H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2001
10/18/2001	US20010030057 Electronic component package, printing circuit board, and method of inspecting the printed circuit board
10/18/2001	US20010030039 Aluminum-copper clad member, method of manufacturing the same, and heat sink
10/18/2001	US20010030037 Spring clip for fixing semiconductor modules to a heat sink
10/18/2001	US20010030013 Method and structure to reduce low force pin pull failures in ceramic substrates
10/18/2001	US20010029755 Method of forming an alignment marker for optical devices
10/18/2001	US20010029667 Method of forming interconnection wire
10/18/2001	US20010029666 Printed-circuit board having projection electrodes and method for producing the same
10/18/2001	DE10117872A1 Multilayer monolithic ceramic substrate has thick boundary green layer in contact with thick base green layer
10/18/2001	DE10053832A1 Production of a silicon carbide preform mixing silicon carbide particles with an organic binder, an inorganic binder, a clustering agent and distilled water, pouring into a mold, drying and calcining
10/18/2001	DE10038120A1 System support used for packing semiconductor chips in electronic components has a number of component assembly regions lying over each other with component assembly region limits on the support
10/18/2001	DE10018938A1 Speichermedien für Latentwärmespeicher Storage media for latent heat storage
10/18/2001	DE10017746A1 Elektronisches Bauteil mit mikroskopisch kleinen Kontaktflächen und Verfahren zu seiner Herstellung Electronic component with microscopically small contact surfaces and process for its preparation
10/18/2001	DE10016867A1 Bauelement mit Beschriftung Component with lettering
10/18/2001	DE10016135A1 Gehäusebaugruppe für ein elektronisches Bauteil A housing assembly for an electronic component
10/18/2001	DE10016132A1 Electronic component for electronic devices comprises electronic switch and conducting paths on surface of the component to electrically connect the switch with metal-coated protrusions made from rubber-elastic insulating material
10/18/2001	DE10016129A1 Verfahren zum Herstellen einer wärmeleitenden Verbindung zwischen zwei Werkstücken A method for producing a thermally conductive connection between the two workpieces
10/18/2001	DE10015962A1 High temp. resistant solder connection enabling mechanically stable, elastically deformable connection of semiconducting body to cooling body
10/18/2001	DE10014382A1 Leiterbahn-Schichtstruktur und Vorstufe zu dieser Wiring layer structure, and the precursor to this
10/18/2001	CA2443551A1 Distributed capacitor
10/17/2001	EP1146637A1 Electronic component of a high frequency current suppression type and bonding wire for the same
10/17/2001	EP1146591A2 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
10/17/2001	EP1146573A1 Semiconductor device and method of manufacture thereof
10/17/2001	EP1146568A2 Electrically-conductive grid shield for semiconductors
10/17/2001	EP1146567A1 Diode and process for manufacturing it
10/17/2001	EP1146558A2 Damascene wiring structure and semiconductor device with damascene wirings
10/17/2001	EP1146552A2 Interconnections to copper ICs
10/17/2001	EP1146550A2 Method for making interconnections in an integrated circuit
10/17/2001	EP1146142A2 Process for forming fluorosilicate glass layers using high density plasma, for copper damascene integrated circuits
10/17/2001	EP1146140A1 Process for deposition of oxides and nitrides with compositional gradients
10/17/2001	EP1146014A2 Mesoporous silica films with mobile ion gettering and accelerated processing
10/17/2001	EP1145612A2 Method for mounting an electronic component
10/17/2001	EP1145430A2 Fully integrated tuner architecture
10/17/2001	EP1145393A1 Method and apparatus for hermetically sealing photonic devices
10/17/2001	EP1145339A1 Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects
10/17/2001	EP1145318A2 System and method for esd protection
10/17/2001	EP1145317A1 Coaxial type signal line and manufacturing method thereof
10/17/2001	EP1145316A2 Power semiconductor module
10/17/2001	EP1145315A1 Vertically integrated semiconductor system
10/17/2001	EP1145314A1 High frequency power transistor device
10/17/2001	EP1145313A1 Methods for forming co-axial interconnect lines in a cmos process
10/17/2001	EP1145312A1 Methods for forming co-axial interconnect lines in a cmos process
10/17/2001	EP1145311A1 Microelectronic structure
10/17/2001	EP1145310A1 Semiconductor device and method of manufacturing the same
10/17/2001	EP1145309A2 Use of additional bonding finger rows to improve wire bond density
10/17/2001	EP1145303A1 Method and device for optically monitoring processes for manufacturing microstructured surfaces in the production of semiconductors
10/17/2001	EP1145302A1 Semiconductor device with bond pad and test pad
10/17/2001	EP1145123A2 Calibrating functions of an integrated circuit and storing calibration parameters thereof in a programmable fuse array
10/17/2001	EP1144933A1 A device for temperature control
10/17/2001	EP1144565A2 Liquid carbon dioxide cleaning utilizing natural solvents
10/17/2001	EP1144523A2 Preparations containing fine-particulate inorganic oxides
10/17/2001	EP0902973B1 Substrate for a semiconductor chip
10/17/2001	EP0852065B1 Interconnect scheme for integrated circuits
10/17/2001	EP0682812B1 Thermally conductive integrated circuit package with radio frequency shielding
10/17/2001	EP0644803B1 Encapsulated semiconductor device
10/17/2001	CN2455045Y Spot-type buckle for radiator
10/17/2001	CN2455044Y Radiating device combination
10/17/2001	CN1318005A Solder ball placement appts.
