Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/26/2013US8592988 Semiconductor device
11/26/2013US8592987 Semiconductor element comprising a supporting structure and production method
11/26/2013US8592986 High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
11/26/2013US8592985 Methods of forming conductive structures and methods of forming DRAM cells
11/26/2013US8592984 Semiconductor integrated circuit device and method of manufacturing the same
11/26/2013US8592983 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device
11/26/2013US8592982 Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
11/26/2013US8592980 Carbon nanotube-modified low-K materials
11/26/2013US8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same
11/26/2013US8592978 Method of fabricating semiconductor device and the semiconductor device
11/26/2013US8592977 Integrated circuit (IC) chip and method for fabricating the same
11/26/2013US8592976 Ball-limiting-metallurgy layers in solder ball structures
11/26/2013US8592975 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
11/26/2013US8592974 Package configurations for low EMI circuits
11/26/2013US8592973 Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof
11/26/2013US8592972 Thermally conductive device with a thermal interface material
11/26/2013US8592971 Direct semiconductor contact ebullient cooling package
11/26/2013US8592970 Multichip electronic packages and methods of manufacture
11/26/2013US8592969 Semiconductor device with protective screen
11/26/2013US8592968 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
11/26/2013US8592967 Semiconductor apparatus and power supply circuit
11/26/2013US8592966 RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
11/26/2013US8592965 On-die bond wires system and method for enhancing routability of a redistribution layer
11/26/2013US8592964 Apparatus and method for high density multi-chip structures
11/26/2013US8592963 Self-aligning structures and method for integrated chips
11/26/2013US8592962 Semiconductor device packages with protective layer and related methods
11/26/2013US8592961 Method of manufacturing a semiconductor device
11/26/2013US8592960 Leadframe package with integrated partial waveguide interface
11/26/2013US8592959 Semiconductor device mounted on a wiring board having a cap
11/26/2013US8592958 Chip package and manufacturing method thereof
11/26/2013US8592957 Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein
11/26/2013US8592956 Resist underlayer film composition and patterning process using the same
11/26/2013US8592955 Accurate deposition of nano-objects on a surface
11/26/2013US8592951 Semiconductor wafer having W-shaped dummy metal filling section within monitor region
11/26/2013US8592950 Semiconductor device and method of forming through vias with reflowed conductive material
11/26/2013US8592947 Thermally controlled refractory metal resistor
11/26/2013US8592944 Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process
11/26/2013US8592941 Fuse structure having crack stop void, method for forming and programming same, and design structure
11/26/2013US8592926 Substrate bonding with metal germanium silicon material
11/26/2013US8592910 Semiconductor body with a protective structure and method for manufacturing the same
11/26/2013US8592831 Integrated circuit device
11/26/2013US8592825 Semiconductor device having Si-substrate and process to form the same
11/26/2013US8592813 Semiconductor device and stacked semiconductor apparatus
11/26/2013US8592811 Active matrix substrate and display panel
11/26/2013US8592688 Multilayer printed wiring board
11/26/2013US8592504 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
11/26/2013US8592303 Wiring structure and method for manufacturing the same
11/26/2013US8592300 Interface structure for copper-copper peeling integrity
11/26/2013US8592256 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
11/26/2013US8592255 Method for electrically connecting dual silicon-on-insulator device layers
11/26/2013US8592254 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
11/26/2013DE202013009203U1 Warmlichtfilter für Leuchtdioden Lichtquellen Warmlightfilter for LEDs light sources
11/25/2013DE202013008895U1 Kühlvorrichtung Cooler
11/21/2013WO2013173302A1 Soft error resistant circuitry
11/21/2013WO2013172994A1 Thermally insulative composition and electronic devices assembled therewith
11/21/2013WO2013172814A1 Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
11/21/2013WO2013172784A1 Device and structure and method for forming the same
11/21/2013WO2013172609A1 Fingerprint sensor package and method for manufacturing same
11/21/2013WO2013172604A1 Fingerprint sensor package and method for manufacturing same
11/21/2013WO2013172444A1 Method for manufacturing crystal oscillator
11/21/2013WO2013172443A1 Electronic component, and method for producing same
11/21/2013WO2013172442A1 Crystal oscillator
11/21/2013WO2013172440A1 Method for producing crystal oscillator, and crystal oscillator
11/21/2013WO2013172429A1 Stretchable heat-radiation sheet, and article having same attached thereto
11/21/2013WO2013172420A1 Semiconductor-element-accommodating package, semiconductor device and mounting structure
11/21/2013WO2013172291A1 Power module semiconductor device
11/21/2013WO2013172139A1 Semiconductor device
11/21/2013WO2013172060A1 Semiconductor device
11/21/2013WO2013172008A1 Semiconductor device and semiconductor device manufacturing method
11/21/2013WO2013172004A1 Structure for connecting cooling apparatus, cooling apparatus, and method for connecting cooling apparatus
11/21/2013WO2013171964A1 Wiring board
11/21/2013WO2013171960A1 Heat conductive sheet supplying body and heat conductive sheet supplying method
11/21/2013WO2013171882A1 Semiconductor module and semiconductor device
11/21/2013WO2013171842A1 Semiconductor device and manufacturing method for semiconductor device
11/21/2013WO2013171235A1 Method for manufacturing germanide interconnect structures and corresponding interconnect structures
11/21/2013WO2013171226A2 An electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle
11/21/2013WO2013171136A1 Electronic power module arrangement
11/21/2013WO2013171121A1 Power electronic devices
11/21/2013WO2013170725A1 Fabrication method for semiconductor device and semiconductor device
11/21/2013WO2013170523A1 Switching device having freewheeling diode
11/21/2013WO2013170485A1 Packaging structure and packaging method thereof
11/21/2013WO2013149001A3 Novel fused naphthalene cyclohetero ring compounds, and methods and uses thereof
11/21/2013WO2013072775A3 Package assembly including a semiconductor substrate with stress relief structure
11/21/2013US20130309862 METHOD FOR MANUFACTURING Sn ALLOY BUMP
11/21/2013US20130309812 Integrated chip package structure using ceramic substrate and method of manufacturing the same
11/21/2013US20130309809 Flexible electronic devices and related methods
11/21/2013US20130308276 Semiconductor device and manufacturing method for same
11/21/2013US20130308269 Method of converting power using a power semiconductor module
11/21/2013US20130307611 Multi-chip package and operating method thereof
11/21/2013US20130307167 Phenolic oligomer and method for producing the same
11/21/2013US20130307166 Method for forming patterns of dense conductor lines and their contact pads, and memory array having dense conductor lines and contact pads
11/21/2013US20130307165 Method for low temperature wafer bonding and bonded structure
11/21/2013US20130307164 Integrated circuit apparatus, systems, and methods
11/21/2013US20130307163 Semiconductor device and method of manufacturing the same
11/21/2013US20130307162 Wiring board and method for manufacturing the same
11/21/2013US20130307161 Chip package and method for forming the same
11/21/2013US20130307160 Via Structure For Three-Dimensional Circuit Integration
11/21/2013US20130307159 Physical design symmetry and integrated circuits enabling three dimentional (3d) yield optimization for wafer to wafer stacking
11/21/2013US20130307158 Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
11/21/2013US20130307157 Semiconductor device packages with solder joint enhancement element and related methods
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