| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/20/2001 | US20010052651 Driver circuits and methods for manufacturing driver circuits |
| 12/20/2001 | US20010052650 Semiconductor device and method of manufacturing the same |
| 12/20/2001 | US20010052649 Semiconductor device |
| 12/20/2001 | US20010052647 Laminated integrated circuit package |
| 12/20/2001 | US20010052646 Semiconductor device and method of manufacturing same |
| 12/20/2001 | US20010052645 Packaged integrated circuit |
| 12/20/2001 | US20010052644 Copper pad structure |
| 12/20/2001 | US20010052643 Semiconductor device and method for manufacturing same |
| 12/20/2001 | US20010052642 Semiconductor device package and method |
| 12/20/2001 | US20010052641 Power semiconductor device |
| 12/20/2001 | US20010052640 Solid image pickup device |
| 12/20/2001 | US20010052639 Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
| 12/20/2001 | US20010052638 Method and apparatus for coupling a semiconductor die to die terminals |
| 12/20/2001 | US20010052637 Memory modules including capacity for additional memory |
| 12/20/2001 | US20010052635 Semiconductor integrated circuit device |
| 12/20/2001 | US20010052632 Semiconductor package with an electrical static discharge resistor |
| 12/20/2001 | US20010052603 Semiconductor integrated circuit device and exposure method |
| 12/20/2001 | US20010052589 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 12/20/2001 | US20010052183 Printed-wiring substrate and method for fabricating the same |
| 12/20/2001 | DE10129282A1 Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge |
| 12/20/2001 | DE10125407A1 Verbesserte elektronische Sicherungen durch die lokale Verschlechterung der schmelzbaren Verbindung Improved electronic fuses by the local deterioration of the fusible link |
| 12/20/2001 | DE10120868A1 Connecting structure used in the production of a semiconductor chip support comprises a support material, a metallic through-hole arranged in the carrier material, a re-distributing layer, and a through-contact |
| 12/20/2001 | DE10064199A1 Halbleitervorrichtung Semiconductor device |
| 12/20/2001 | DE10062232A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 12/20/2001 | DE10059773A1 Semiconductor device, esp. with pad-electrode structure e.g. MOS transistor, has plan-view shape of lower extending section of pad-electrode having predetermined shape |
| 12/20/2001 | DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing |
| 12/20/2001 | DE10029094A1 SMD-cooler esp. for thermal LSI-circuits, has metal layers and sacrificial layer arranged alternatively over one another |
| 12/20/2001 | DE10028145A1 Integrierte Schaltungsanordnung zum Testen von Transistoren An integrated circuit device for testing transistors |
| 12/20/2001 | DE10022341A1 Elektronisches Leistungsmodul Electronic power module |
| 12/20/2001 | CA2411197A1 Water getter devices for laser amplifiers and process for the manufacture thereof |
| 12/20/2001 | CA2408317A1 Encapsulation using microcellular foamed materials |
| 12/19/2001 | EP1164639A2 Alignment marks for manufacturing semiconductor device |
| 12/19/2001 | EP1164637A2 Method of making metallization and contact structures in an integrated circuit comprising an etch stop layer |
| 12/19/2001 | EP1164632A2 Method of forming a fluoro-organosilicate layer on a substrate |
| 12/19/2001 | EP1164630A2 Graded/stepped silicide process to improve MOS transistor |
| 12/19/2001 | EP1164113A1 Method of laser machining glass substrate and method of fabricating high-frequency circuit |
| 12/19/2001 | EP1163483A1 Thermally conductive material and method of using the same |
| 12/19/2001 | EP0935526A4 Metal ceramic composites with improved interfacial properties |
| 12/19/2001 | EP0808508B1 Methods of mechanical and electrical substrate connection |
| 12/19/2001 | EP0766909B1 Vertical interconnect process for silicon segments |
| 12/19/2001 | EP0737363B1 Method of manufacturing a semiconductor device for microwave |
| 12/19/2001 | EP0729646B1 Electronic system circuit package |
| 12/19/2001 | EP0551382B1 Semiconductor chip assemblies, methods of making same and components for same |
| 12/19/2001 | CN2466795Y Heat sink |
| 12/19/2001 | CN2466794Y Side blowing heat sink |
| 12/19/2001 | CN1327710A Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 12/19/2001 | CN1327267A Forming anti-fuse structure in silicone on insulator and method thereof |
| 12/19/2001 | CN1327266A Semiconductor device and its producing method |
| 12/19/2001 | CN1327265A Lead wire frame, semiconductor and its producing method, circuit base board and electronic device |
