| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/13/2001 | WO2001043169A3 Methods for separating microcircuit dies from wafers |
| 12/13/2001 | WO2001041212A3 Integrated circuit package |
| 12/13/2001 | WO2001039250A3 Conductive interconnection |
| 12/13/2001 | WO2001037335A3 Packaging for a semiconductor chip |
| 12/13/2001 | WO2001033621A3 Methods for forming openings in a substrate and methods for creating assemblies |
| 12/13/2001 | WO2001029843A3 Method for identifying an integrated circuit |
| 12/13/2001 | WO2001016996A3 Circuit and method for producing the same |
| 12/13/2001 | WO2000019524A9 Ic interconnect structures and methods for making same |
| 12/13/2001 | US20010051447 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer |
| 12/13/2001 | US20010051445 Semiconductor device and method of manufacturing the same |
| 12/13/2001 | US20010051441 Semiconductor processing methods and structures for determining alignment during semiconductor wafer processing |
| 12/13/2001 | US20010051431 Fabrication process for dishing-free cu damascene structures |
| 12/13/2001 | US20010051426 Method for forming a semiconductor device having a mechanically robust pad interface. |
| 12/13/2001 | US20010051422 Semiconductor devices and methods for manufacturing the same |
| 12/13/2001 | US20010051421 Method of manufacturing a semiconductor device |
| 12/13/2001 | US20010051415 Thin microelectronic substrates and methods of manufacture |
| 12/13/2001 | US20010051397 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 12/13/2001 | US20010051396 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device |
| 12/13/2001 | US20010051395 Tape stiffener, semiconductor device assemblies including same, and stereolithographic methods for fabricating same |
| 12/13/2001 | US20010051393 Method of making a semiconductor device having a stress relieving mechanism |
| 12/13/2001 | US20010051392 Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices |
| 12/13/2001 | US20010051391 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 12/13/2001 | US20010051383 Method for identifying defective elements in array molding of semiconductor packaging |
| 12/13/2001 | US20010051211 Manufacturing method and plating apparatus for film carrier tape |
| 12/13/2001 | US20010051210 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 12/13/2001 | US20010051105 Overcoating plastic substrates |
| 12/13/2001 | US20010051029 Three-dimensional mounted assembly, method of manufacturing the same, and optical transmission device |
| 12/13/2001 | US20010051000 Pattern recognition method |
| 12/13/2001 | US20010050846 Reel-deployed printed circuit board and method for manufacturing chip-on-board packages |
| 12/13/2001 | US20010050845 Semiconductor device including combed bond pad opening, assemblies and methods |
| 12/13/2001 | US20010050844 Structure for mounting radiating plate |
| 12/13/2001 | US20010050843 Radiation structure for heating element |
| 12/13/2001 | US20010050842 Heat sink and information processor using it |
| 12/13/2001 | US20010050799 Electro-optical device, method for making the same, and electronic apparatus |
| 12/13/2001 | US20010050743 Method of manufacturing an array substrate for liquid crystal display |
| 12/13/2001 | US20010050717 Semiconductor device constituting a CMOS camera system |
| 12/13/2001 | US20010050644 High-frequency communication apparatus and method of manufacturing the same |
| 12/13/2001 | US20010050607 Integrated transformer |
| 12/13/2001 | US20010050600 Isolating energy conditioning shield assembly |
| 12/13/2001 | US20010050441 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
| 12/13/2001 | US20010050440 Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof |
| 12/13/2001 | US20010050439 Surface modified interconnects |
| 12/13/2001 | US20010050438 Methods of forming materials between conductive electrical components, and insulating materials |
| 12/13/2001 | US20010050437 Semiconductor device and method of manufacturing the same |
| 12/13/2001 | US20010050433 Ball grid array package semiconductor device having improved power line routing |
| 12/13/2001 | US20010050432 Flip chip technique for chip assembly |
| 12/13/2001 | US20010050431 Semiconductor device and liquid crystal module adopting the same |
| 12/13/2001 | US20010050430 Electronic assembly having high interconnection density |
| 12/13/2001 | US20010050429 Method and apparatus for surface mounted power transistor with heat sink |
| 12/13/2001 | US20010050428 Semiconductor device and a method of manufacturing the same |
