H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/14/2001	EP1036414A4 Chip scale package using large ductile solder balls
11/14/2001	EP0928486B1 Device and method for testing integrated circuit dice in an integrated circuit module
11/14/2001	CN2459757Y Diode radiation structure
11/14/2001	CN2459756Y Side air inlet radiator
11/14/2001	CN2459755Y Structure of IC chip
11/14/2001	CN1322378A Method for reducing die cracking in integrated circuits
11/14/2001	CN1322377A Lead frmae structure for fabrication of hybrid semiconductor devices
11/14/2001	CN1322376A Flat semiconductor device, method for manufacturing same, and converter comprising same
11/14/2001	CN1322375A Electronic device and method of manufacture thereof
11/14/2001	CN1322363A Isolator
11/14/2001	CN1322229A Adhesive for bonding circuit members, circuit board, and method of producing same
11/14/2001	CN1322105A Method for mfg. multilayer integrated substrate and multilayer ceramic element
11/14/2001	CN1322010A Protsusion forming method, semiconductor device and its mfg. method, circuit board and electronic machine
11/14/2001	CN1322009A Spin coating glass composition and method for forming silica layer in production of semiconductor
11/14/2001	CN1321898A Three-D installed element, its mfg. method and optical transmission device
11/14/2001	CN1321784A High density rod grid array connection and method thereof
11/14/2001	CN1321720A Storage medium of latent heat storage system
11/14/2001	CN1074857C Method for forming metal wiring of semiconductor device
11/13/2001	US6317333 Package construction of semiconductor device
11/13/2001	US6317331 Wiring substrate with thermal insert
11/13/2001	US6317328 Heat-radiating module structure
11/13/2001	US6317327 Diode cooling arrangement
11/13/2001	US6317326 Integrated circuit device package and heat dissipation device
11/13/2001	US6317324 Encapsulated power supply with a high thermal conductivity molded insert
11/13/2001	US6317323 Heat sink assembly for an electrical socket
11/13/2001	US6317322 Plate type heat pipe and a cooling system using same
11/13/2001	US6317023 Method to embed passive components
11/13/2001	US6316981 Signal distribution network on backside of substrate
11/13/2001	US6316839 Mask repattern process
11/13/2001	US6316838 Semiconductor device
11/13/2001	US6316837 Area array type semiconductor package and fabrication method
11/13/2001	US6316836 Semiconductor device interconnection structure
11/13/2001	US6316835 Method for forming zig-zag bordered openings in semiconductor structures and structures formed
11/13/2001	US6316834 Tungsten plugs for integrated circuits and method for making same
11/13/2001	US6316833 Semiconductor device with multilayer interconnection having HSQ film with implanted fluorine and fluorine preventing liner
11/13/2001	US6316832 Moldless semiconductor device and photovoltaic device module making use of the same
11/13/2001	US6316831 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
11/13/2001	US6316829 Reinforced semiconductor package
11/13/2001	US6316828 Structure of a solder mask for the circuit module of a BGA substrate
11/13/2001	US6316827 Semiconductor device having improved temperature distribution
11/13/2001	US6316826 Semiconductor mounting package
11/13/2001	US6316825 Chip stack package utilizing a connecting hole to improve electrical connection between leadframes
11/13/2001	US6316824 Plastic leads frames for semiconductor devices
11/13/2001	US6316823 LOC semiconductor assembled with room temperature adhesive
11/13/2001	US6316822 Multichip assembly semiconductor
11/13/2001	US6316821 High density lead frames and methods for plastic injection molding
11/13/2001	US6316820 Passivation layer and process for semiconductor devices
11/13/2001	US6316816 Film resistor and method of producing same
11/13/2001	US6316814 Solid imaging device
11/13/2001	US6316811 Selective CVD TiSi2 deposition with TiSi2 liner
11/13/2001	US6316797 Scalable lead zirconium titanate(PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
11/13/2001	US6316794 Lateral high voltage semiconductor device with protective silicon nitride film in voltage withstanding region