| 12/19/2001 | CN1327263A Semiconductor device and its producing method, laminated semiconductor device and circuit base board |
| 12/19/2001 | CN1327168A Liquid crystal display device and its producing method |
| 12/19/2001 | CN1327020A Connection material and connection structure body |
| 12/19/2001 | CN1326833A Mo-Cu composite powder |
| 12/18/2001 | US6331939 Stackable ball grid array package |
| 12/18/2001 | US6331937 Apparatus and method for securing a heat sink to an electronic component in a computer system |
| 12/18/2001 | US6331931 Radio frequency power device improvement |
| 12/18/2001 | US6331926 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 12/18/2001 | US6331806 Microwave circuit package and edge conductor structure |
| 12/18/2001 | US6331739 Fuse in top level metal and in a step, process of making and process of trimming |
| 12/18/2001 | US6331738 Semiconductor device having a BGA structure |
| 12/18/2001 | US6331737 Method of encapsulating thin semiconductor chip-scale packages |
| 12/18/2001 | US6331736 Utilization of die repattern layers for die internal connections |
| 12/18/2001 | US6331735 Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts |
| 12/18/2001 | US6331734 Semiconductor device and method for manufacturing the same |
| 12/18/2001 | US6331731 Column for module component |
| 12/18/2001 | US6331730 Push-in type semiconductor device including heat spreader |
| 12/18/2001 | US6331729 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them |
| 12/18/2001 | US6331728 High reliability lead frame and packaging technology containing the same |
| 12/18/2001 | US6331681 Electrical connection device for forming and semiconductor device having metal bump electrical connection |
| 12/18/2001 | US6331679 Multi-layer circuit board using anisotropic electro-conductive adhesive layer |
| 12/18/2001 | US6331485 Electron cyclotron resonance plasma/chemical vapor deposition of titanium, zirconium or hafnium by reducing halide; conformally covering; noncracking; forming barrier layer; filling with electroconductive material |
| 12/18/2001 | US6331484 Titanium-tantalum barrier layer film and method for forming the same |
| 12/18/2001 | US6331483 Method of film-forming of tungsten |
| 12/18/2001 | US6331482 Method of VLSI contact, trench, and via filling using a germanium underlayer with metallization |
| 12/18/2001 | US6331478 Methods for manufacturing semiconductor devices having chamfered metal silicide layers |
| 12/18/2001 | US6331453 Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities |
| 12/18/2001 | US6331452 Method of fabricating integrated circuit package with opening allowing access to die |
| 12/18/2001 | US6331451 Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages |
| 12/18/2001 | US6331450 Method of manufacturing semiconductor device using group III nitride compound |
| 12/18/2001 | US6331448 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
| 12/18/2001 | US6331443 Method for manufacturing a liquid crystal display |
| 12/18/2001 | US6331356 Polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes, and blends |
| 12/18/2001 | US6331347 Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method |
| 12/18/2001 | US6331221 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member |
| 12/18/2001 | US6330977 Electronic labeling systems and methods and electronic card systems and methods |
| 12/18/2001 | US6330908 Heat sink |
| 12/18/2001 | US6330906 Heat sink with flanged portions and spaced apart metal radiating fins |
| 12/18/2001 | US6330905 Heat sink assembly |
| 12/18/2001 | US6330745 Method for making a modular integrated apparatus for heat dissipation |
| 12/13/2001 | WO2001095690A1 Method of making electronic materials |
| 12/13/2001 | WO2001095688A1 Multiscale transport apparatus and methods |
| 12/13/2001 | WO2001095681A1 Method for producing ceramic substrate |
| 12/13/2001 | WO2001095486A1 System and method for array processing of surface acoustic wave devices |
| 12/13/2001 | WO2001095394A1 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit |
| 12/13/2001 | WO2001095393A1 Printed circuit heat sink and methods for making same |
| 12/13/2001 | WO2001095390A1 Semiconductor device and method of manufacturing the device |
| 12/13/2001 | WO2001095120A1 Crosspoint switch with switch matrix module |
| 12/13/2001 | WO2001094273A1 Method for manufacturing aluminum nitride sintered body in which via hole is made |
| 12/13/2001 | WO2001052323A3 Thermal joint and method of use |
| 12/13/2001 | WO2001051243A3 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |