| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/21/2001 | CN1322977A Heat radiator |
| 11/21/2001 | CN1322863A Electroplating apparatus |
| 11/21/2001 | CN1075339C Electromagnetic interference suppressing body with low electromagnetic penetrability and reflectivity, and its electronic device |
| 11/21/2001 | CN1075244C Method for producing metal wire |
| 11/20/2001 | US6320780 Reduced impact from coupling noise in diagonal bitline architectures |
| 11/20/2001 | US6320757 Electronic package |
| 11/20/2001 | US6320754 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package |
| 11/20/2001 | US6320753 Integrated circuit board combining external contact zones and an antenna, and process for manufacturing such a board |
| 11/20/2001 | US6320748 Power heatsink for a circuit board |
| 11/20/2001 | US6320747 Method for manufacturing electric modules, and the electric module |
| 11/20/2001 | US6320739 Electronic part and manufacturing method therefor |
| 11/20/2001 | US6320397 Molded plastic carrier for testing semiconductor dice |
| 11/20/2001 | US6320396 Parasitic MIM structural spot analysis method for semiconductor device and parasitic MIM structure spot analysis method for silicon semiconductor device |
| 11/20/2001 | US6320270 Semiconductor device and method of producing the same |
| 11/20/2001 | US6320268 Power semiconductor module |
| 11/20/2001 | US6320267 Bonding layer in a semiconductor device |
| 11/20/2001 | US6320264 Interconnect wiring with sidewalls and inter-wiring insulation composed of fluorine |
| 11/20/2001 | US6320263 Semiconductor metalization barrier and manufacturing method therefor |
| 11/20/2001 | US6320262 Semiconductor device and manufacturing method thereof |
| 11/20/2001 | US6320261 High aspect ratio metallization structures for shallow junction devices, and methods of forming the same |
| 11/20/2001 | US6320259 Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor device |
| 11/20/2001 | US6320258 Semiconductor device having alternating electrically insulative coated leads |
| 11/20/2001 | US6320257 Chip packaging technique |
| 11/20/2001 | US6320255 Rerouted semiconductor device and method of fabrication |
| 11/20/2001 | US6320254 Plug structure |
| 11/20/2001 | US6320253 Semiconductor device comprising a socket and method for forming same |
| 11/20/2001 | US6320252 Pc |
| 11/20/2001 | US6320251 Stackable package for an integrated circuit |
| 11/20/2001 | US6320250 Semiconductor package and process for manufacturing the same |
| 11/20/2001 | US6320249 Multiple line grids incorporating therein circuit elements |
| 11/20/2001 | US6320248 Lead frame and method of fabricating semiconductor device including the lead frame |
| 11/20/2001 | US6320247 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals |
| 11/20/2001 | US6320245 Radiation-hardened semiconductor device |
| 11/20/2001 | US6320243 Defect removable semiconductor devices and manufacturing methods thereof |
| 11/20/2001 | US6320242 Semiconductor device having trimmable fuses and position alignment marker formed of thin film |
| 11/20/2001 | US6320241 Circuitry and method of forming the same |
| 11/20/2001 | US6320240 Semiconductor device and method of manufacturing the same |
| 11/20/2001 | US6320232 Integrated semiconductor circuit with protective structure for protection against electrostatic discharge |
| 11/20/2001 | US6320231 Semiconductor device for protecting a semiconductor chip from damage due to electrostatic discharge |
| 11/20/2001 | US6320229 Semiconductor device |
| 11/20/2001 | US6320225 SOI CMOS body contact through gate, self-aligned to source- drain diffusions |
| 11/20/2001 | US6320224 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor |
| 11/20/2001 | US6320201 Semiconductor reliability test chip |
| 11/20/2001 | US6320200 Sub-nanoscale electronic devices and processes |
| 11/20/2001 | US6320138 Wiring substrate; for use in reduction in resistance and the occurrence of deformations in thin film |
| 11/20/2001 | US6320137 Flexible circuit with coverplate layer and overlapping protective layer |
| 11/20/2001 | US6320135 Flexible wiring substrate and its manufacturing method |
| 11/20/2001 | US6320128 Environmentally-sealed electronic assembly and method of making same |
| 11/20/2001 | US6320126 Vertical ball grid array integrated circuit package |
| 11/20/2001 | US6319859 Borderless vias with HSQ gap filled metal patterns having high etching resistance |
| 11/20/2001 | US6319849 Semiconductor device and a process for forming a protective insulating layer thereof |
