H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/08/2001	US20010039646 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components
11/08/2001	US20010039645 Semiconductor integrated circuit having thereon on-chip capacitors
11/08/2001	US20010039374 Hermetic feedthrough for an implantable device
11/08/2001	US20010039128 Method of connecting IC package to IC contactor with weaker force and IC contactor for such method
11/08/2001	US20010039125 Method for making an insulating film
11/08/2001	US20010039113 Method for forming a semiconductor connection with a top surface having an enlarged recess
11/08/2001	US20010039111 Semiconductor devices and methods for manufacturing the same
11/08/2001	US20010039110 Semiconductor apparatus and semiconductor apparatus manufacturing method
11/08/2001	US20010039078 Wafer level packaging
11/08/2001	US20010039077 Semiconductor Constructions Compromising Aluminum-Containing Layers
11/08/2001	US20010039076 Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device
11/08/2001	US20010039075 Method for Capacitively Coupling Electronic Devices
11/08/2001	US20010039074 Micro-flex technology in semiconductor packages
11/08/2001	US20010039073 Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts
11/08/2001	US20010039071 Method of forming board -on -chip packages
11/08/2001	US20010038926 Magnetic thin film
11/08/2001	US20010038905 Printed wiring board and method of manufacturing the same
11/08/2001	US20010038531 Package substrate
11/08/2001	US20010038530 Imbedded die-scale interconnect for ultra-high speed digital communications
11/08/2001	US20010038526 Semiconductor device mounting structure and feeding-side charger with heat radiating unit
11/08/2001	US20010038521 Low inductance high capacitance capacitor and method of making same
11/08/2001	US20010038485 Electro-optical device, manufacturing method for manufacturing electro-optical device, and electronic equipment
11/08/2001	US20010038310 Power transistor module, power amplifier and methods in the fabrication thereof
11/08/2001	US20010038166 Method of underfilling an integrated circuit chip
11/08/2001	US20010038154 Semiconductor device
11/08/2001	US20010038153 Semiconductor substrate and process for its production
11/08/2001	US20010038152 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
11/08/2001	US20010038151 Semiconductor device and the method for manufacturing the same
11/08/2001	US20010038150 Semiconductor device manufactured by package group molding and dicing method
11/08/2001	US20010038149 Multilayered wiring structure and method of manufacturing the same
11/08/2001	US20010038148 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
11/08/2001	US20010038147 Semiconductor device manufacturing method and semiconductor device
11/08/2001	US20010038146 High-frequency circuit and its module for communication devices
11/08/2001	US20010038145 Multilayer wiring board, semiconductor device and methods for manufacturing such multilayer wiring board and semiconductor device
11/08/2001	US20010038144 Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
11/08/2001	US20010038142 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
11/08/2001	US20010038141 Packaged semiconductor chip and method of making same
11/08/2001	US20010038140 High rigidity, multi-layered semiconductor package and method of making the same
11/08/2001	US20010038138 High voltage shield
11/08/2001	US20010038132 Porous silicon oxycarbide integrated circuit insulator
11/08/2001	US20010038104 Multilayer matrix-addressable logic device with a plurality of individually matrix-addressable and stacked thin films of an active material
11/08/2001	US20010038097 Thin film transistors, and liquid crystal display device and electronic apparatus using the same
11/08/2001	US20010038093 Comprises resin of vinyl terminated polydimethyl siloxane, methylhydrosiloxane-dimethylsiloxane copolymers, polysilicate, silicone rubber formed with use of Karstedt cataylst; heat dissipation; heat resistant semiconductors
11/08/2001	US20010037896 Package substrate
11/08/2001	US20010037893 Method and an arrangement relating to the encapsulation of a component
11/08/2001	US20010037892 Semiconductor package
11/08/2001	US20010037880 Valved heat pipe and adaptive cooling system including the same
11/08/2001	US20010037875 Stackable heat sink for electronic components
