H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2001
11/29/2001	US20010045663 Semiconductor circuit device and method for manufacturing thereof
11/29/2001	US20010045662 Semiconductor device and method for manufacturing the same
11/29/2001	US20010045661 Composite metallization process for filling high aspect ratio contact holes
11/29/2001	US20010045660 Semiconductor device and process for forming amorphous titanium silicon nitride on substrate
11/29/2001	US20010045659 Conductive implant structure in a dielectric
11/29/2001	US20010045658 Method and structure for reducing contact aspect ratios
11/29/2001	US20010045656 Multilayer wiring structure for semiconductor device
11/29/2001	US20010045655 Semiconductor device and manufacturing method thereof
11/29/2001	US20010045654 Utilization of energy absorbing layer to improve metal flow and fill in a novel interconnect structure
11/29/2001	US20010045653 Apparatus and method for metal layer streched conducting plugs
11/29/2001	US20010045652 Semiconductor device and manufacturing method thereof
11/29/2001	US20010045651 Semiconductor integrated circuit device and a method of manufacturing the same
11/29/2001	US20010045650 Local interconnect structure for integrated circuit devices, source structure for the same, and method for fabricating the same
11/29/2001	US20010045649 Semiconductor device
11/29/2001	US20010045648 Method and system for decreasing the spaces between wordlines
11/29/2001	US20010045647 Method of producing a wavelength-converting casting composition
11/29/2001	US20010045646 Silicon oxynitride arc for metal patterning
11/29/2001	US20010045645 Multichip semiconductor device and memory card
11/29/2001	US20010045644 Semiconductor package having heat sink at the outer surface
11/29/2001	US20010045643 Semiconductor device keeping structural integrity under heat-generated stress
11/29/2001	US20010045642 Die-to-insert permanent connection and method of forming
11/29/2001	US20010045641 Device for packaging electronic components
11/29/2001	US20010045640 Resin-molded semiconductor device and method for manufacturing the same
11/29/2001	US20010045639 Power wiring structure and semiconductor device
11/29/2001	US20010045638 Method of producing semiconductor device and configuration thereof, and lead frame used in said method
11/29/2001	US20010045637 Method and apparatus for injection molded flip chip encapsulation
11/29/2001	US20010045636 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
11/29/2001	US20010045635 Vertical conduction flip-chip device with bump contacts on single surface
11/29/2001	US20010045634 Semiconductor package
11/29/2001	US20010045633 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
11/29/2001	US20010045632 Semiconductor chip package and fabrication method therefor
11/29/2001	US20010045631 Interdigitated capacitor design for integrated circuit lead frames
11/29/2001	US20010045630 Frame for semiconductor package
11/29/2001	US20010045629 Leads under chip in conventional IC package
11/29/2001	US20010045628 Frame for semiconductor package
11/29/2001	US20010045627 Semiconductor device package with plural pad lead frame
11/29/2001	US20010045626 Integrated circuit package
11/29/2001	US20010045625 Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof
11/29/2001	US20010045623 Semiconductor device and method for fabricating the same
11/29/2001	US20010045622 Semiconductor integrated circuit having functional macro with improved power line connection structure
11/29/2001	US20010045611 Via plug adapter
11/29/2001	US20010045593 Integrated circuit provided with a substrate and with a memory, transponder, and method of programming a memory
11/29/2001	US20010045583 Semiconductor memory device capable of performing stable operation for noise while preventing increase in chip area
11/29/2001	US20010045571 Cell architecture with local interconnect and method for making same
11/29/2001	US20010045531 Photocoupling device and method of manufacturing the same
11/29/2001	US20010045524 Process for precise arrangement of micro-bodies
11/29/2001	US20010045417 Implementation of laser technology
11/29/2001	US20010045297 Molding of electrical devices with a thermally conductive and electrically insulative polymer composition
11/29/2001	US20010045276 Heat transfer apparatus with zigzag passage
11/29/2001	US20010045271 Bubble cycling heat exchanger
11/29/2001	US20010045270 High-performance heat sink for electronics cooling
11/29/2001	US20010045012 Angled flying lead wire bonding process
