| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/06/2001 | US20010048708 Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with a radiation fins. |
| 12/06/2001 | US20010048698 Mounting substrate and heat sink for high-power diode laser bars |
| 12/06/2001 | US20010048591 Microelectronics component with rigid interposer |
| 12/06/2001 | US20010048581 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 12/06/2001 | US20010048508 Method and apparatus for placing identifying mark on semiconductor wafer |
| 12/06/2001 | US20010048166 Flip chip type semiconductor device and method of manufactruing the same |
| 12/06/2001 | US20010048165 Semiconductor device and fabrication process thereof |
| 12/06/2001 | US20010048164 High-frequency signal amplification device and method for manufacturing the same |
| 12/06/2001 | US20010048163 Wiring structure of semiconductor device |
| 12/06/2001 | US20010048162 Semiconductor device having a structure of a multilayer interconnection unit and manufacturing method thereof |
| 12/06/2001 | US20010048160 Semiconductor device having reinforced coupling between solder balls and substrate |
| 12/06/2001 | US20010048159 Electronic device having a multiplicity of contact bumps |
| 12/06/2001 | US20010048158 Solder balls and columns with stratified underfills on substrate for flip chip joining |
| 12/06/2001 | US20010048157 Direct attach chip scale package |
| 12/06/2001 | US20010048156 Semiconductor device and method of manufacturing the same |
| 12/06/2001 | US20010048155 Interchangeable bond-wire interconnects |
| 12/06/2001 | US20010048154 Three commonly housed diverse semiconductor dice |
| 12/06/2001 | US20010048152 Stackable ceramic fbga for high thermal applications |
| 12/06/2001 | US20010048151 Stackable ball grid array semiconductor package and fabrication method thereof |
| 12/06/2001 | US20010048150 Compact, surface-mounting-type, electronic-circuit unit |
| 12/06/2001 | US20010048149 Leadframe with elevated small mount pads |
| 12/06/2001 | US20010048148 Semiconductor device and a method of manufacturing the same |
| 12/06/2001 | US20010048146 Method of forming composite silicon oxide layer over a semiconductro device |
| 12/06/2001 | US20010048145 Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof |
| 12/06/2001 | US20010048125 Semiconductor device and manufacturing method thereof |
| 12/06/2001 | US20010048116 Chip scale surface mounted device and process of manufacture |
| 12/06/2001 | US20010048105 Semiconductor device |
| 12/06/2001 | US20010048104 Semiconductor device and method of manufacturing the same |
| 12/06/2001 | US20010048064 Electronic device and production process of same |
| 12/06/2001 | US20010048014 Method of producing a semiconductor device |
| 12/06/2001 | US20010047944 Means for holding plurality of wafers and rotating each wafer at constant speed and synchronous within the plurality for electroless plating of bondable metal caps onto bond pads of integrated corcuits having copper metallization |
| 12/06/2001 | US20010047932 Depositing barrier, wetting layer, vapor depositing conformal metal layer over surface, filling apertures with metals; void-free |
| 12/06/2001 | US20010047882 Multi-chip land grid array carrier |
| 12/06/2001 | US20010047881 Printed-wiring substrate and method for fabricating the printed-wiring substrate |
| 12/06/2001 | US20010047880 Double sided flexible circuit for integrated circuit packages and method of manufacture |
| 12/06/2001 | US20010047858 Conforming heat sink assembly |
| 12/06/2001 | US20010047590 Method of manufacturing a heat pipe construction |
| 12/06/2001 | US20010047588 Electronic interconnection medium having offset electrical mesh plane |
| 12/06/2001 | EP1145316A3 Power semiconductor module |
| 12/06/2001 | DE19655006C2 Semiconductor encapsulation with numerous, external, intermediate connectors |
| 12/06/2001 | DE10125586A1 Copper alloy used in electrical and electronic components e.g. semiconductor conductor frames contains alloying additions of nickel, iron, phosphorous and zinc |
| 12/06/2001 | DE10125035A1 Halbleiterbauteil Semiconductor device |
| 12/06/2001 | DE10103106A1 Power semiconductor module has smoothing capacitor whose main surface lies against main and side surfaces of package |
| 12/06/2001 | DE10100620A1 Power semiconductor module has capacitor and power semiconductor device disposed directly on heat sink having cooling medium channels |
| 12/06/2001 | DE10059604A1 Structure for connecting up electronic components, has a metal carrier strip supporting two single strips holding tongues aligned inwards welded to connector wires for a sensor element designed as a semiconductor sensor |
| 12/06/2001 | DE10057412A1 Halbleitergeräteeinkapselungsanordnung und Verfahren zu deren Hertellung Halbleitergeräteeinkapselungsanordnung and methods for their Hertel Lung |
