| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/12/2001 | CN1325790A Copper film for TAB band carrier and TAB carried band and TAB band carrier |
| 12/12/2001 | CN1076123C Semiconductor device equipped with antifuse elements and a method for manufacturing an fpga |
| 12/11/2001 | US6330166 Electronic-component mounting structure |
| 12/11/2001 | US6330165 Semiconductor device |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6330162 IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof |
| 12/11/2001 | US6330160 Component retention clip for a heat sink assembly |
| 12/11/2001 | US6330159 Vertical surface mount apparatus with thermal carrier |
| 12/11/2001 | US6330158 Semiconductor package having heat sinks and method of fabrication |
| 12/11/2001 | US6330157 Variable thermal exchanger and method thereof |
| 12/11/2001 | US6329879 High frequency power amplifier system and wireless communication system |
| 12/11/2001 | US6329863 Input circuit having a fuse therein and semiconductor device having the same |
| 12/11/2001 | US6329722 Bonding pads for integrated circuits having copper interconnect metallization |
| 12/11/2001 | US6329721 Pb-In-Sn tall C-4 for fatigue enhancement |
| 12/11/2001 | US6329719 Semiconductor device |
| 12/11/2001 | US6329718 Method for reducing stress-induced voids for 0.25mμ and smaller semiconductor chip technology by annealing interconnect lines and using low bias voltage and low interlayer dielectric deposition rate and semiconductor chip made thereby |
| 12/11/2001 | US6329715 Passive electronic parts, IC parts, and wafer |
| 12/11/2001 | US6329714 Hybrid S.C. devices and method of manufacture thereof |
| 12/11/2001 | US6329713 Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate |
| 12/11/2001 | US6329712 High density flip chip memory arrays |
| 12/11/2001 | US6329711 Semiconductor device and mounting structure |
| 12/11/2001 | US6329710 Integrated circuit package electrical enhancement |
| 12/11/2001 | US6329709 Interconnections for a semiconductor device |
| 12/11/2001 | US6329708 Micro ball grid array semiconductor device and semiconductor module |
| 12/11/2001 | US6329707 Twin transistor device with improved collector-base isolation |
| 12/11/2001 | US6329706 Leadframe using chip pad as heat conducting path and semiconductor package adopting the same |
| 12/11/2001 | US6329705 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes |
| 12/11/2001 | US6329702 High frequency carrier |
| 12/11/2001 | US6329701 Semiconductor device comprising copper interconnects with reduced in-line diffusion |
| 12/11/2001 | US6329696 Semiconductor device with electric converter element |
| 12/11/2001 | US6329690 Method and apparatus to match semiconductor device performance |
| 12/11/2001 | US6329680 Semiconductor integrated circuit device and process for manufacturing the same |
| 12/11/2001 | US6329671 Semiconductor device and method of manufacturing the same |
| 12/11/2001 | US6329670 Conductive material for integrated circuit fabrication |
| 12/11/2001 | US6329669 Semiconductor device able to test changeover circuit which switches connection between terminals |
| 12/11/2001 | US6329610 Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board |
| 12/11/2001 | US6329608 Key-shaped solder bumps and under bump metallurgy |
| 12/11/2001 | US6329607 Microelectronic lead structures with dielectric layers |
| 12/11/2001 | US6329606 Grid array assembly of circuit boards with singulation grooves |
| 12/11/2001 | US6329605 Components with conductive solder mask layers |
| 12/11/2001 | US6329594 Integrated circuit package |
| 12/11/2001 | US6329492 Useful as material for encapsulating electronic devices, for lamination or for adhesion; curing agent for epoxy resins |
| 12/11/2001 | US6329474 For printed wiring boards; heat resistance, hydrophobic; corrosion resistance, discoloration inhibition |
| 12/11/2001 | US6329301 Method and apparatus for selective removal of material from wafer alignment marks |
| 12/11/2001 | US6329295 Semiconductor device capable of having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material and method of manufacturing the same |
| 12/11/2001 | US6329289 Method and apparatus for forming copper wiring |
| 12/11/2001 | US6329288 Semiconductor device and manufacturing method thereof |
| 12/11/2001 | US6329284 Manufacturing process of a semiconductor device |
| 12/11/2001 | US6329281 Methods for fabricating a multilevel interconnection for an integrated circuit device utilizing a selective overlayer |
| 12/11/2001 | US6329280 Interim oxidation of silsesquioxane dielectric for dual damascene process |
| 12/11/2001 | US6329275 Target formed by sputtering and a second element of carbon, oxygen, nitrogen and hydrogen |