10/17/2001	CN1317829A High frequency current inhibiting type electronic component and its conjunction wire
10/17/2001	CN1317828A Lead frame and copper alloy for lead frame
10/17/2001	CN1317827A Semiconductor and liquid crystal module of utilizing semiconductor
10/17/2001	CN1317826A Plastic netted array structure and its preparing process
10/17/2001	CN1317825A Electroplating appts.
10/17/2001	CN1317389A Wire welding tech. for copper metallized integrated circuit
10/17/2001	CN1073286C Pressure contactor shell for semiconductor device
10/17/2001	CN1073284C 半导体器件 Semiconductor devices
10/17/2001	CN1073283C Lead-on-chip lead frame
10/17/2001	CN1073282C Lead frame assembly for semiconductor device
10/17/2001	CN1073281C Semiconductor device and its making method
10/17/2001	CN1073157C 转录因子aprf Transcription factor aprf
10/17/2001	CA2344120A1 Storage media for latent heat storage systems
10/16/2001	USRE37413 Semiconductor package for a semiconductor chip having centrally located bottom bond pads
10/16/2001	US6305002 Semiconductor integrated circuit having thereon on-chip capacitors
10/16/2001	US6305000 Placement of conductive stripes in electronic circuits to satisfy metal density requirements
10/16/2001	US6304453 Heat sink assembly
10/16/2001	US6304452 Clip for securing heat sink to electronic device package
10/16/2001	US6304451 Reverse mount heat sink assembly
10/16/2001	US6304449 Heat sink mounting for power semiconductors
10/16/2001	US6304448 Power module
10/16/2001	US6304446 Heat dissipater
10/16/2001	US6304445 Fan heat sink and method
10/16/2001	US6304442 Actively cooled daughterboard system
10/16/2001	US6304441 Radiation apparatus and radiation method for integrated circuit semiconductor device and for portable computer
10/16/2001	US6304001 Semiconductor device with alignment mark and manufacturing method thereof
10/16/2001	US6303999 Interconnect structure with a passivation layer and chip pad
10/16/2001	US6303998 Semiconductor device having a chip mounted on a rectangular substrate
10/16/2001	US6303997 Thin, stackable semiconductor packages
10/16/2001	US6303992 Interposer for mounting semiconductor dice on substrates
10/16/2001	US6303990 Conductor path contacting arrangement and method
10/16/2001	US6303987 Compression bonded type semiconductor device
10/16/2001	US6303986 Method of and apparatus for sealing an hermetic lid to a semiconductor die
10/16/2001	US6303985 Semiconductor lead frame and package with stiffened mounting paddle
10/16/2001	US6303984 Lead frame including angle iron tie bar
10/16/2001	US6303983 Apparatus for manufacturing resin-encapsulated semiconductor devices
10/16/2001	US6303982 Semiconductor device
10/16/2001	US6303981 Semiconductor package having stacked dice and leadframes and method of fabrication
10/16/2001	US6303980 Fusible link in an integrated semiconductor circuit and a memory cell of a semiconductor component
10/16/2001	US6303978 Packaging material includes an optically transparent cycloaliphatic polymer
10/16/2001	US6303977 Fully hermetic semiconductor chip, including sealed edge sides
10/16/2001	US6303974 Semiconductor chips encapsulated within a preformed sub-assembly
10/16/2001	US6303970 Semiconductor device with a plurality of fuses

1 ... 1825 1826 1827 1828 1829 1830 1831 1832 1833 1834 1835 1836 1837 1838 1839 1840 1841 1842 1843 1844 1845 ... 2262