Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/01/2001US20010036685 Manufacturing method for semiconductor device
11/01/2001US20010036677 Semiconductor wafer having identification indication and method of manufacturing the same
11/01/2001US20010036514 Partial plating system
11/01/2001US20010036506 Substrate and process for producing the same
11/01/2001US20010036066 Method and apparatus for delivering power to high performance electronic assemblies
11/01/2001US20010036065 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
11/01/2001US20010036063 Electronic part module mounted on
11/01/2001US20010035809 MMIC airbridge balun transformer
11/01/2001US20010035805 Radio frequency amplifier with small distortion and superior isolation
11/01/2001US20010035764 System for testing a semiconductor device
11/01/2001US20010035763 Method of testing a semiconductive device
11/01/2001US20010035762 Integrated circuit device and semiconductor wafer having test circuit therein
11/01/2001US20010035746 Transistor pattern for voltage regulator
11/01/2001US20010035597 Stereolithographically marked semiconductor devices and methods
11/01/2001US20010035588 Epoxy resin composition, semiconductor device, and method of judging visibility of laser mark
11/01/2001US20010035587 Resin-sealed chip stack type semiconductor device
11/01/2001US20010035586 Chip size package semiconductor device without an interposer and method of forming the same
11/01/2001US20010035585 Semiconductor device having stress reducing laminate and method for manufacturing the same
11/01/2001US20010035584 Semiconductor device and manufacturing method therefor
11/01/2001US20010035582 Hard mask for copper plasma etch
11/01/2001US20010035579 Resin-molded unit including an electronic circuit component
11/01/2001US20010035578 Thermal conducting trench in a semiconductor structure and method for forming the same
11/01/2001US20010035577 Heat dissipating microelectronic package
11/01/2001US20010035576 HID land grid array packaged device having electrical and optical interconnects
11/01/2001US20010035575 Semiconductor device and manufacturing method thereof
11/01/2001US20010035572 Stackable flex circuit chip package and method of making same
11/01/2001US20010035571 Lead frame assemblies with voltage reference plane and IC packages including same
11/01/2001US20010035570 Package for semiconductor devices
11/01/2001US20010035569 Resin-packaged semiconductor device
11/01/2001US20010035568 Lead frame for a semiconductor chip package, semiconductor chip package incorporating multiple integrated circuit chips, and method of fabricating a semiconductor chip package with multiple integrated circuit chips
11/01/2001US20010035567 Semiconductor wafer having a bank on a scribe line
11/01/2001US20010035566 Semiconductor device and process for producing the same
11/01/2001US20010035556 Display apparatus and manufacture method thereof
11/01/2001US20010035555 Semiconductor device and method of fabricating the same
11/01/2001US20010035547 Semiconductor device and method of fabricating same
11/01/2001US20010035533 Semiconductor device and process for fabrication thereof
11/01/2001US20010035529 Micro-flex technology in semiconductor packages
11/01/2001US20010035525 Semiconductor device having a test pattern same as conductive pattern to be tested and method for testing semiconductor device for short-circuit
11/01/2001US20010035452 Wire bonding process for copper-metallized integrated circuits
11/01/2001US20010035451 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
11/01/2001US20010035294 Chip size package and method of fabricating the same
11/01/2001US20010035285 High performance cold plate for electronic cooling
11/01/2001US20010035261 Counterfeiting prevention by embossing substrates to form concealed impression visible at inclines
11/01/2001US20010035238 Physical vapor deposition target
11/01/2001US20010035237 Copper, silver alloy
11/01/2001CA2402082A1 Method of forming an integrated circuit package at a wafer level
10/2001
10/31/2001EP1150552A2 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
10/31/2001EP1150551A1 Conductive connecting pin and package board
10/31/2001EP1150384A2 Connector module for integrated circuit device, and integrated circuit device suitable for use with the same