11/13/2001	US6316790 Active matrix assembly with light blocking layer over channel region
11/13/2001	US6316735 Semiconductor chip mounting board and a semiconductor device using same board
11/13/2001	US6316734 Flexible circuits with static discharge protection and process for manufacture
11/13/2001	US6316732 Printed circuit boards with cavity and method of producing the same
11/13/2001	US6316727 Multi-chip semiconductor package
11/13/2001	US6316726 Surface mount electronic component having electrodes suppressing the occurrence of migration
11/13/2001	US6316717 Heat sink for microchip application
11/13/2001	US6316566 To protect from corrosion and mechanical damage
11/13/2001	US6316528 As underfilling sealing resin which enables a semiconductor device to be securely connected to circuit board
11/13/2001	US6316360 High aspect ratio metallization structures for shallow junction devices, and methods of forming the same
11/13/2001	US6316359 Interconnect structure in a semiconductor device and method of formation
11/13/2001	US6316356 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication
11/13/2001	US6316350 Post fuse slag etch
11/13/2001	US6316347 Air gap semiconductor structure and method of manufacture
11/13/2001	US6316346 Antifuse development using α-C:H,N,F thin films
11/13/2001	US6316334 Method of fabricating various-sized passivated integrated circuit chips from a borderless gate array
11/13/2001	US6316328 Fabrication method for semiconductor device utilizing parallel alignment slits
11/13/2001	US6316325 Method for fabricating a thin film resistor
11/13/2001	US6316292 Adhesion enhanced semiconductor die for mold compound packaging
11/13/2001	US6316291 Method of fabricating a non-laminate carrier substrate utilizing a mold
11/13/2001	US6316288 Semiconductor device and methods of manufacturing film camera tape
11/13/2001	US6316287 Chip scale surface mount packages for semiconductor device and process of fabricating the same
11/13/2001	US6316285 Passivation layer for packaged integrated circuits
11/13/2001	US6316278 Methods for fabricating a multiple modular assembly
11/13/2001	US6316167 Lithography structure with multilayer element
11/13/2001	US6316132 Two separately-formed titanium-nitride layers with impenetrable mismatched grain boundaries; integrated circuits; prevention of ?tungsten volcano?
11/13/2001	US6316116 Ceramic circuit board and method of manufacturing the same
11/13/2001	US6316100 Nickel powders, methods for producing powders and devices fabricated from same
11/13/2001	US6315936 Encapsulation method using non-homogeneous molding compound pellets
11/13/2001	US6315577 Electronic component with lead and lead terminal
11/13/2001	US6315185 Ball mount apparatus
11/13/2001	US6315038 Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
11/13/2001	US6315033 Heat dissipating conduit
11/13/2001	US6315032 Heat sink and method for making the same
11/13/2001	US6315031 Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus
11/13/2001	US6314639 Chip scale package with heat spreader and method of manufacture
11/08/2001	WO2001084886A1 Ceramic heater
11/08/2001	WO2001084641A1 Thermoelectric element
11/08/2001	WO2001084629A2 Detector for computer tomographs
11/08/2001	WO2001084627A2 Electronic devices with diffusion barrier and process for making same
11/08/2001	WO2001084626A1 Semiconductor device having a low dielectric film and fabrication process thereof
11/08/2001	WO2001084619A2 Method of depositing low stress films
11/08/2001	WO2001084581A2 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/08/2001	WO2001084068A1 Channel connection for pipe to block joints
11/08/2001	WO2001083607A1 Rheology-controlled epoxy-based compositions
11/08/2001	WO2001083604A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
11/08/2001	WO2001061757B1 Module and method for interconnecting integrated circuits that facilitate high speed signal propagation with reduced noise
11/08/2001	WO2001061746A9 Test structure for metal cmp process control

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