| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/23/2001 | US6307213 Method for making a fuse structure for improved repaired yields on semiconductor memory devices |
| 10/23/2001 | US6307162 Integrated circuit wiring |
| 10/23/2001 | US6307161 Partially-overcoated elongate contact structures |
| 10/23/2001 | US6307160 High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method |
| 10/23/2001 | US6307159 Bump structure and method for making the same |
| 10/23/2001 | US6306792 Mixing with water, subjecting to pressure cooking, measuring electroconductivity of extraction mixture |
| 10/23/2001 | US6306765 Method for the formation of thin films for use as a semiconductor device |
| 10/23/2001 | US6306762 Forming aluminum alloy, forming metal layer in direct contact with aluminum alloy, forming metal nitride; conductively coupled so conduction continues even if alloy layer becomes non-conducting |
| 10/23/2001 | US6306757 Method for forming a multilevel interconnect |
| 10/23/2001 | US6306755 Method for endpoint detection during dry etch of submicron features in a semiconductor device |
| 10/23/2001 | US6306754 Method for forming wiring with extremely low parasitic capacitance |
| 10/23/2001 | US6306753 Feasible, gas-dielectric interconnect process |
| 10/23/2001 | US6306752 Connection component and method of making same |
| 10/23/2001 | US6306751 Apparatus and method for improving ball joints in semiconductor packages |
| 10/23/2001 | US6306750 Bonding pad structure to prevent inter-metal dielectric cracking and to improve bondability |
| 10/23/2001 | US6306749 Bond pad with pad edge strengthening structure |
| 10/23/2001 | US6306746 Backend process for fuse link opening |
| 10/23/2001 | US6306745 Chip-area-efficient pattern and method of hierarchal power routing |
| 10/23/2001 | US6306744 Filter capacitor construction |
| 10/23/2001 | US6306731 Semiconductor device and method for fabricating the same |
| 10/23/2001 | US6306728 Stable high voltage semiconductor device structure |
| 10/23/2001 | US6306714 Method to form an elevated S/D CMOS device by contacting S/D through the contact of oxide |
| 10/23/2001 | US6306688 Method of reworkably removing a fluorinated polymer encapsulant |
| 10/23/2001 | US6306687 Tape under frame for conventional-type IC package assembly |
| 10/23/2001 | US6306686 Method of fabricating an electronic package with interconnected chips |
| 10/23/2001 | US6306685 Method of molding a bump chip carrier and structure made thereby |
| 10/23/2001 | US6306684 Stress reducing lead-frame for plastic encapsulation |
| 10/23/2001 | US6306682 Method of fabricating a ball grid array integrated circuit package having an encapsulating body |
| 10/23/2001 | US6306680 Power overlay chip scale packages for discrete power devices |
| 10/23/2001 | US6306528 Method for the controlling of certain second phases in aluminum nitride |
| 10/23/2001 | US6306526 Lid suitable for use in hermetic sealing of semiconductor package, comprising metal plate having solder layer secured thereto by cladding prior to formation of hermetic seal |
| 10/23/2001 | US6306511 Substrate comprising compact of first powder comprising partially sintered glass, functional layer comprising compact of second powder comprising ceramic material having specified electrical property, diffusion bonded by substrate material |
| 10/23/2001 | US6306495 Film for use in microelectronic devices and methods of producing same |
| 10/23/2001 | US6305464 Method for producing a cooling element, and a cooling element |
| 10/23/2001 | US6305095 Methods and circuits for mask-alignment detection |
| 10/23/2001 | CA2067784C Method and device for hermetic encapsulation of electronic components |
| 10/18/2001 | WO2001078478A1 Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger |
| 10/18/2001 | WO2001078475A1 Method and device for fabricating electrical connecting elements, and connecting element |
| 10/18/2001 | WO2001078472A1 Flexible circuit with plated cover layer and overlapping protective layer |
| 10/18/2001 | WO2001078147A1 Lead frame design for reduced wire sweep |
| 10/18/2001 | WO2001078146A2 Bonding pad in semiconductor device |
| 10/18/2001 | WO2001078145A2 Boding pad in semiconductor device |
| 10/18/2001 | WO2001078144A1 Vertical structure and process for semiconductor wafer-level chip scale packages |
| 10/18/2001 | WO2001078143A1 Removable heat transfer apparatus for a pin grid array (pga) dev ice |
| 10/18/2001 | WO2001078141A2 USE OF AlN AS COPPER PASSIVATION LAYER AND THERMAL CONDUCTOR |
| 10/18/2001 | WO2001078140A2 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier |
| 10/18/2001 | WO2001078139A1 Common electrode wire for plating |