10/31/2001EP1150355A1 Integrated circuit chip, integrated circuit, printed-circuit board and electronic device
10/31/2001EP1150352A2 Lead-less semiconductor device with improved electrode pattern structure
10/31/2001EP1150351A2 Semiconductor package and semiconductor package fabrication method
10/31/2001EP1150347A2 Semiconductor device and manufacturing method of the same
10/31/2001EP1150346A2 A process for preparing insulating material having low dielectric constant
10/31/2001EP1150345A2 Fluorine-containing materials and processes
10/31/2001EP1150129A2 Low temperature coeficient leadframe for integrated circuits, and circuits comprising same
10/31/2001EP1150086A1 Flexible volume-variable heat-conducting device
10/31/2001EP1149936A2 Plating system
10/31/2001EP1149933A1 Deposition method of dielectric films having a low dielectric constant
10/31/2001EP1149864A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
10/31/2001EP1149519A2 Method of applying a phase change thermal interface material
10/31/2001EP1149433A1 Electrical contact element and use of the contact element
10/31/2001EP1149419A1 Multi-chip module for use in high-power applications
10/31/2001EP1149418A1 Open-cavity semiconductor die package
10/31/2001EP1149416A1 Method of depositing a copper seed layer which promotes improved feature surface coverage
10/31/2001EP1149409A2 Method for forming a silicide region on a silicon body
10/31/2001EP1149391A1 Multi-track integrated spiral inductor
10/31/2001EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface
10/31/2001EP0715353B1 Board for a semiconductor chip
10/31/2001DE10049397A1 Aufbau von Leistungshalbleitern mit einer textilen Ausgleichsschicht zum Kühlkörper Construction of power semiconductors with a textile balancing layer to the heatsink
10/31/2001DE10019811A1 Integrierte Schaltung Integrated circuit
10/31/2001DE10019489A1 Package for surface-mounted electronic device
10/31/2001CN2457740Y Structure of IC wafer
10/31/2001CN1320278A Lead frame attachement for optoelectronic device
10/31/2001CN1320276A Clad plate for lead frame,s lead frame using the same, and method of manufacturing the lead frame
10/31/2001CN1320275A Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
10/31/2001CN1320183A Liquid carbon dioxide cleaning utilizing natural and modified natural solvents
10/31/2001CN1320136A Preparation of cross-linked 2-dimensional polymers with sidedness from alpha beta-lactones
10/31/2001CN1320132A Phenolic resin, epoxy resin, and processes for producing these
10/31/2001CN1320101A Method of and apparatus for sealing an hermetic lid to a microelectronic machine
10/31/2001CN1320012A Method for producing multi-layer circuit board
10/31/2001CN1319948A Electronic element, electronic device and communication equipment
10/31/2001CN1319893A Electric capacitor structure and method for making same
10/31/2001CN1319891A Structure for preventing interconnected copper from being oxidized in low dielectric constant material
10/31/2001CN1319890A Semiconductor device and semiconductor assembly using same
10/31/2001CN1319889A Power source with inlaid high heat conduction moulding element
10/31/2001CN1319888A Heat conduction itensified semicondcutor structure and making process
10/31/2001CN1319887A Structure of semiconductor device adherence layer and technology for forming same
10/31/2001CN1319885A Fixing clamp distribution board and electronic component assembly and making method thereof
10/31/2001CN1319571A Isolation ceramic, multi-layer ceramic substrate and laminated electronic component
10/31/2001CN1319560A Ozone generator
10/31/2001CN1319474A Heating head for hot-pressing bonding and making method thereof
10/31/2001CN1074168C Silicon semiconductor diode chip of all tangent plane junction glass passivation and making method
10/31/2001CN1074165C Optical mask with vernier
10/30/2001US6311315 Semiconductor integrated circuit, design method and computer-readable recording medium
10/30/2001US6311147 Integrated circuit power net analysis
10/30/2001US6310791 Power rectifier
10/30/2001US6310776 Transverse mountable heat sink for use in an electronic device
10/30/2001US6310775 Power module substrate
10/30/2001US6310774 Heat sink clip
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