| 12/11/2001 | US6329265 Method of making a semiconductor device using processing from both sides of a workpiece |
| 12/11/2001 | US6329262 Method for producing semiconductor integrated circuit |
| 12/11/2001 | US6329231 Distributed constant circuit with active element |
| 12/11/2001 | US6329228 Semiconductor device and method of fabricating the same |
| 12/11/2001 | US6329223 Method for preventing electrostatic discharge in an integrated circuit |
| 12/11/2001 | US6329222 Interconnect for packaging semiconductor dice and fabricating BGA packages |
| 12/11/2001 | US6329220 Packages for semiconductor die |
| 12/11/2001 | US6329065 Wire board and method of producing the same |
| 12/11/2001 | US6329045 Substrates with inorganic powders |
| 12/11/2001 | US6328914 Thick-film paste with insoluble additive |
| 12/11/2001 | US6328871 Depositing a barrier layer comprising tantalum over the surface; annealing the barrier layer to form high conductance barrier layer; depositing a seed layer over the barrier layer |
| 12/11/2001 | US6328529 Cooling device with support members facing fin |
| 12/11/2001 | US6328483 Electronic or optoelectronic housing with ceramic insert |
| 12/11/2001 | US6328201 Multilayer wiring substrate and method for producing the same |
| 12/11/2001 | US6328097 Integrated heat dissipation apparatus |
| 12/08/2001 | CA2349870A1 Use of pcms in heat sinks for electronic components |
| 12/08/2001 | CA2348802A1 Electronic assembly with high interconnect density |
| 12/06/2001 | WO2001093335A1 Component with a transistor and method for production thereof |
| 12/06/2001 | WO2001093331A2 Fuse link |
| 12/06/2001 | WO2001093330A2 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer |
| 12/06/2001 | WO2001093329A2 Faraday cage for an integrated circuit |
| 12/06/2001 | WO2001093328A2 Lead frame laminate and method for manufacturing semiconductor parts |
| 12/06/2001 | WO2001093327A1 Semiconductor component, electrically conductive structure therefor, and process for production thereof |
| 12/06/2001 | WO2001093324A2 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 12/06/2001 | WO2001093318A1 Planarizing anti-reflective coating layer with improved light absorption |
| 12/06/2001 | WO2001093317A1 Integrated inductive circuits |
| 12/06/2001 | WO2001093314A1 Ball grid array with pre-slotted substrate |
| 12/06/2001 | WO2001092979A1 Temperature compensation method |
| 12/06/2001 | WO2001092606A1 Electrolyte and method for depositing tin-silver alloy layers |
| 12/06/2001 | WO2001092594A2 Fiber-metal-matrix composite for physical vapor deposition target backing plates |
| 12/06/2001 | WO2001092587A1 Hardened fe-ni alloy for making integrated circuit grids and method for making same |
| 12/06/2001 | WO2001092396A1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof |
| 12/06/2001 | WO2001092185A1 Brazeable metallizations for diamond components |
| 12/06/2001 | WO2001092184A1 Material composite and production and use of the material composite |
| 12/06/2001 | WO2001052410A3 Component with drain for pyroelectrical voltages and a method for production thereof |
| 12/06/2001 | WO2001027997A3 Power semiconductor module |
| 12/06/2001 | WO2000051012A8 Integrated circuit interconnect system |
| 12/06/2001 | US20010049813 Integrated circuit incorporating a power mesh |
| 12/06/2001 | US20010049199 Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect |
| 12/06/2001 | US20010049191 Semiconductor device and manufacturing method thereof |
| 12/06/2001 | US20010049190 In a recess within a dielectric material on a semiconductor substrate is formed a diffusion barrier layer, a seed layer, an electroconductive layer, and a thermal absorption layer; heating to melt the electroconductive layer and avoid voids |
| 12/06/2001 | US20010049187 Semiconductor chip and method manufacturing the same |
| 12/06/2001 | US20010049177 Method for manufacturing semiconductor devices |
| 12/06/2001 | US20010049159 Substrate strip for use in packaging semiconductor chips and method for making the substrate strip |
| 12/06/2001 | US20010049156 Increasing the interface area between the package body and die pad and the connection pads to prolong the path and time for moisture diffusion into the package by etching concave profiles in the connective pads to give a larger thickness |
| 12/06/2001 | US20010049155 Semiconductor device using substrate having cubic structure and method of manufacturing the same |
| 12/06/2001 | US20010049151 Method for manufacturing semiconductor device capable of improving manufacturing yield |
| 12/06/2001 | US20010049027 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding |
| 12/06/2001 | US20010048980 High density plasma enhanced chemical vapor deposition method |