Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/15/2001WO2001009952A3 Interconnect assemblies and methods
11/15/2001US20010042238 Semiconductor apparatus including bypass capacitor having structure for making automatic design easy, and semiconductor apparatus layout method
11/15/2001US20010041439 Low temperature reflow method for filling high aspect ratio contacts
11/15/2001US20010041431 Semiconductor device with transparent link area for silicide applications and fabrication thereof
11/15/2001US20010041428 Apparatus for modeling IC substrate noise
11/15/2001US20010041425 Semiconductor wafer and method for manufacturing semiconductor devices
11/15/2001US20010041424 Semiconductor device and a method of manufacturing the same
11/15/2001US20010041393 Process of forming a thick oxide field effect transistor
11/15/2001US20010041390 Integrated device package and fabrication methods thereof
11/15/2001US20010041389 Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same
11/15/2001US20010041386 Method of manufacturing semiconductor devices and semiconductor devices made according to the method
11/15/2001US20010041385 Plated leadframes with cantilevered leads
11/15/2001US20010041384 Method of producing semiconductor device and configuration thereof, and lead frame used in said method
11/15/2001US20010041383 Center bond flip-chip semiconductor device and method of making it
11/15/2001US20010041382 Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures
11/15/2001US20010041378 Test photomask and method for invertigating esd-induced reticle defects
11/15/2001US20010041370 Semiconductor package with heat sink and method of fabrication
11/15/2001US20010041257 Ultrafine particle structure and production method thereof
11/15/2001US20010040795 Mounting bracket for integrated circuit device
11/15/2001US20010040793 Electronic device and method of producing the same
11/15/2001US20010040792 Multi-chip module having interconnect dies
11/15/2001US20010040791 Mounting structure and method of mounting semiconductor device
11/15/2001US20010040790 Radiator capable of considerably suppressing a high-frequency current flowing in an electric component
11/15/2001US20010040789 Portable electronic device capable of efficiently cooling heat-generation electronic component
11/15/2001US20010040664 Tape carrier package and display device using the same
11/15/2001US20010040301 Semiconductor device
11/15/2001US20010040300 Semiconductor package with heat dissipation opening
11/15/2001US20010040299 Flip chip adaptor package for bare die
11/15/2001US20010040297 Multiple line grid for use in a packaging of a testing application
11/15/2001US20010040295 Method for reducing stress-induced voids for 0.25 micron and smaller semiconductor chip technology by annealing interconnect lines prior to ild deposition and semiconductor chip made thereby
11/15/2001US20010040294 Porous dielectric material and electronic devices fabricated therewith
11/15/2001US20010040292 Semiconductor device having a contact plug formed by a dual epitaxial layer and method for fabricating the same
11/15/2001US20010040291 Method of manufacturing semiconductor device and method of manufacturing film carrier tape
11/15/2001US20010040290 Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device
11/15/2001US20010040289 Semiconductor device and the method for manufacturing the same
11/15/2001US20010040288 Packaged semiconductor device and manufacturing method thereof
11/15/2001US20010040287 Surface mount package including terminal on its side
11/15/2001US20010040286 Semiconductor device and method for the fabrication thereof
11/15/2001US20010040285 Semiconductor device and method of manufacturing same
11/15/2001US20010040284 Semiconductor device
11/15/2001US20010040282 Stackable ball grid array package
11/15/2001US20010040281 Multi-chip memory apparatus and associated method
11/15/2001US20010040280 Semiconductor apparatus and manufacturing method therefor
11/15/2001US20010040279 Apparatus and methods of packaging and testing die
11/15/2001US20010040278 Ultra high density integrated circuit BLP stack and method for fabricating the same
11/15/2001US20010040277 Symmetrical package for semiconductor die
11/15/2001US20010040276 Lead frame for a semiconductor device and method of manufacturing a semiconductor device
11/15/2001US20010040275 Radiation-hardened semoconductor device
11/15/2001US20010040274 Semiconductor device
11/15/2001US20010040272 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer
11/15/2001US20010040271 BEOL decoupling capacitor
11/15/2001US20010040270 Inductance device formed on semiconductor substrate
11/15/2001US20010040269 Method and apparatus for forming a junctionless antifuse
11/15/2001US20010040267 Semiconductor integrated circuit with an insulation structure having reduced permittivity
11/15/2001US20010040264 Method of forming a semiconductor device and an improved deposition system
