| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/25/2001 | US20010033889 Manufacturing computer systems with fine line circuitized substrates |
| 10/25/2001 | US20010033509 Stacked integrated circuits |
| 10/25/2001 | US20010033477 Coolant cooled type semiconductor device |
| 10/25/2001 | US20010033476 Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device |
| 10/25/2001 | US20010033474 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 10/25/2001 | US20010033033 Alignment mark configuration |
| 10/25/2001 | US20010033031 Semiconductor device and production process thereof |
| 10/25/2001 | US20010033029 Methods for fabricating semiconductor devices having protected plug contacts and upper interconnections and semiconductor devices formed thereby |
| 10/25/2001 | US20010033028 Semiconductor devices and methods for manufacturing the same |
| 10/25/2001 | US20010033026 Low dielectric constant film material, film and semiconductor device using such material |
| 10/25/2001 | US20010033024 Method of creating shielded stuctures to protect semiconductor devices |
| 10/25/2001 | US20010033023 Semiconductor device and method of manufacturing the same |
| 10/25/2001 | US20010033022 Nickel-iron expansion contact for semiconductor die |
| 10/25/2001 | US20010033021 Semiconductor device and method for manufacturing the same |
| 10/25/2001 | US20010033020 Structure and method for bond pads of copper-metallized integrated circuits |
| 10/25/2001 | US20010033018 Semiconductor device, its manufacturing method and electrodeposition frame |
| 10/25/2001 | US20010033017 Chip package and method of making and testing the same |
| 10/25/2001 | US20010033016 Semiconductor device and method of manufacturing the same |
| 10/25/2001 | US20010033015 Ball array layout and method of making |
| 10/25/2001 | US20010033014 High frequency, low cost package for semiconductor devices |
| 10/25/2001 | US20010033013 Repairable multi-chip package |
| 10/25/2001 | US20010033012 Anti tamper encapsulation for an integrated circuit |
| 10/25/2001 | US20010033011 Semiconductor package having a die pad with downward-extended tabs |
| 10/25/2001 | US20010033008 Lead frame for fabricating surface mount type semiconductor devices with high reliability |
| 10/25/2001 | US20010032981 Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same |
| 10/25/2001 | US20010032978 Semiconductor device |
| 10/25/2001 | US20010032800 Method of manufacturing semiconductor device and tray used in the method |
| 10/25/2001 | US20010032740 Microwave package |
| 10/25/2001 | US20010032739 Lead-less semiconductor device with improved electrode pattern structure |
| 10/25/2001 | US20010032738 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 10/25/2001 | US20010032720 High performance heat exchange assembly |
| 10/25/2001 | US20010032719 Thermal joint and method of use |
| 10/25/2001 | US20010032715 Method of manufacturing combination heat-sink and heat-sink made thereby |
| 10/25/2001 | US20010032666 Integrated capacitor-like battery and associated method |
| 10/25/2001 | DE10103807A1 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture |
| 10/25/2001 | DE10019433A1 Manufacture of multi media cards has sequence of operations to mount components on circuit board layer followed by encapsulation |
| 10/25/2001 | DE10019431A1 Multimedia card production method involves forming conducting carrier or conducting bracket and card integrally by injection molding |
| 10/25/2001 | DE10018702A1 Cooling system for use with circuit board mounted CPUs has a ribbed heat sink and fan |
| 10/25/2001 | DE10017971A1 Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager Cooling device components for the cooling of the power electronics with a micro-heat exchanger |
| 10/25/2001 | DE10017741A1 Gehäuse für Halbleiterchips Enclosure for semiconductor chips |
| 10/25/2001 | CA2406371A1 Electromigration early failure distribution in submicron interconnects |
| 10/24/2001 | EP1148773A1 High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics |
| 10/24/2001 | EP1148772A2 Cold plate utilizing fin with evaporating refrigerant |
| 10/24/2001 | EP1148559A2 High speed semiconductor photodetector and method of fabricating the same |
| 10/24/2001 | EP1148550A1 Radio frequency amplifier with small distortion and superior isolation |
| 10/24/2001 | EP1148549A2 Integrated circuit with integrated HF filter |
| 10/24/2001 | EP1148548A2 Method of forming lead-free bump interconnections |
| 10/24/2001 | EP1148547A2 Coolant cooled type semiconductor device |