| 10/18/2001 | WO2001078138A1 Flip chip semiconductor device including a compliant support for supporting a heat sink |
| 10/18/2001 | WO2001078137A1 Semiconductor photodetector |
| 10/18/2001 | WO2001078120A1 Method of forming vias in silicon carbide and resulting devices and circuits |
| 10/18/2001 | WO2001078109A2 High rigidity, multi-layered, semiconductor package and method of making the same |
| 10/18/2001 | WO2001078093A2 Distributed capacitor |
| 10/18/2001 | WO2001078041A1 Component provided with a description |
| 10/18/2001 | WO2001077192A1 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured object obtained therefrom |
| 10/18/2001 | WO2001076855A1 Thermally conductive sheet |
| 10/18/2001 | WO2001015508A9 Integrated emi shield utilizing a hybrid edge |
| 10/18/2001 | US20010031925 Apparatus and method for collecting data useful for determining the parameters of an alert window for timing delivery or etc signals to a heart under varying cardiac conditons |
| 10/18/2001 | US20010031851 Thermosetting resin composition |
| 10/18/2001 | US20010031828 Film-type adhesive for electronic components, and electronic components bonded therewith |
| 10/18/2001 | US20010031690 Insulator ceramic is composed of an magnesium oxide-magnesium aluminate (MgO-MgAl2O4) ceramic powder, and a glass powder containing oxides of silicon, boron and with or without alumina, also contains oxides of 1a, 11a, zinc and copper |
| 10/18/2001 | US20010031563 Semiconductor device and method of fabricating the same |
| 10/18/2001 | US20010031555 Method for forming aluminum interconnection |
| 10/18/2001 | US20010031553 Leads under chip in conventional IC package |
| 10/18/2001 | US20010031549 Magnetic layer processing |
| 10/18/2001 | US20010031548 Method for forming chip scale package |
| 10/18/2001 | US20010031545 Bonding layer method in a semiconductor device |
| 10/18/2001 | US20010031516 Pedestal fuse |
| 10/18/2001 | US20010031514 Method and apparatus for fabricating self-assembling microstructures |
| 10/18/2001 | US20010031513 Semiconducator device and a method of manufacturing the same |
| 10/18/2001 | US20010031511 Stress-free silicon wafer and a die or chip made therefrom and method |
| 10/18/2001 | US20010031508 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects |
| 10/18/2001 | US20010031506 Etch bias distribution across semiconductor wafer |
| 10/18/2001 | US20010031345 Laminated radiation member, power semiconductor apparatus, and method for producing the same |
| 10/18/2001 | US20010030853 Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket |
| 10/18/2001 | US20010030852 Heat sink apparatus and method of attaching the heat sink apparatus to a device |
| 10/18/2001 | US20010030591 Integrated inductor |
| 10/18/2001 | US20010030552 Conductive material for integrated circuit fabrication |
| 10/18/2001 | US20010030493 Laminated ceramic electronic device |
| 10/18/2001 | US20010030371 High density flip chip memory arrays |
| 10/18/2001 | US20010030370 Microelectronic assembly having encapsulated wire bonding leads |
| 10/18/2001 | US20010030369 Methods and apparatus for forming a film on s substrate |
| 10/18/2001 | US20010030368 Semiconductor device and fabrication method |
| 10/18/2001 | US20010030367 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device |
| 10/18/2001 | US20010030366 Semiconducting system and production method |
| 10/18/2001 | US20010030365 Damascene wiring structure and semiconductor device with damascene wirings |
| 10/18/2001 | US20010030363 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 10/18/2001 | US20010030361 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module |
| 10/18/2001 | US20010030359 Housing for semiconductor chips |
| 10/18/2001 | US20010030358 Semiconductor device package |
| 10/18/2001 | US20010030357 Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus |
| 10/18/2001 | US20010030356 Transverse hybrid LOC package |
| 10/18/2001 | US20010030355 Saw-singulated leadless plastic chip carrier |
| 10/18/2001 | US20010030344 Semiconductor device and method for manufacturing the same |
| 10/18/2001 | US20010030334 Wiring for semiconductor device and method for forming the same |
| 10/18/2001 | US20010030330 High speed semiconductor photodetector and method of fabricating same |
| 10/18/2001 | US20010030185 Connection of a junction to an electrical conductor track on a plate |
| 10/18/2001 | US20010030062 Conductive composition |
| 10/18/2001 | US20010030061 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 10/18/2001 | US20010030060 Electronic component protection devices and methods |
| 10/18/2001 | US20010030059 Circuit component built-in module, radio device having the same, and method for producing the same |