Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/28/2001CN1323671A Method for prepn. of metal powder
11/28/2001CN1075658C Membrane forming material and circuit layout forming method
11/27/2001US6324073 Clamping arrangement for compression-mounted power electronic devices
11/27/2001US6324069 Chip package with molded underfill
11/27/2001US6324068 Electronic component device, and main board for circuit boards
11/27/2001US6324061 Heat sink
11/27/2001US6324060 Heat transfer interface
11/27/2001US6324059 Apparatus and method for improving heat sink component capacity and efficiency
11/27/2001US6324058 Heat-dissipating apparatus for an integrated circuit device
11/27/2001US6323931 LCD with external circuit having anti-short-circuit pattern and particular structure
11/27/2001US6323930 Liquid crystal display device, production method thereof and mobile telephone
11/27/2001US6323891 Imaging apparatus with thermal discharger for transferring heat to cool photoelectric transfer elements
11/27/2001US6323735 Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
11/27/2001US6323642 Detector for determining rotational speed and position for an internal combustion engine
11/27/2001US6323599 Vertical spark gap for microelectric circuits
11/27/2001US6323559 Hexagonal arrangements of bump pads in flip-chip integrated circuits
11/27/2001US6323558 Method for fabricating a contact of a semiconductor device
11/27/2001US6323556 Interconnect structure of semiconductor device
11/27/2001US6323555 Metallization structure on a fluorine-containing dielectric and a method for fabrication thereof
11/27/2001US6323554 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
11/27/2001US6323552 Semiconductor device having bumps
11/27/2001US6323551 Resin sealed-type semiconductor device and method of manufacturing the same
11/27/2001US6323549 Ceramic composite wiring structures for semiconductor devices and method of manufacture
11/27/2001US6323548 Semiconductor integrated circuit device
11/27/2001US6323547 Pressure contact type semiconductor device with ringshaped gate terminal
11/27/2001US6323546 Direct contact through hole type wafer structure
11/27/2001US6323545 Semiconductor device
11/27/2001US6323544 Plated leadframes with cantilevered leads
11/27/2001US6323543 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
11/27/2001US6323542 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
11/27/2001US6323541 Structure for manufacturing a semiconductor die with copper plated tapes
11/27/2001US6323536 Method and apparatus for forming a junctionless antifuse
11/27/2001US6323535 Electrical fuses employing reverse biasing to enhance programming
11/27/2001US6323534 Fuse for use in a semiconductor device
11/27/2001US6323531 Two-chip power IC having an improved short-circuit response
11/27/2001US6323529 Semiconductor acceleration sensor and a method of manufacturing the same
11/27/2001US6323526 Semiconductor integrated circuit
11/27/2001US6323522 Silicon on insulator thick oxide structure and process of manufacture
11/27/2001US6323518 Insulated gate type semiconductor device and method of manufacturing thereof
11/27/2001US6323438 Printed circuit board and semiconductor device using the same
11/27/2001US6323436 High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
11/27/2001US6323435 Low-impedance high-density deposited-on-laminate structures having reduced stress
11/27/2001US6323434 Circuit board and production method thereof
11/27/2001US6323432 Manufacture of dendrites and their use
11/27/2001US6323185 Anti-viral guanosine-rich oligonucleotides and method of treating HIV
11/27/2001US6323131 Passivated copper surfaces
11/27/2001US6323126 Tungsten formation process
11/27/2001US6323125 Simplified dual damascene process utilizing PPMSO as an insulator layer
11/27/2001US6323122 Structure for a multi-layered dielectric layer and manufacturing method thereof
11/27/2001US6323120 Method of forming a wiring film
11/27/2001US6323119 CVD deposition method to improve adhesion of F-containing dielectric metal lines for VLSI application
11/27/2001US6323117 Grooved wiring structure in semiconductor device and method for forming the same
11/27/2001US6323116 Differential pair geometry for integrated circuit chip packages
11/27/2001US6323113 Intelligent gate-level fill methods for reducing global pattern density effects
11/27/2001US6323111 Preweakened on chip metal fuse using dielectric trenches for barrier layer isolation
11/27/2001US6323097 Electrical overlay/spacing monitor method using a ladder resistor
11/27/2001US6323096 Method for fabricating a flexible interconnect film with resistor and capacitor layers
11/27/2001US6323087 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
11/27/2001US6323081 Diffusion barrier layers and methods of forming same
11/27/2001US6323076 Integrated circuit having temporary conductive path structure and method for forming the same
11/27/2001US6323067 Light absorption layer for laser blown fuses
11/27/2001US6323066 Heat-dissipating structure for integrated circuit package
11/27/2001US6323065 Methods for manufacturing ball grid array assembly semiconductor packages
11/27/2001US6323064 Method for fabricating a memory card
11/27/2001US6323062 Wafer coating method for flip chips
11/27/2001US6323061 Method for manufacturing a semiconductor device
11/27/2001US6323060 Stackable flex circuit IC package and method of making same
11/27/2001US6323059 Method of fabricating a semiconductor device
11/27/2001US6323058 Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
11/27/2001US6323048 Integrated circuit probe pad metal level
11/27/2001US6323047 Method for monitoring second gate over-etch in a semiconductor device
11/27/2001US6323045 Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process
11/27/2001US6322903 Package of integrated circuits and vertical integration
11/27/2001US6322713 Nanoscale conductive connectors and method for making same
11/27/2001US6322384 Electrical socket apparatus
11/27/2001US6322383 Socket for IC device
11/27/2001US6321994 Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component
11/27/2001US6321831 Cooling apparatus using boiling and condensing refrigerant
11/27/2001US6321739 Film frame substrate fixture
11/27/2001US6321734 Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same
11/27/2001US6321452 Method for manufacturing the heat pipe integrated into the heat sink
11/27/2001US6321451 Method for making a heat sink
11/27/2001US6321443 Connection substrate
11/27/2001CA2201083C Hollow package manufacturing method and apparatus
11/27/2001CA2171458C Multi-chip module
11/22/2001WO2001089006A1 Encapsulated microelectronic devices
11/22/2001WO2001088983A2 Power semiconductor module
11/22/2001WO2001088982A2 Housing device and contact element used therein
11/22/2001WO2001088981A1 Planarised semiconductor structure including a conductive fuse and process for fabrication thereof
11/22/2001WO2001088979A2 Semi-conductor component and method for the production thereof
11/22/2001WO2001088978A1 Component assembly and method for producing the same
11/22/2001WO2001088976A2 Wireless radio frequency testing methode of integrated circuits and wafers
11/22/2001WO2001088975A2 Method for producing a component
11/22/2001WO2001088956A2 Rf integrated circuit layout
11/22/2001WO2001088612A1 Photolithographically-patterned out-of-plane coil structures and method of making
11/22/2001WO2001088041A1 Moisture absorbing formed article
11/22/2001WO2001087529A1 Method for producing a structural member from plates stacked on top of each other and soldered together
11/22/2001WO2001087521A2 High conductivity copper/refractory metal composites and method for making same
11/22/2001US20010044925 Circuit design method for designing conductive members with a multilayered structure to have antenna sized of proper values
11/22/2001US20010044669 System and method to reduce bond program errors of integrated circuit bonders
1 ... 1814 1815 1816 1817 1818 1819 1820 1821 1822 1823 1824 1825 1826 1827 1828 1829 1830 1831 1832 1833 1834 ... 2262