Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2001
10/30/2001US6310773 Heat sink system
10/30/2001US6310772 Enclosure for telecommunications equipment
10/30/2001US6310771 CPU heat sink
10/30/2001US6310758 Lead terminal and electronic component including lead terminal
10/30/2001US6310401 Substrate for high-voltage modules
10/30/2001US6310400 Apparatus for capacitively coupling electronic devices
10/30/2001US6310399 Semiconductor memory configuration with a bit-line twist
10/30/2001US6310398 Routable high-density interfaces for integrated circuit devices
10/30/2001US6310396 Semiconductor circuit apparatus and method for fabricating the semiconductor circuit apparatus
10/30/2001US6310395 Electronic component with anodically bonded contact
10/30/2001US6310394 Reduced parasitic capacitance semiconductor devices
10/30/2001US6310393 Electric circuit and package for semiconductor
10/30/2001US6310391 Mounted structure of circuit board and multi-layer circuit board therefor
10/30/2001US6310390 BGA package and method of fabrication
10/30/2001US6310389 Semiconductor package
10/30/2001US6310388 Semiconductor die assembly having leadframe decoupling characters
10/30/2001US6310387 Integrated circuit inductor with high self-resonance frequency
10/30/2001US6310386 High performance chip/package inductor integration
10/30/2001US6310368 Semiconductor device and method for fabricating same
10/30/2001US6310361 Electrical test structure on a semiconductor substrate and test method
10/30/2001US6310303 Structure for printed circuit design
10/30/2001US6310300 Fluorine-free barrier layer between conductor and insulator for degradation prevention
10/30/2001US6310298 Printed circuit board substrate having solder mask-free edges
10/30/2001US6310288 Underfill coating for loc package
10/30/2001US6310285 EMI preventive part and active device with the same
10/30/2001US6310280 Thermoelectric device; for use in analysis of chip surfaces
10/30/2001US6310119 Film-shaped encapsulating agent for electronic parts
10/30/2001US6309975 Methods of making implanted structures
10/30/2001US6309970 Method of forming multi-level copper interconnect with formation of copper oxide on exposed copper surface
10/30/2001US6309967 Method of forming a contact
10/30/2001US6309965 Multilayer
10/30/2001US6309963 Method for manufacturing semiconductor device
10/30/2001US6309958 Semiconductor device and method of manufacturing the same
10/30/2001US6309946 Reduced RC delay between adjacent substrate wiring lines
10/30/2001US6309944 Overlay matching method which eliminates alignment induced errors and optimizes lens matching
10/30/2001US6309943 Precision marking and singulation method
10/30/2001US6309931 Method of making a semiconductor device with sidewall insulating layers in the capacitor contact hole
10/30/2001US6309915 Semiconductor chip package with expander ring and method of making same
10/30/2001US6309913 Technique for attaching die to leads
10/30/2001US6309912 Method of interconnecting an embedded integrated circuit
10/30/2001US6309911 Method of fabricating semiconductor device
10/30/2001US6309910 Microelectronic components with frangible lead sections
10/30/2001US6309909 Semiconductor device and method of manufacturing the same
10/30/2001US6309908 Package for an electronic component and a method of making it
10/30/2001US6309901 Use of glass laminate as a substrate in semiconductor devices
10/30/2001US6309900 Test structures for testing planarization systems and methods for using same
10/30/2001US6309898 Method for manufacturing semiconductor device capable of improving manufacturing yield
10/30/2001US6309897 Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
10/30/2001US6309801 Applying layer, masking, etching
10/30/2001US6309790 Organic anti-reflective coating material and its preparation
10/30/2001US6309766 Integrated circuits
10/30/2001US6309737 Circuit substrate
10/30/2001US6309698 Manufacturing process for a lead-frame forming material
10/30/2001US6309575 Transfer molding method for forming integrated circuit package
10/30/2001US6308938 Semiconductor integrated circuit device
10/30/2001US6308773 Heat sink and fan arrangement
10/30/2001US6308772 Heat sink
10/30/2001US6308771 High performance fan tail heat exchanger
10/30/2001CA2068726C Novel bistriazene compounds and polymeric compositions crosslinked therewith
10/26/2001CA2345175A1 High-frequency circuit and its module for communication devices
10/25/2001WO2001080612A1 Method for fabricating electrical connecting element, and electrical connecting element
10/25/2001WO2001080609A1 Double-sided wiring board and its manufacture method
10/25/2001WO2001080387A2 Over-voltage protection for electronic circuits
10/25/2001WO2001080320A1 Diode and method for producing the same
10/25/2001WO2001080316A2 Contactless interconnection system
10/25/2001WO2001080315A2 Shaped springs and methods of fabricating and using shaped springs
10/25/2001WO2001080314A2 Performance enhanced leaded packaging for electrical components
10/25/2001WO2001080313A1 Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
10/25/2001WO2001080309A2 A method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer
10/25/2001WO2001080305A2 Electromigration early failure distribution in submicron interconnects
10/25/2001WO2001080304A2 Improved test structures and methods for inspecting and utilizing the same
10/25/2001WO2001080302A1 Flip chip mounting method
10/25/2001WO2001080301A1 A module card and a method for manufacturing the same
10/25/2001WO2001080299A1 Semiconductor device and fabrication method therefor
10/25/2001WO2001080256A1 Laminated body, capacitor, electronic part, and method and device for manufacturing the laminated body, capacitor, and electronic part
10/25/2001WO2001079776A1 Notched finned heat sink structure
10/25/2001WO2001017013A3 A method and an apparatus for forming an under bump metallization structure
10/25/2001WO2000055909A9 Extreme density packaging for electronic assemblies
10/25/2001WO2000042231A9 Polycrystalline silicon germanium films for forming micro-electromechanical systems
10/25/2001US20010034587 Method for determining the desired decoupling components for power distribution systems
10/25/2001US20010034382 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
10/25/2001US20010034150 Socket for electric part
10/25/2001US20010034137 Semiconductor device and manufacturing method of the device
10/25/2001US20010034132 Method of manufacturing a semiconductor device and a semicondustor device
10/25/2001US20010034128 Deposition method for wiring thin film
10/25/2001US20010034127 Semiconductor device manufacturing method
10/25/2001US20010034126 Copper alloy seed layer for copper metallization
10/25/2001US20010034122 Structure for a multi-layered dielectric layer and manufacturing method thereof
10/25/2001US20010034120 Method for producing semiconductor device
10/25/2001US20010034119 Semiconductor devices and methods for manufacturing semiconductor devices
10/25/2001US20010034117 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
10/25/2001US20010034108 Semiconductor device and method for manufacturing the same
10/25/2001US20010034084 Method for making a pedestal fuse
10/25/2001US20010034083 Method of fabricating a molded package for micromechanical devices
10/25/2001US20010034082 Semiconductor package and semiconductor package fabrication method
10/25/2001US20010034079 Semiconductor device baking method
10/25/2001US20010034070 Apparatus and method for testing fuses
10/25/2001US20010033963 Layered substrate with battery
10/25/2001US20010033952 Method and apparatus for integrated-battery devices
10/25/2001US20010033891 Blending copper powder with a high-polymer organic substance, adding alumina in cellulose derivative vehicle, and sintering to smaller particles
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