H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2001
12/04/2001	US6327148 Heatsink for actively cooled daughterboard system
12/04/2001	US6327145 Heat sink with integrated fluid circulation pump
12/04/2001	US6327128 Automotive bridge rectifier assembly with thermal protection
12/04/2001	US6326936 Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means
12/04/2001	US6326701 Chip size package and manufacturing method thereof
12/04/2001	US6326700 Low profile semiconductor package and process for making the same
12/04/2001	US6326699 Semiconductor device
12/04/2001	US6326698 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices
12/04/2001	US6326697 Hermetically sealed chip scale packages formed by wafer level fabrication and assembly
12/04/2001	US6326696 Electronic package with interconnected chips
12/04/2001	US6326695 Twisted bit line structures and method for making same
12/04/2001	US6326693 Semiconductor integrated circuit device
12/04/2001	US6326690 Method of titanium/titanium nitride integration
12/04/2001	US6326689 Backside contact for touchchip
12/04/2001	US6326687 IC package with dual heat spreaders
12/04/2001	US6326686 Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packages
12/04/2001	US6326683 Carrier element for a semiconductor chip
12/04/2001	US6326681 Semiconductor device
12/04/2001	US6326679 Low cost heat sink for packaged semiconductor device
12/04/2001	US6326678 Molded plastic package with heat sink and enhanced electrical performance
12/04/2001	US6326675 Semiconductor device with transparent link area for silicide applications and fabrication thereof
12/04/2001	US6326673 Method and structure of manufacturing a high-Q inductor with an air trench
12/04/2001	US6326610 Optical sensor including temperature control
12/04/2001	US6326561 Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer
12/04/2001	US6326544 Polymer based circuit
12/04/2001	US6326312 Contact hole of semiconductor and its forming method
12/04/2001	US6326309 Semiconductor device manufacturing method
12/04/2001	US6326303 Copper electroless deposition on a titanium-containing surface
12/04/2001	US6326299 Method for manufacturing a semiconductor device
12/04/2001	US6326298 Substantially planar semiconductor topography using dielectrics and chemical mechanical polish
12/04/2001	US6326287 Semiconductor device and method of fabricating the same
12/04/2001	US6326278 Method of protecting an alignment mark when manufacturing a semiconductor device
12/04/2001	US6326245 Method and apparatus for fabricating electronic device
12/04/2001	US6326244 Method of making a cavity ball grid array apparatus
12/04/2001	US6326243 Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
12/04/2001	US6326242 Semiconductor package with heat sink and method of fabrication
12/04/2001	US6326240 Apparatus for packaging semiconductor device and method for packaging the same
12/04/2001	US6326239 Mounting structure of electronic parts and mounting method of electronic parts
12/04/2001	US6326238 Die paddle clamping method for wire bond enhancement
12/04/2001	US6326237 Reworkable thermoplastic hyper-branched encapsulant
12/04/2001	US6326235 Long wire IC package fabrication method
12/04/2001	US6326234 Semiconductor device and method for manufacturing the same
12/04/2001	US6326233 Semiconductor device, method of fabricating the same and electronic apparatus
12/04/2001	US6326232 Method of fabricating semiconductor device
12/04/2001	US6325655 Electrical connector for a PGA package
12/04/2001	US6325638 Electrical assembly for coupling two circuit members
12/04/2001	US6325606 Apparatus for filling a gap between spaced layers of a semiconductor
12/04/2001	US6325421 Authenticity attribute
12/04/2001	US6325275 Bondhead lead clamp apparatus and method
12/04/2001	US6324756 Method and system for sealing the edge of a PBGA package
12/04/2001	US6324754 Method for fabricating microelectronic assemblies
12/01/2001	CA2315660A1 Heat sink element for direct attach chip mounting
11/2001
11/29/2001	WO2001091526A1 A method of providing a bias voltage at radio frequencies
11/29/2001	WO2001091184A2 Semiconductor component comprising a surface metallization
