H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/22/2001	US20010044225 Method for forming microelectronic spring structures on a substrate
11/22/2001	US20010044204 Method for making semiconductor devices having gradual slope contacts
11/22/2001	US20010044203 Surface treatment of low-k siof to prevent metal interaction
11/22/2001	US20010044201 Semiconductor device having a multilayer interconnection structure
11/22/2001	US20010044199 Semiconductor device and manufacture thereof
11/22/2001	US20010044198 Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same
11/22/2001	US20010044197 Wafer-scale assemby of chip-size packages
11/22/2001	US20010044194 Bonded substrate structures and method for fabricating bonded substrate structures
11/22/2001	US20010044169 Lead frame for semiconductor devices, a semiconductor device made using the lead frame, and a method of manufacturing a semiconductor device
11/22/2001	US20010044168 Protective element
11/22/2001	US20010044167 Power semiconductor package and method for making the same
11/22/2001	US20010044162 Method and apparatus for fabricating electronic device
11/22/2001	US20010044058 For patterns formed by lithography or etching to manufacturing semiconductor or optical devices.
11/22/2001	US20010043487 Semiconductor memory device
11/22/2001	US20010043461 Cooling mechanism, heat sink, electronic equipment and fablication method therefor
11/22/2001	US20010043197 Electronic apparatus
11/22/2001	US20010043136 Lateral high-Q inductor for semiconductor devices
11/22/2001	US20010043127 Microstrip line-waveguide converter structure, integrated circuit package for high frequency signals provided with this converter structure, and manufacturing method therefor
11/22/2001	US20010042924 Semiconductor package
11/22/2001	US20010042923 Semiconductor apparatus and process of production thereof
11/22/2001	US20010042922 Trench interconnect formed in polyimide film using chemical vapor deposition and sputtering techniques; increased interlayer connection resistance
11/22/2001	US20010042921 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
11/22/2001	US20010042920 Semiconductor device
11/22/2001	US20010042919 Semiconductor device and manufacturing method thereof
11/22/2001	US20010042918 Semiconductor device and method of fabricating the same
11/22/2001	US20010042917 Semiconductor interconnect barrier and manufacturing method thereof
11/22/2001	US20010042916 Semiconductor device and method of manufacturing the same
11/22/2001	US20010042915 Packages having flash-proof structure and method for manufacturing the same
11/22/2001	US20010042914 Grid array package with reduced power and ground impedance under high frequency
11/22/2001	US20010042913 Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system
11/22/2001	US20010042912 Dual-die integrated circuit package
11/22/2001	US20010042911 Semiconductor device and semiconductor assembly apparatus for semiconductor device
11/22/2001	US20010042910 Vertical ball grid array integrated circuit package
11/22/2001	US20010042908 Semiconductor device and manufacturing method of semiconductor device
11/22/2001	US20010042906 Semiconductor device and process for producing the same
11/22/2001	US20010042904 Frame for semiconductor package
11/22/2001	US20010042903 Inter-metal dielectric layer structure and its forming method
11/22/2001	US20010042902 Semiconductor device and method of manufacturing the same
11/22/2001	US20010042901 Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package
11/22/2001	US20010042898 Electronic device and method for manufacturing the same
11/22/2001	US20010042897 Copper fuse for integrated circuit
11/22/2001	US20010042892 Semiconductor device having an improved interlayer contact and manufacturing method thereof
11/22/2001	US20010042887 Integrated circuit devices that use antiparallel diodes to reduce damage during plasma processing
11/22/2001	US20010042868 Conductive material for integrated circuit fabrication
11/22/2001	US20010042867 Monolithic compound semiconductor integrated circuit and method of forming the same
11/22/2001	US20010042863 Semiconductor device and manufacturing method thereof
11/22/2001	US20010042858 Backside light emitting chip type light emitting element and insulating substrate therefor
11/22/2001	US20010042854 Electroconductive composition and printed circuit board using the same
11/22/2001	US20010042853 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays
11/22/2001	US20010042640 Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
11/22/2001	US20010042639 Semiconductor element-mounting board and semiconductor device