| 10/24/2001 | EP1148542A2 Process for the fabrication of an interconnection level in a semiconductor chip having an antifuse |
| 10/24/2001 | EP1148539A2 Method of depositing low K films using an oxidizing plasma |
| 10/24/2001 | EP1148440A1 Semiconductor device and production method thereof |
| 10/24/2001 | EP1148108A1 Storage media for latent heat storage units |
| 10/24/2001 | EP1147557A1 Integrated circuit device, electronic module for chip card using said device and method for making same |
| 10/24/2001 | EP1147556A1 Mechanical assembly for regulating the temperature of an electronic device |
| 10/24/2001 | EP1147555A1 Heat exchanger that contacts an entire planar face of an electronic device except for its corners |
| 10/24/2001 | EP1147554A2 METHOD AND DEVICE FOR INTERCONNECT RADIO FREQUENCY POWER SiC FIELD EFFECT TRANSISTORS |
| 10/24/2001 | EP1147553A1 Method for housing electronic components |
| 10/24/2001 | EP0820639B1 Process for passivating a silicon carbide surface against oxygen |
| 10/24/2001 | CN2456313Y Extruded aluminium radiating sectional material for increasing radiation effection |
| 10/24/2001 | CN2456312Y Thyristor gate for high voltage dynamic reactive power compensator |
| 10/24/2001 | CN1319115A Salt-modified electrostatic dissipative polymers |
| 10/24/2001 | CN1319112A Epoxy resin composition and seimconductor device |
| 10/24/2001 | CN1318868A Electrooptical device, and its mfg. and electronic device |
| 10/24/2001 | CN1318866A Multi-chip semiconductor device and storage card |
| 10/24/2001 | CN1318865A Terminal electrode forming method of chip electronic element and apparatus therefor |
| 10/24/2001 | CN1318849A High-frequency current inhibiting body of magnetic loss material |
| 10/24/2001 | CN1318655A Electroplating method |
| 10/24/2001 | CN1318571A Semiconductor device and its manufacture |
| 10/24/2001 | CN1073746C Mfg. of multichip component |
| 10/23/2001 | USRE37416 Method for manufacturing a modular semiconductor power device |
| 10/23/2001 | US6308307 Method for power routing and distribution in an integrated circuit with multiple interconnect layers |
| 10/23/2001 | US6307755 Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
| 10/23/2001 | US6307748 Heat sink clip assembly |
| 10/23/2001 | US6307747 Resilient processor/heat sink retaining assembly |
| 10/23/2001 | US6307479 Running indicator for integrated circuit package |
| 10/23/2001 | US6307450 Millimeter wave module and radio apparatus |
| 10/23/2001 | US6307273 High contrast, low noise alignment mark for laser trimming of redundant memory arrays |
| 10/23/2001 | US6307272 Semiconductor device and method for manufacturing the same |
| 10/23/2001 | US6307271 Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
| 10/23/2001 | US6307269 Semiconductor device with chip size package |
| 10/23/2001 | US6307268 Suppression of interconnect stress migration by refractory metal plug |
| 10/23/2001 | US6307267 Semiconductor device and manufacturing method thereof |
| 10/23/2001 | US6307266 Metal-line structure having a spacer structure covering the sidewalls thereof |
| 10/23/2001 | US6307265 Feasible, gas-dielectric interconnect process |
| 10/23/2001 | US6307264 Semiconductor device, active matrix substrate and process for production thereof |
| 10/23/2001 | US6307263 Integrated semiconductor chip with modular dummy structures |
| 10/23/2001 | US6307262 Condensed memory matrix |
| 10/23/2001 | US6307261 Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device |
| 10/23/2001 | US6307260 Microelectronic assembly fabrication with terminal formation from a conductive layer |
| 10/23/2001 | US6307259 Plastic package for semiconductor device |
| 10/23/2001 | US6307258 Open-cavity semiconductor die package |
| 10/23/2001 | US6307257 Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads |
| 10/23/2001 | US6307256 Semiconductor package with a stacked chip on a leadframe |
| 10/23/2001 | US6307255 Multi-layer lead frame for a semiconductor device |
| 10/23/2001 | US6307254 Technique for attaching die to leads |
| 10/23/2001 | US6307253 Lead frame and semiconductor device made by using it |
| 10/23/2001 | US6307252 On-chip shielding of signals |
| 10/23/2001 | US6307249 Integrated circuit having isolated anti-fuse structures and method for fabricating the same |
| 10/23/2001 | US6307247 Monolithic low dielectric constant platform for passive components and method |
| 10/23/2001 | US6307226 Contact openings to electronic components having recessed sidewall structures |