
| 10/16/2001 | US6303509 Method to calibrate the wafer transfer for oxide etcher (with clamp) |
| 10/16/2001 | US6303505 Copper interconnect with improved electromigration resistance |
| 10/16/2001 | US6303496 Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit |
| 10/16/2001 | US6303495 Method of forming thin copper film and semiconductor device with thin copper film |
| 10/16/2001 | US6303493 Wiring for semiconductor device and method for forming the same |
| 10/16/2001 | US6303487 Method for forming an air gap in an insulating film between adjacent interconnection conductors in a semiconductor device |
| 10/16/2001 | US6303486 Forming dielectric layer, opening in dielectric layer; forming copper structure; forming sacrificial dielectric layer; forming second dielectric layer, opening, copper strucure and removing; forming copper interconnect by annealing |
| 10/16/2001 | US6303478 Semiconductor integrated circuit device and method for fabricating the same |
| 10/16/2001 | US6303471 Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device |
| 10/16/2001 | US6303470 Semiconductor wafer and method for manufacturing semiconductor devices |
| 10/16/2001 | US6303469 Thin microelectronic substrates and methods of manufacture |
| 10/16/2001 | US6303460 Semiconductor device and method for manufacturing the same |
| 10/16/2001 | US6303459 Integration process for Al pad |
| 10/16/2001 | US6303458 Alignment mark scheme for Sti process to save one mask step |
| 10/16/2001 | US6303457 Integrated circuit having integral decoupling capacitor |
| 10/16/2001 | US6303423 Method for forming high performance system-on-chip using post passivation process |
| 10/16/2001 | US6303422 Semiconductor memory and manufacturing method thereof |
| 10/16/2001 | US6303408 Microelectronic assemblies with composite conductive elements |
| 10/16/2001 | US6303219 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 10/16/2001 | US6303192 Process to improve adhesion of PECVD cap layers in integrated circuits |
| 10/16/2001 | US6303047 Low dielectric constant multiple carbon-containing silicon oxide dielectric material for use in integrated circuit structures, and method of making same |
| 10/16/2001 | US6302991 Method of producing a lead frame with composite film attached, and use of the lead frame |
| 10/16/2001 | US6302729 Integrated circuit with electrical connection points that can be severed by the action of energy |
| 10/16/2001 | US6302702 Connecting devices and method for interconnecting circuit components |
| 10/16/2001 | US6302192 Integrated circuit heat pipe heat spreader with through mounting holes |
| 10/16/2001 | US6301903 Apparatus for activating fusible links on a circuit substrate |
| 10/16/2001 | US6301779 Method for fabricating a heat sink having nested extended surfaces |
| 10/16/2001 | CA2229596C Hermetically sealed electrical feedthrough for use with implantable electronic devices |
| 10/16/2001 | CA2080831C Crosslinkable fluorinated aromatic ether compositions |
| 10/16/2001 | CA2080690C Batch assembly of high density hermetic packages for power semiconductor chips |
| 10/11/2001 | WO2001076336A1 Method for fabricating electrical connecting elements, and connecting element |
| 10/11/2001 | WO2001076335A1 Mounting structure of electronic device and method of mounting electronic device |
| 10/11/2001 | WO2001076332A1 Circuit board, method of manufacture thereof, integrated circuit and method of manufacture thereof |
| 10/11/2001 | WO2001076331A1 Element for an electronic assembly |
| 10/11/2001 | WO2001076330A1 Electrical connecting element and method of fabricating the same |
| 10/11/2001 | WO2001075983A2 Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron cmos |
| 10/11/2001 | WO2001075973A2 Combined transistor-capacitor structure in deep sub-micron cmos for power amplifiers |
| 10/11/2001 | WO2001075970A2 Element and method for connecting constituents of an electronic assembly |
| 10/11/2001 | WO2001075969A1 Electronic component with flexible contact points and method for the production thereof |
| 10/11/2001 | WO2001075964A1 Semiconductor element comprising a chip and arrangement with a chip |
| 10/11/2001 | WO2001075963A1 Method for producing a heat-conducting connection between two work pieces |
| 10/11/2001 | WO2001075962A1 Housing assembly for an electronic component |
| 10/11/2001 | WO2001075961A1 Chip scale surface mounted device and process of manufacture |
| 10/11/2001 | WO2001075938A2 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 10/11/2001 | WO2001075458A1 Multiple layer electrical interface |