11/08/2001	US20010037862 Support-frame bonding apparatus
11/08/2001	US20010037716 Method and apparatus for removing one or more covers of an electronic module
11/08/2001	US20010037571 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
11/08/2001	US20010037567 Method and apparatus of die attachment for BOC and F/C surface mount
11/08/2001	US20010037565 Process for forming a multi-level thin-film electronic packaging structure
11/08/2001	DE10121337A1 Magnetic thin film for magnetic component, has photosensitive or non-photosensitive resin film having fine particles of either ferrous, cobalt, nickel, manganese and chromium
11/08/2001	DE10050487A1 Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer
11/08/2001	DE10041764A1 Semiconductor component, uses contact forming process based on filling a cavity with an electrical contact material formed from a conductive metallic paste
11/08/2001	CA2413222A1 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/07/2001	EP1152485A1 Radio communication device
11/07/2001	EP1152465A1 A method and a circuit system for using equivalent integrated-circuit devices operating at different voltages
11/07/2001	EP1152464A2 Chip size package semiconductor device and method of manufacturing the same
11/07/2001	EP1152463A1 Semiconductor device and its production method
11/07/2001	EP1151962A1 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
11/07/2001	EP1151817A2 Method for preparing metal powder by thermal decomposition
11/07/2001	EP1151476A1 Semiconductor device having a field effect transistor and a method of manufacturing such a device
11/07/2001	EP1151474A1 Programmable semiconductor device structures and methods for making the same
11/07/2001	EP1151473A1 Air gap dielectric in self-aligned via structures
11/07/2001	EP1151471A1 Method for protecting an integrated circuit chip
11/07/2001	EP1151457A1 Method and apparatus for utilizing heat dissipated from an electrical device
11/07/2001	EP1151454A1 An optoelectronic assembly
11/07/2001	EP1151033A1 Thermally conductive composite material
11/07/2001	EP0757846B1 Electronic component comprising a thin-film structure with passive elements
11/07/2001	CN2458734Y Radiator with magnetic positioning fan set
11/07/2001	CN2458733Y Combination of radiating device
11/07/2001	CN2458732Y Radiating device
11/07/2001	CN2458731Y 散热器组合 Radiator combination
11/07/2001	CN2458730Y Substrate of encapsulated integrated circuit
11/07/2001	CN2458729Y Encapsulated integrated circuit
11/07/2001	CN1321411A Printed wiring board and method of producing same
11/07/2001	CN1321410A Printed wiring board and method of producing same
11/07/2001	CN1321337A Heat sink including heat receiving surface with protruding portion
11/07/2001	CN1321335A Heat sink mfg. device and mfg. method
11/07/2001	CN1321179A Epoxy resin composition and semiconductor device
11/07/2001	CN1320966A Connecting module for integrated circuit element and IC element adapted for it
11/07/2001	CN1320965A Semiconductor package and mfg. method thereof
11/07/2001	CN1320964A Semiconductor device and mfg. method thereof
11/07/2001	CN1320963A Expansible film-type soft heat tube
11/07/2001	CN1320960A Interconnection method without lead bosses
11/07/2001	CN1320957A Method for installing semiconductor chip
11/07/2001	CN1320953A Method for forming electroless plated metal lining
11/07/2001	CN1320951A Semiconductor device, its mfg. method and chip contg. epoxy resin compoistion
11/07/2001	CN1074589C Array of electrical component with leads attached
11/07/2001	CN1074584C Heat sink attachment assembly
11/06/2001	US6314013 Stacked integrated circuits
11/06/2001	US6313998 Circuit board assembly having a three dimensional array of integrated circuit packages
11/06/2001	US6313996 Heat radiation system for electric circuitry
11/06/2001	US6313994 Extended surface area heat sink
11/06/2001	US6313993 Strap spring for attaching heat sinks to circuit boards
11/06/2001	US6313992 Method and apparatus for increasing the power density of integrated circuit boards and their components
11/06/2001	US6313990 Cooling apparatus for electronic devices
11/06/2001	US6313651 Carrier and system for testing bumped semiconductor components

1 ... 1819 1820 1821 1822 1823 1824 1825 1826 1827 1828 1829 1830 1831 1832 1833 1834 1835 1836 1837 1838 1839 ... 2262