11/29/2001	US20010045011 Method of positioning a conductive element in a laminated electrical device
11/29/2001	US20010044999 Method for sealing and/or joining an end of a ceramic filter
11/29/2001	EP1144523A3 Preparations containing fine-particulate inorganic oxides
11/29/2001	DE10125750A1 Halbleiterschaltungsanordnung und Verfahren zu deren Herstellung A semiconductor circuit arrangement, and processes for their preparation
11/29/2001	DE10120641A1 Ceramic used in the production of a high frequency printed circuit board comprises crystal phases and an amorphous phase
11/29/2001	DE10026351A1 Elektronische Baugruppe Electronic assembly
11/29/2001	DE10026348A1 Vorrichtung zum Andrücken eines Wärmeleitkörpers Apparatus for pressing a thermal conductor
11/29/2001	DE10025835A1 Micropoint marking shape is formed with laser beam; micropoint marking is formed at each individual wafer illumination point; marker has protrusion from surface of wafer in central section
11/29/2001	DE10025289A1 Inductances have windings that windings that are not wound but produced e.g. by diffusion or implantation then divided, mounted around ferromagnetic circuit and recombined
11/29/2001	DE10024516A1 Leistungshalbleitermodul The power semiconductor module
11/29/2001	DE10024377A1 Gehäuseeinrichtung und darin zu verwendendes Kontaktelement Housing means and to be used in contact element
11/29/2001	DE10024111A1 Verfahren zur Herstellung eines Bauelements aus übereinander gestapelten miteinander verlöteten Platten A method for producing a component of stacked plates soldered together
11/29/2001	DE10023539A1 Verfahren zum Herstellen eines Bauteils A method for manufacturing a component
11/29/2001	DE10022384A1 Production of a power diode used in a semiconductor component comprises carrying out the steps of forming the carbon-hydrogen layer and etching the carbon-hydrogen layer in the same apparatus
11/29/2001	DE10022268A1 Halbleiterbauelement Semiconductor device
11/29/2001	DE10022267A1 Semiconducting component has lead frame to which first semiconducting body is attached and raised part on lead frame to which second semiconducting body is attached
11/29/2001	CA2409376A1 Active cooling system for cpu and semiconductors
11/28/2001	EP1158844A2 Laminated ceramic electronic component, production method therefor, and electronic device
11/28/2001	EP1158656A1 Electronic power device
11/28/2001	EP1158579A1 Wire bonding capillary for forming bump electrodes
11/28/2001	EP1158578A1 Bump electrode on an integrated circuit and manufacturing method thereof
11/28/2001	EP1158577A2 Method for forming an insulating film with low dielectric constant
11/28/2001	EP1158575A2 Method for fabricating a semiconductor device including a step of etching an organic film to form a pattern
11/28/2001	EP1158573A1 Method and apparatus for forming interconnection
11/28/2001	EP1158570A1 Vertical interconnect process for silicon segments
11/28/2001	EP1158389A2 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
11/28/2001	EP1158340A2 High-frequency circuit and its module for communication devices
11/28/2001	EP1158302A2 Method and apparatus for probing a conductor of an array of closely-spaced conductors
11/28/2001	EP1158073A1 Plating method, wiring forming method and devices therefor
11/28/2001	EP1157967A2 Packaging micromechanical devices
11/28/2001	EP1157441A1 Housing for an electronic apparatus in microwave technology
11/28/2001	EP1157422A1 Intelligent gate-level fill methods for reducing global pattern density effects
11/28/2001	EP1157420A1 Light extractor apparatus
11/28/2001	EP1157059A1 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
11/28/2001	CN2462641Y Improved fitting structure of radiating fin
11/28/2001	CN2462545Y Large power thyristor modular
11/28/2001	CN2462544Y Sandwich radiating module
11/28/2001	CN2462543Y Thin-wing type radiating fin
11/28/2001	CN2462542Y Radiating appliance
11/28/2001	CN2462541Y Radiator with group connector
11/28/2001	CN2462540Y Plastic packed electronic component (element)
11/28/2001	CN2462468Y Radiator clasping device
11/28/2001	CN1324558A Electrical component and electrical circuit module having connected ground planes
11/28/2001	CN1324208A Combination circuit plate and its mfg. method
11/28/2001	CN1324109A Improved integrated circuit structure
11/28/2001	CN1324108A Multiple line grid for application of packaging or testing
11/28/2001	CN1324086A Protection element
11/28/2001	CN1323672A System and method for reducing welding program error for IC welding machine

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