| 12/06/2001 | DE10048203A1 Verbundwerkstoff und Verfahren zu seiner Herstellung Composite material and process for its preparation |
| 12/06/2001 | DE10027688A1 Preparing flat, unstructured baseplate of electrical or electronic component for use with liquid cooling has structure of slots or ribs applied to baseplate |
| 12/06/2001 | DE10026933C1 Faraday cage for integrated circuit has lower and upper metallization planes filled with metallization layers and connected at edges by metal ring structures in intermediate planes |
| 12/06/2001 | DE10026251A1 Fuse or anti-fuse programming device has fuse inserted in series between 2 transistor source-drain paths |
| 12/06/2001 | DE10025774A1 Halbleiterbauelement mit Oberflächenmetallisierung Semiconductor component with surface metallization |
| 12/06/2001 | DE10024439A1 Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile Casting or embedding compound having electromagnetic shielding for the production of electronic components |
| 12/06/2001 | DE10024376A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 12/06/2001 | CA2410456A1 Hardened fe-ni alloy for making integrated circuit grids and method for making same |
| 12/05/2001 | EP1161127A2 Electronic module |
| 12/05/2001 | EP1161125A2 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 12/05/2001 | EP1161124A2 Surface-mounting type electronic circuit unit suitable for miniaturization |
| 12/05/2001 | EP1160869A2 SMD with passive components formed by thin film technology |
| 12/05/2001 | EP1160867A2 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency charateristic |
| 12/05/2001 | EP1160866A2 Power wiring structure and semiconductor device |
| 12/05/2001 | EP1160865A2 Semiconductor device with optical fuse |
| 12/05/2001 | EP1160864A2 Semiconductor device with a corrosion resistant bonding pad and manufacturing method thereof |
| 12/05/2001 | EP1160863A2 Pressing device for heat sink |
| 12/05/2001 | EP1160862A1 Thermal conductive material and method for producing the same |
| 12/05/2001 | EP1160861A2 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof |
| 12/05/2001 | EP1160860A1 Heat sink material and method of manufacturing the heat sink material |
| 12/05/2001 | EP1160859A2 Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
| 12/05/2001 | EP1160858A2 A board for manufacturing a bga and method of manufacturing semiconductor device using thereof |
| 12/05/2001 | EP1160857A2 Epoxy-based adhesive for mounting a semiconductor device on a substrate |
| 12/05/2001 | EP1160856A2 Flip chip type semiconductor device and method of manufacturing the same |
| 12/05/2001 | EP1160853A2 Method of producing a semiconductor device |
| 12/05/2001 | EP1160843A1 Planarizing anti-reflective coating layer with improved light absorption |
| 12/05/2001 | EP1160842A2 Integrated radio frequency circuits |
| 12/05/2001 | EP1160841A2 Integrated inductive circuits |
| 12/05/2001 | EP1160344A1 Gold wire for semiconductor element connection and semiconductor element connection method |
| 12/05/2001 | EP1159768A1 Packaged strain actuator |
| 12/05/2001 | EP1159103A1 Laser processing |
| 12/05/2001 | EP1149409A4 Method for forming a silicide region on a silicon body |
| 12/05/2001 | EP1048056A4 A single step electroplating process for interconnect via fill and metal line patterning |
| 12/05/2001 | EP0914757B1 Z-axis interconnect method and circuit |
| 12/05/2001 | EP0698292B1 Method of forming a moulded lead frame |
| 12/05/2001 | CN2463962Y Semiconductor discharge tube capable of outputting detecting and warning signals |
| 12/05/2001 | CN2463961Y Heat tube electronic element radiator |
| 12/05/2001 | CN2463960Y Stacked radiator |
| 12/05/2001 | CN2463959Y Slope-preventing device for central processor |
| 12/05/2001 | CN2463958Y Integrated circuit |
| 12/05/2001 | CN1325545A High voltage shield |
| 12/05/2001 | CN1325139A Semiconductor circuit device and mfg. method |
| 12/05/2001 | CN1325138A Manufacture of wire holder in double electroplating mold |
| 12/05/2001 | CN1325137A Semiconductor device and mfg. method thereof |
| 12/05/2001 | CN1325136A Mfg. for producing plate-shape body and semiconductor device |
| 12/05/2001 | CN1325135A Combined radiating fin and its making process |
| 12/05/2001 | CN1325132A Inactivation method of plastic packel GaAs chip |
| 12/05/2001 | CN1324904A Isolator or filler having electromagnetic shielding characteristic for producing electronic device |
| 12/05/2001 | CN1324871A Amorphous copolymer of tetrafuoro ethylene and hexafluopropene |
| 12/04/2001 | US6327697 Method for routing conductive paths in an integrated circuit |
| 12/04/2001 | US6327665 Processor with power consumption limiting function |
| 12/04/2001 | US6327513 Methods and apparatus for calculating alignment of layers during semiconductor processing |
| 12/04/2001 | US6327158 Metal pads for electrical probe testing on wafer with bump interconnects |
| 12/04/2001 | US6327149 Electrical circuit board and method for making the same |