11/22/2001	US20010042638 Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device
11/22/2001	US20010042615 Notched finned heat sink structure
11/22/2001	US20010042592 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
11/22/2001	US20010042378 Controlled production of ammonia
11/22/2001	US20010042304 Thin-film structure having reliably removable oxide layer formed on bump exposed at surface of insulating layer and manufacturing method therefor
11/22/2001	DE10123514A1 Semiconductor memory component, such as multiport SRAM cell with two word lines and CMOS structure
11/22/2001	DE10122666A1 Light emitting element of rear side light emitting chip type
11/22/2001	DE10111998A1 Schaltungsmodul Circuit module
11/22/2001	DE10050488A1 Substrate assembly strip for semiconductor casing carrier
11/22/2001	DE10024336A1 Component arrangement on bearer substrate has two barrier layers of identical material joined in contact region with ratio of barrier height and width between 0.5 and one
11/22/2001	DE10023736A1 Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte Printed circuit board and method of manufacturing a printed circuit board
11/22/2001	DE10022972A1 Micro heat exchanger has a number of parallel metal hollow fiber tubes shrouded by a graphite matrix body for a high heat exchange in a simple unit
11/22/2001	DE10009899A1 Integrated active semiconductor component cooling element has coupling coating between cooling element and semiconducting chip consisting of one or more layers of metallisation
11/22/2001	CA2342409A1 Packaging micromechanical devices
11/21/2001	EP1156711A1 Potting or moulding material with electromagnetic properties for building electronic component
11/21/2001	EP1156708A2 Circuit board and method for manufacturing a circuit board
11/21/2001	EP1156705A1 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
11/21/2001	EP1156533A1 Peripheral structure for a vertical component
11/21/2001	EP1156531A1 Method for recycled separated wafer and recycled separated wafer
11/21/2001	EP1156528A1 Electric connection structure for electronic power devices and method of connection
11/21/2001	EP1156527A2 Protective fuse element
11/21/2001	EP1156526A2 Heat sink having bonded cooling fins
11/21/2001	EP1156525A1 Multilayer circuit board and semiconductor device
11/21/2001	EP1156521A2 Low cost electroless plating process for single chips and wafer parts and products obtained thereof
11/21/2001	EP1156517A1 Method for forming tungsten silicide film and method for fabricating metal-insulator-semiconductor transistor
11/21/2001	EP1156134A2 Method and apparatus of depositing a layer of nitrogen-doped fluorinated silicate glass
11/21/2001	EP1156133A2 Method of manufacturing a multilayered dielectric film and semiconductor device
11/21/2001	EP1155452A1 Semiconductor device comprising a security coating and smartcard provided with such a device
11/21/2001	EP1155451A1 An integrated circuit with a serpentine conductor track for circuit selection
11/21/2001	EP1155450A1 Functionally symmetric integrated circuit die
11/21/2001	EP1155449A1 Semiconductor component with a chip carrier with openings for contacting
11/21/2001	EP1155448A1 Leadless chip carrier design and structure
11/21/2001	EP0926196B1 Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices
11/21/2001	EP0864175B1 Novel metallization sidewall passivation technology for deep sub-half micrometer ic applications
11/21/2001	EP0774163B1 Reduced leakage antifuse structure and fabrication method
11/21/2001	EP0723704B1 Layout for radio frequency power transistors
11/21/2001	CN2461240Y Stacked structure of integrated circuit
11/21/2001	CN2461239Y Stacking device of integrated circuit
11/21/2001	CN2461238Y Stacked integrated circuit device
11/21/2001	CN2461148Y Latent heat-sink device
11/21/2001	CN2461147Y Buffer heat-sink device
11/21/2001	CN2461146Y Semi-conductor triode
11/21/2001	CN1323506A Fabrication process for flex circuit application
11/21/2001	CN1323505A Article having an embedded electronic device, and method of making same
11/21/2001	CN1323449A Semiconductor device and method of manufacture thereof
11/21/2001	CN1323448A Integrated circuit chip made secure against the action of electromagnetic radiation
11/21/2001	CN1323065A Method for producing plate shape body, lead wire frame and semiconductor device
11/21/2001	CN1323064A Method for producing plate shape body and semiconductor device
11/21/2001	CN1323060A Packed metal structure of semi-conductor device and capacitor including the same structure

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