| 10/11/2001 | WO2001075385A1 Oil cooled multistage depressed collector high power amplifier |
| 10/11/2001 | US20010029228 Ceramics having excellent high-frequency characteristics and method of producing the same |
| 10/11/2001 | US20010029105 Semiconductor device and method for manufacturing the same |
| 10/11/2001 | US20010029100 Microelectronic Contacts |
| 10/11/2001 | US20010029098 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device |
| 10/11/2001 | US20010029084 Thermal conductivity enhanced semiconductor structures and fabrication processes |
| 10/11/2001 | US20010029081 Method for producing semiconductor device |
| 10/11/2001 | US20010029079 Semiconductor device with multiple emitter contact plugs |
| 10/11/2001 | US20010029074 Semiconductor device and process of producing the same |
| 10/11/2001 | US20010029065 Dimensionally stable core for use in high density chip packages and a method of fabricating same |
| 10/11/2001 | US20010029063 Semiconductor device and manufacturing method thereof |
| 10/11/2001 | US20010029062 Semiconductor device, method of making the same, circuit board, and film carrier tape |
| 10/11/2001 | US20010028951 Method for attenuating thermal sensation when handling objects at non-body temperature |
| 10/11/2001 | US20010028927 Heat transfer material for an improved die edge contacting socket |
| 10/11/2001 | US20010028553 Removable heat sink bumpers on a quad flat package |
| 10/11/2001 | US20010028552 Securing heat sinks to electronic components |
| 10/11/2001 | US20010028544 Chip capacitor, a fabrication method for the same, and a metal mold |
| 10/11/2001 | US20010028417 Liquid crystal display device and defect repairing method therefor |
| 10/11/2001 | US20010028415 Semiconductor device, electro-optical device substrate, liquid crystal device substrate and manufacturing method therefor, liquid crystal device, and projection liquid crystal display device and electronic apparatus using the liquid crystal device |
| 10/11/2001 | US20010028117 Thiol or sulfur portion of an alkyl mercaptan or a disulfide derivative bonds with a noble metal, alkyl portion is oriented away from the surface |
| 10/11/2001 | US20010028116 Apparatus and methods of reinforcement of lead bonding in microelectronics packages |
| 10/11/2001 | US20010028115 semiconductor device and method of manufacturing the same |
| 10/11/2001 | US20010028114 Semiconductor device including memory unit and semiconductor module including memory units |
| 10/11/2001 | US20010028113 Method of manufacturing semiconductor device |
| 10/11/2001 | US20010028110 Semiconductor device and method for manufacturing the same |
| 10/11/2001 | US20010028109 Solder alloy, a circuit substrate, a semiconductor device and a method of manufacturing the same |
| 10/11/2001 | US20010028108 Semiconductor device having external connecting terminals and process for manufacturing the device |
| 10/11/2001 | US20010028107 Semiconductor device and a method of manufacturing the same |
| 10/11/2001 | US20010028106 Cooling apparatus for cooling electric element |
| 10/11/2001 | US20010028105 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 10/11/2001 | US20010028103 Semiconductor device and method of manufacturing the same |
| 10/11/2001 | US20010028102 Electronic component having microscopically small contact areas and method for fabricating it |
| 10/11/2001 | US20010028101 Method of fabricating semiconductor having through hole |
| 10/11/2001 | US20010028100 Passivation layer and process for semiconductor devices |
| 10/11/2001 | US20010028099 Semiconductor device and manufacturing method therefor |
| 10/11/2001 | US20010028098 Method and structure of manufacturing a high-q inductor with an air trench |
| 10/11/2001 | US20010028095 Semiconductor processing methods, semiconductor circuitry, and gate stacks |
| 10/11/2001 | US20010028094 Semiconductor chip with surface cover |
| 10/11/2001 | US20010028082 Semiconductor integrated circuit device and method of manufacturing the same |
| 10/11/2001 | US20010028081 Semiconductor memory device |
| 10/11/2001 | US20010028079 Semiconductor device and method of manufacturing the same |
| 10/11/2001 | US20010028076 Fuse configuration for a semiconductor apparatus |
| 10/11/2001 | US20010028074 Having first and second tetraethyl orthosilicate-ozone films formed on protection film through chemical vapor deposition; second film has higher ozone concentration and lower water content as compared to first film |