| 12/13/2001 | US20010050426 LSI package and internal connecting method used therefor |
| 12/13/2001 | US20010050425 Flexible sheet bonded in tension on a rigid frame so that the sheet spans an aperture in the frame; frame and sheet have different coefficients of thermal expansion; use making microelectronics |
| 12/13/2001 | US20010050424 Electrostastic charge protection structure |
| 12/13/2001 | US20010050423 Semiconductor device |
| 12/13/2001 | US20010050422 Semiconductor device and a method of manufacturing the same |
| 12/13/2001 | US20010050420 Leadframe having joined internal lead |
| 12/13/2001 | US20010050419 Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
| 12/13/2001 | US20010050418 Semiconductor device with semiconductor chip on flexible tape |
| 12/13/2001 | US20010050417 Modified bus bar with kaptonTM tape or insulative material on loc packaged part |
| 12/13/2001 | US20010050408 Integrated high-performance decoupling capacitor and heat sink |
| 12/13/2001 | US20010050407 Anti-fuse structure and method of writing and reading in integrated circuits |
| 12/13/2001 | US20010050405 Method of manufacturing a rom device that includes ion implantation through an insulating layer |
| 12/13/2001 | US20010050397 Semiconductor device and method of manufacturing the same |
| 12/13/2001 | US20010050381 Semiconductor apparatus and manufacturing method therefor |
| 12/13/2001 | US20010050182 Wiring board |
| 12/13/2001 | US20010050180 Method for preparing side attach pad traces through buried conductive material |
| 12/13/2001 | US20010050175 Electromagnetic radiation shield for attenuating electromagnetic radiation from an active electronic device |
| 12/13/2001 | US20010050165 Channel connection for pipe to block joints |
| 12/13/2001 | US20010050164 Cooling apparatus for electronic devices |
| 12/13/2001 | US20010050162 Normal-flow heat exchanger |
| 12/13/2001 | US20010050138 Thin electronic circuit component and method and apparatus for producing the same |
| 12/13/2001 | US20010049881 Methods and circuits for mask-alignment detection |
| 12/13/2001 | DE10027914A1 Bauelement mit einem Transistor und Verfahren zu dessen Herstellung Component having a transistor and method for its production |
| 12/13/2001 | DE10027206A1 Alterungsstabile Epoxidharzsysteme, daraus hergestellte Formstoffe und Bauelemente und deren Verwendung Aging stable epoxy resin, produced therefrom mold materials and components and their use |
| 12/13/2001 | DE10026926A1 Halbleiteranordnung mit optischer Fuse A semiconductor device having optical Fuse |
| 12/12/2001 | EP1162867A1 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 12/12/2001 | EP1162719A2 Vehicle AC generator |
| 12/12/2001 | EP1162661A1 Electronic semiconductor device having a heat spreader |
| 12/12/2001 | EP1162660A1 Electronic assembly with high density of electrical interconnections |
| 12/12/2001 | EP1162659A2 Use of PCM in heat sinks for electronic devices |
| 12/12/2001 | EP1162656A2 Filling holes and the like in substrates |
| 12/12/2001 | EP1162655A2 Integrated circuit device for testing of transistors and semiconductor wafer equipped with such a circuit device |
| 12/12/2001 | EP1162654A1 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 12/12/2001 | EP1161768A1 Pad metallization over active circuitry |
| 12/12/2001 | EP0907928B1 Leadframe for the assembly of an integrated circuit in an injection mounded housing |
| 12/12/2001 | EP0815593B1 Solder bump fabrication methods and structure including a titanium barrier layer |
| 12/12/2001 | CN2465328Y Double-chip package unit |
| 12/12/2001 | CN2465327Y Double-chip top package device |
| 12/12/2001 | CN2465326Y Heat sink for electronic component |
| 12/12/2001 | CN2465325Y Fin structure for heat sink |
| 12/12/2001 | CN2465324Y Heat sink for large power semiconductor device |
| 12/12/2001 | CN2465323Y Heat sink for IC |
| 12/12/2001 | CN1326592A Integrated circuit chip, integrated circuit, printed-circuit board and electronic device |
| 12/12/2001 | CN1326227A Metal inter-connector and active matrix bottom therewith |
| 12/12/2001 | CN1326226A Electrode structure on carrier bottom of semiconductor device |
| 12/12/2001 | CN1326225A Semiconductor device with downward installed chip and manufacture thereof |
| 12/12/2001 | CN1326224A Method for connecting semiconductor device with golden wires |
| 12/12/2001 | CN1326221A Method for stimulating defect chip and defect testing |
| 12/12/2001 | CN1326219A Method for etching organic film, manufacture of semiconductor device and pattern forming method |
| 12/12/2001 | CN1326016A Local electroplating system |