Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/21/2013US20130307156 Reliable Area Joints for Power Semiconductors
11/21/2013US20130307155 Semiconductor device, method of manufacturing the same, and electronic component
11/21/2013US20130307153 Interconnect with titanium-oxide diffusion barrier
11/21/2013US20130307152 Semiconductor package and fabrication method thereof
11/21/2013US20130307151 Method to resolve hollow metal defects in interconnects
11/21/2013US20130307150 Copper interconnect structure and its formation
11/21/2013US20130307149 Three-Dimensional Integrated Circuit (3DIC)
11/21/2013US20130307148 Low loop wire bonding
11/21/2013US20130307147 Chip package and method for forming the same
11/21/2013US20130307146 Mounting structure of electronic component and method of manufacturing the mounting structure of the electronic component
11/21/2013US20130307145 Semiconductor package and method of fabricating the same
11/21/2013US20130307144 Three-dimensional chip stack and method of forming the same
11/21/2013US20130307143 Wafer-level packaging mechanisms
11/21/2013US20130307142 Selective solder bump formation on wafer
11/21/2013US20130307141 Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals
11/21/2013US20130307140 Packaging with interposer frame
11/21/2013US20130307139 Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
11/21/2013US20130307138 Deskewed multi-die packages
11/21/2013US20130307137 Chip package and method for forming the same
11/21/2013US20130307136 Sheet structure, method of manufacturing sheet structure, and electronic device
11/21/2013US20130307135 Semiconductor element housing package and semiconductor device equipped with the same
11/21/2013US20130307134 Conductive chip disposed on lead semiconductor package and methods of making the same
11/21/2013US20130307133 Semiconductor device assembly and semiconductor device and method of manufacturing the same
11/21/2013US20130307132 Semiconductor device
11/21/2013US20130307131 Semiconductor device
11/21/2013US20130307130 Semiconductor device
11/21/2013US20130307129 Wiring member and semiconductor module having the same
11/21/2013US20130307128 Semiconductor packages with thermal dissipation structures and emi shielding
11/21/2013US20130307125 Chip package and method for forming the same
11/21/2013US20130307124 Method for manufacturing electronic component, and electronic apparatus
11/21/2013US20130307116 Method and System for Split Threshold Voltage Programmable Bitcells
11/21/2013US20130307115 Anti-fuse structure and fabrication
11/21/2013US20130307114 SEMICONDUCTOR DEVICE COMPRISING METAL-BASED eFUSES OF ENHANCED PROGRAMMING EFFICIENCY BY ENHANCING METAL AGGLOMERATION AND/OR VOIDING
11/21/2013US20130307113 Semiconductor device
11/21/2013US20130307091 Schottky Diodes Having Metal Gate Electrodes and Methods of Formation Thereof
11/21/2013US20130307046 Electronic device including a nonvolatile memory structure having an antifuse component
11/21/2013US20130307036 Semiconductor device and a method of manufacturing the same
11/21/2013US20130307032 Methods of forming conductive contacts for a semiconductor device
11/21/2013US20130306992 Silicon carbide semiconductor device and method for manufacturing the same
11/21/2013US20130306991 Semiconductor device
11/21/2013US20130306990 Wafer precursor prepared for group iii nitride epitaxial growth on a composite substrate having diamond and silicon carbide layers, and semiconductor laser formed thereon
11/21/2013US20130306967 Adjusting configuration of a multiple gate transistor by controlling individual fins
11/21/2013US20130306708 Ultrasonic bonding systems and methods of using the same
11/21/2013DE10300530B4 Leiterplatte mit einem eingebauten Kondensator und Herstellungsverfahren der Leiterplatte Printed circuit board with a built-in capacitor and manufacturing method of the printed circuit board
11/21/2013DE102013209222A1 ESD-Schutz für Anwendungen mit hoher Spannung ESD protection for high voltage applications
11/21/2013DE102013208818A1 Zuverlässige Bereichsverbindungsstellen für Leistungshalbleiter Reliable field joints for power semiconductors
11/21/2013DE102013105057A1 Halbleiterstruktur, halbleiterbauelement mit einer halbleiterstruktur und verfahren zur herstellung einer halbleiterstruktur A semiconductor structure semiconductor device with a semiconductor structure and method of manufacturing a semiconductor structure
11/21/2013DE102013105030A1 Lichtemittierende Hableitervorrichtung mit Multi-Zellenarray und Herstellungsverfahren davon, lichtemittierendes Modul und Beleuchtungsvorrichtung Light emitting Hableitervorrichtung with multi-cell array and manufacturing method thereof, light-emitting module and lighting device