11/29/2001	WO2001091183A1 Solder bar for high power flip chips
11/29/2001	WO2001091182A1 Environmentally-sealed electronic assembly and method of making same
11/29/2001	WO2001091175A1 Method and device for bleed out control in solder bonding
11/29/2001	WO2001091173A1 Stackable flex circuit chip package and method of making same
11/29/2001	WO2001091144A1 Structure and method for fabrication of an improved capacitor
11/29/2001	WO2001090867A1 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
11/29/2001	WO2001090866A2 Active cooling system for cpu and semiconductors
11/29/2001	WO2001090710A1 Thermocouple passing through encapsulant of integrated circuit
11/29/2001	WO2001090242A1 Red phosphorus-base flame retardant for epoxy resins, red phosphorus-base flame retardant compositions therefor, processes for the production of both, epoxy resin compositions for sealing semiconductor devices, sealants and semiconductor devices
11/29/2001	WO2001089827A1 High dielectric constant nano-structure polymer-ceramic composite
11/29/2001	WO2001089753A1 Improved apparatus and method for dispensing solder
11/29/2001	WO2001089745A1 Porous heat sink for forced convective flow and method of making therefore
11/29/2001	WO2001024259A3 Semiconductor packaging
11/29/2001	WO2000020519A3 Preparations containing fine-particulate inorganic oxides
11/29/2001	US20010046796 Substrate having pins
11/29/2001	US20010046789 Semiconductor device and method for manufacturing the same
11/29/2001	US20010046786 High-temperature high-pressure processing method for semiconductor wafers, and an anti-oxidizing body used for the method
11/29/2001	US20010046784 Method of manufacturing a semiconductor device
11/29/2001	US20010046783 Semiconductor device and manufacturing method thereof
11/29/2001	US20010046781 Method for etching organic film, method for fabricating semiconductor device and pattern formation method
11/29/2001	US20010046780 Using plasma generated from a gas including an amine such as methylamine.
11/29/2001	US20010046776 Method for fabricating a stencil mask
11/29/2001	US20010046764 Semiconductor device and manufacturing method thereof
11/29/2001	US20010046763 Method for creating a die shrink insensitive semiconductor package and component therefor
11/29/2001	US20010046752 Method of improving alignment for semiconductor fabrication
11/29/2001	US20010046737 Semiconductor memory device and fabricating method thereof
11/29/2001	US20010046728 Method of forming conductive lines
11/29/2001	US20010046726 Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same
11/29/2001	US20010046725 High density cavity-up wire bond BGA
11/29/2001	US20010046724 Molded ball grid array
11/29/2001	US20010046721 Method for reworking metal layers on integrated circuit bond pads
11/29/2001	US20010046586 Stencil and method for depositing solder
11/29/2001	US20010046567 Siloxan polymer film on semiconductor substrate and method for forming same
11/29/2001	US20010046127 Semiconductor package and device socket
11/29/2001	US20010046125 Novel MCM -MLC technology
11/29/2001	US20010046120 Chip scale packaging on cte matched printed wiring boards
11/29/2001	US20010046119 Low profile EMI shield with heat spreading plate
11/29/2001	US20010045999 Semiconductor device, display apparatus using such devices and method of manufacturing such an apparatus as well as that of manufacturing such an apparatus
11/29/2001	US20010045861 Fuse selectable pinout package
11/29/2001	US20010045671 Wafer with resin layer comprising plural projected electrodes and cured resin layer formed on projected electrode-mounting side of wafer, formed by tablet comprising specified epoxy resin and curing agent; wafer has substantially no bowing
11/29/2001	US20010045670 Semiconductor device
11/29/2001	US20010045669 Semiconductor device
11/29/2001	US20010045668 Plug structure
11/29/2001	US20010045666 Semiconductor device having self-aligned contact and fabricating method therefor
11/29/2001	US20010045665 Semiconductor device
11/29/2001	US20010045664 Semiconductor apparatus and method for fabricating the same

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