11/15/2001US20010040261 Integrated circuit wiring and fabricating method thereof
11/15/2001US20010040243 Semiconductor device with a diode, and method of manufacturing such a device
11/15/2001US20010040242 Bed structure underlying electrode pad of semiconductor device and method for manufacturing same
11/15/2001US20010040239 Chip-type semiconductor light-emitting device
11/15/2001US20010040022 Bubble cycling heat exchanger
11/15/2001US20010040006 Substrate having an upper surface for carrying semiconductor chips and a semiconductor chip mounted on the upper surface of the substrate, a heatsink cap is covering the chip, applying silicone adhesive, securing the cap, curing adhesive adhesive
11/15/2001US20010039729 Method of aligning features in a multi-layer electrical connective device
11/15/2001US20010039724 Method and apparatus for mounting circuit elements on a printed wiring board
11/15/2001DE10122705A1 Device with functional component has insulating substrate with recess, wiring layer formed as pattern on substrate surface extending continuously from recess floor to substrate surface
11/15/2001DE10115207A1 Active semiconductor module with plastic frame
11/15/2001DE10053201A1 Aufschleuder-Glaszusammensetzung und Verfahren zur Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozeß unter Verwendung derselben Spin-on glass composition and method for producing a silicon oxide film in a semiconductor fabrication process using the same
11/15/2001DE10052191C1 Cooling assembly for electronic components includes spring clamps holding them against cooling plate and away from PCB connections
11/15/2001DE10021907A1 Fuel cell system has fuel cell stack with integrated polarity inversion protection diode on or in end plate with cooling device in end plate near diode and in thermal contact with diode
11/15/2001DE10021865A1 Electronic component with a semiconductor chip and optionally a test structure has adhesive regions contacting glass layer
11/15/2001DE10021859A1 Printed circuit board used in the semiconductor industry comprises a conductor layer containing a bond window with a conducting pathway
11/15/2001DE10021735A1 Semiconductor element and process for computer memories and logic circuits treats copper lines with tin or magnesium to reduce electromigration
11/15/2001DE10021595A1 Arrangement for choosing the configuration of an integrated semiconductor circuit applies programming signal to select required configuration
11/15/2001DE10021367A1 Detektor für Computertomographen Detector computed tomography
11/15/2001CA2308820A1 Wireless radio frequency technique design and method for testing of integrated circuits and wafers
11/14/2001EP1154482A2 Low inductance multilayer chip and method for fabricating same
11/14/2001EP1154481A2 Interposer and semiconductor device using it
11/14/2001EP1154480A2 Wiring board and semiconductor device including it
11/14/2001EP1154479A2 Multiple line grid for use in a packaging or a testing application
11/14/2001EP1154478A2 Sheet-like board member, lead frame, and manufacture of a semiconductor device
11/14/2001EP1154477A1 Contact pad of a semiconductor device
11/14/2001EP1154476A1 Substrate, semiconductor device, element-mounted device and preparation of substrate
11/14/2001EP1154475A1 Semiconductor device and semiconductor device manufacturing method
11/14/2001EP1154474A1 Semiconductor device and method of manufacture thereof
11/14/2001EP1154473A2 Sheet-like board member and method of manufacturing a semiconductor device
11/14/2001EP1154472A1 Process for fabrication of semiconductor devices having copper interconnects
11/14/2001EP1154471A1 Semiconductor chip and manufacture method thereof
11/14/2001EP1154470A2 Semiconductor unit packaging method
11/14/2001EP1154467A2 Bi-layer etch stop for inter-level via
11/14/2001EP1153985A1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
11/14/2001EP1153984A1 Resin composition, molded article therefrom, and utilization thereof
11/14/2001EP1153980A1 Epoxy resin composition
11/14/2001EP1153952A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element
11/14/2001EP1153503A1 Method and system for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system
11/14/2001EP1153433A1 High density electronic package
11/14/2001EP1153432A1 Method for the production of a chip-card type portable storage medium
11/14/2001EP1153431A1 Method and apparatus for cooling backside optically probed integrated circuits
11/14/2001EP1153430A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
11/14/2001EP1153429A2 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement
11/14/2001EP1153419A2 Multiple chip module with integrated rf capabilities
11/14/2001EP1076930A4 Surface acoustic wave device package and method
1 ... 1817 1818 1819 1820 1821 1822 1823 1824 1825 1826 1827 1828 1829 1830 1831 1832 1833 1834 1835 1836 1837 ... 2262