11/21/2013DE102013105009A1 Halbleitervorrichtung mit einer Silikatglasstruktur und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device comprising a silicate glass structure and method of manufacturing a semiconductor device
11/21/2013DE102013104742A1 Verdrahtungselement und Halbleitermodul mit demselben Wiring member and the semiconductor module with the same
11/21/2013DE102013103916A1 Housing comprises chip formed in first region, molding composition formed in second region, first- and second polymer layers, several connecting structures formed between polymer layers, metal-insulator-metal capacitor, and metal bump
11/21/2013DE102012212890B4 High-Side Schalter High-side switch
11/21/2013DE102012208251A1 Elektrische Kontaktierung für Halbleiter The electrical contact for semiconductor
11/21/2013DE102012112758A1 Semiconductor package for use as wafer level package, has contact whose surface contacts portion of distribution lines at different level than surface of casting mass under distribution lines that extend over borders of semiconductor die
11/21/2013DE102012009746A1 Method for checking thermal coupling between semiconductor component and heat-conductive associated cooling element, involves passing measurement current through semiconductor material heated by load current during measuring phase
11/21/2013DE102011050228B9 Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule The semiconductor package and method for manufacturing a semiconductor package with inductor
11/20/2013EP2665095A1 Power electronic devices
11/20/2013EP2665094A1 Tamper resistant IC
11/20/2013EP2665093A1 Cooler
11/20/2013EP2665092A1 Method for producing a semiconductor element on a copper substrate with intermediate insulation layer
11/20/2013EP2664228A1 Devices having anisotropic conductivity heatsinks, and methods of making thereof
11/20/2013EP2664226A1 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
11/20/2013EP2664224A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
11/20/2013EP2664222A1 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
11/20/2013EP2664013A1 Light emitting device, light emitting module, and method for manufacturing light emitting device
11/20/2013EP2663999A2 Arrangement and method for cooling a support
11/20/2013EP2455512B1 Masking jig, substrate heating apparatus, and film formation method
11/20/2013EP2390914B1 Assembly of two connection partners with low temperature pressure interconnection and method for producing same
11/20/2013EP2361440B1 Backside illuminated image sensor
11/20/2013EP1992012B1 Novel structure and method for metal integration
11/20/2013EP1943672B1 Methods and apparatus for flip-chip-on-lead semiconductor package
11/20/2013CN203301408U Brushless motor controller and elasticity trim strip
11/20/2013CN203300645U Single-phase rectifying bridge
11/20/2013CN203300644U Double-base island packaging form structure based on gate-associated transistor
11/20/2013CN203300643U Three-dimensionally packaged SDRAM memory
11/20/2013CN203300641U To-be-plated sample reducing surface over plating of silicon through-hole after copper plating
11/20/2013CN203300640U A hot-pressing formed surface-mounted ceramic housing of an electronic component
11/20/2013CN203300639U Semiconductor packaging structure
11/20/2013CN203300638U Three-dimensionally packaged EEPROM memory
11/20/2013CN203300637U Semiconductor encapsulating body
11/20/2013CN203300636U Lead wire framework conducive to tin point diffusion
11/20/2013CN203300635U A triode lead frame
11/20/2013CN203300634U Special-shaped copper belt for electronic lead frames
11/20/2013CN203300633U A packaging structure of a glass-sealed electronic component
11/20/2013CN203300632U Semiconductor double-side packaging structure
11/20/2013CN203300631U 半导体器件 Semiconductor devices
11/20/2013CN203300630U Back-surface metallized structure for P-type silicon chip device and applicable to eutectic soldering process
11/20/2013CN203300629U Package structure of audio power amplification circuit
11/20/2013CN203300628U Water cooling load device
11/20/2013CN203300627U Heat dissipation device of integrated circuit
11/20/2013CN203300626U Cooling fin fixing structure
11/20/2013CN203300625U Semiconductor surge suppressor package body structure
11/20/2013CN203299499U Array substrate and display device
11/20/2013CN1870261B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/20/2013CN103404249A Cover tape, component package, and method of making the same
11/20/2013CN103404245A Hybrid-core through holes and vias
11/20/2013CN103403890A Light emitting device, light emitting module, and method for manufacturing light emitting device
11/20/2013CN103403865A Ramp-stack chip package with static bends
11/20/2013CN103403864A Semiconductor packages with agglomerate terminals
11/20/2013CN103403863A Heat dissipation device and method
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