| 11/20/2001 | US6319833 Forming a copper (cu) or cu alloy interconnection pattern comprising a dense array of spaced apart cu or cu alloy lines bordering open dielectric field on surface of wafer; spraying the wafer with a chemical agent to remove dielectric material |
| 11/20/2001 | US6319830 Process of fabricating semiconductor device |
| 11/20/2001 | US6319829 Enhanced interconnection to ceramic substrates |
| 11/20/2001 | US6319828 Method for manufacturing a chip scale package having copper traces selectively plated with gold |
| 11/20/2001 | US6319827 Integrated electronic micromodule and method for making same |
| 11/20/2001 | US6319825 Metallization process of semiconductor device |
| 11/20/2001 | US6319820 Fabrication method for dual damascene structure |
| 11/20/2001 | US6319818 Pattern factor checkerboard for planarization |
| 11/20/2001 | US6319817 Method of forming viahole |
| 11/20/2001 | US6319814 Method of fabricating dual damascene |
| 11/20/2001 | US6319806 Integrated circuit wiring and fabricating method thereof |
| 11/20/2001 | US6319797 Process for manufacturing a semiconductor device |
| 11/20/2001 | US6319792 Providing first and second chip regions on silicon wafer, wherein first resist pattern for semiconductor device is to be formed in first chip region, and second chip region includes a plurality of evaluation regions, determining data rate |
| 11/20/2001 | US6319791 Semiconductor device manufacturing method and semiconductor device |
| 11/20/2001 | US6319768 Method for fabricating capacitor in dram cell |
| 11/20/2001 | US6319766 Method of tantalum nitride deposition by tantalum oxide densification |
| 11/20/2001 | US6319758 Redundancy structure in self-aligned contact process |
| 11/20/2001 | US6319757 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates |
| 11/20/2001 | US6319756 Heat sink for chip stacking applications |
| 11/20/2001 | US6319755 Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe |
| 11/20/2001 | US6319753 Semiconductor device having lead terminals bent in J-shape |
| 11/20/2001 | US6319752 Single-layer autorouter |
| 11/20/2001 | US6319750 Layout method for thin and fine ball grid array package substrate with plating bus |
| 11/20/2001 | US6319749 Lead frame, semiconductor package having the same and method for manufacturing the same |
| 11/20/2001 | US6319740 Multilayer protective coating for integrated circuits and multichip modules and method of applying same |
| 11/20/2001 | US6319728 Decreasing chemical resistance of copper on surface; deposit copper containing moisture upon substrate, plasma treat copper and monitor chemical resistance |
| 11/20/2001 | US6319638 Semiconductor device manufacturing method of accurately performing alignment of patterning, mask for exposure |
| 11/20/2001 | US6319619 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 11/20/2001 | US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks |
| 11/20/2001 | US6319450 Encapsulated circuit using vented mold |
| 11/20/2001 | US6319387 Copper alloy electroplating bath for microelectronic applications |
| 11/20/2001 | US6319019 Selectively reinforced flexible tape carrier packages for liquid crystal display modules |
| 11/20/2001 | US6318452 Clip for heat sink |
| 11/20/2001 | US6318451 Heat sink for integrated circuit |
| 11/20/2001 | US6318091 Cryopump system with modular electronics |
| 11/20/2001 | US6317948 Embedded thin film passive components |
| 11/15/2001 | WO2001087032A1 Electronic power module |
| 11/15/2001 | WO2001087023A1 Multilayer circuit board and method of producing the same |
| 11/15/2001 | WO2001086774A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways |
| 11/15/2001 | WO2001086722A2 Semiconductor component |
| 11/15/2001 | WO2001086721A2 A semiconductor device including an integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals |
| 11/15/2001 | WO2001086720A1 Contact connector for a semiconductor component |
| 11/15/2001 | WO2001086719A1 Thin layer chip insulation for conductive polymer connection |
| 11/15/2001 | WO2001086718A2 Semiconductor device with fuses and method of manufacturing same |
| 11/15/2001 | WO2001086716A1 Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
| 11/15/2001 | WO2001086706A1 Method for substrate noise distribution |
| 11/15/2001 | WO2001086221A1 Microstructured heat exchanger and method for producing the same |
| 11/15/2001 | WO2001085848A1 Polymer composition containing clean filler incorporated therein |
| 11/15/2001 | WO2001085377A1 Production method of radiators |