| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/27/2001 | US20010054233 Method of making an electronic device |
| 12/27/2001 | CA2416625A1 Graphite-based heat sink |
| 12/26/2001 | CN2468157Y Light diode lattice large screen cabinet with water & wind circulating temperature-regulating structure |
| 12/26/2001 | CN1328712A Electrical contact element and use of contact element |
| 12/26/2001 | CN1328709A Wideband RF port structure using coplanar waveguide and BGA I/O |
| 12/26/2001 | CN1328699A Methods and compositions for improving interconnect metallization performance in integrated circuits |
| 12/26/2001 | CN1328644A Probe card for probing wafers with raised contact elements |
| 12/26/2001 | CN1328588A Impact-resistant epoxide resin compositions |
| 12/26/2001 | CN1328414A Fastener of heat radiator |
| 12/26/2001 | CN1327896A Technology for manufacturing heat radiator |
| 12/26/2001 | CN1076946C Cooling apparatus and assembling method thereof |
| 12/26/2001 | CN1076873C Integrated chip package and its connecting member |
| 12/26/2001 | CN1076872C Chip carrier and method of maufacturing and mounting the same |
| 12/26/2001 | CN1076866C Fabricating method for high-melting point metal silicide layer on surface of polysilicon layer |
| 12/26/2001 | CN1076638C Grafted thermoplastic elastomer barrier layer |
| 12/25/2001 | US6333858 Carrier module |
| 12/25/2001 | US6333857 Printing wiring board, core substrate, and method for fabricating the core substrate |
| 12/25/2001 | US6333856 Arrangement for mounting chips in multilayer printed circuit boards |
| 12/25/2001 | US6333852 CPU heat dissipation device with special fins |
| 12/25/2001 | US6333850 Heat sink system |
| 12/25/2001 | US6333566 Semiconductor having high density packaging thereof |
| 12/25/2001 | US6333565 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 12/25/2001 | US6333564 Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes |
| 12/25/2001 | US6333563 Electrical interconnection package and method thereof |
| 12/25/2001 | US6333561 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 12/25/2001 | US6333560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/25/2001 | US6333559 Method/structure for creating aluminum wirebound pad on copper BEOL |
| 12/25/2001 | US6333558 Semiconductor device and method for fabricating the same |
| 12/25/2001 | US6333557 Semiconductor chip structures with embedded thermal conductors |
| 12/25/2001 | US6333556 Insulating materials |
| 12/25/2001 | US6333555 Interconnect for semiconductor components and method of fabrication |
| 12/25/2001 | US6333554 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 12/25/2001 | US6333552 Millimeter wave semiconductor device |
| 12/25/2001 | US6333551 Surface profiling in electronic packages for reducing thermally induced interfacial stresses |
| 12/25/2001 | US6333550 Surface mount semiconductor diode device |
| 12/25/2001 | US6333549 Integrated circuit package having interchip bonding and method therefor |
| 12/25/2001 | US6333548 Semiconductor device with etch stopping film |
| 12/25/2001 | US6333547 Semiconductor device and method of manufacturing the same |
| 12/25/2001 | US6333546 Micro fusible link for semiconductor devices and method of manufacture |
| 12/25/2001 | US6333545 Semiconductor device having blocking layer and fuses |
| 12/25/2001 | US6333535 Semiconductor device |
| 12/25/2001 | US6333527 Semiconductor device and method for fabricating the same |
| 12/25/2001 | US6333524 Electrically programmable interlevel fusible link for integrated circuits |
| 12/25/2001 | US6333522 Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor |
| 12/25/2001 | US6333469 Wafer-scale package structure and circuit board attached thereto |
| 12/25/2001 | US6333460 Structural support for direct lid attach |
| 12/25/2001 | US6333278 Forming an interlayer insulating film by chemical vapor deposition employing a mixed gas of hydrogen peroxide and a reactive silicon compound gas |
| 12/25/2001 | US6333276 Semiconductor device and method of forming semiconductor device |
| 12/25/2001 | US6333265 Low pressure, low temperature, semiconductor gap filling process |
| 12/25/2001 | US6333260 Semiconductor device having improved metal line structure and manufacturing method therefor |
| 12/25/2001 | US6333258 Method of manufacturing a semiconductor device |
| 12/25/2001 | US6333257 Interconnection structure and method for forming the same |
| 12/25/2001 | US6333255 Method for making semiconductor device containing low carbon film for interconnect structures |
| 12/25/2001 | US6333252 Low-pin-count chip package and manufacturing method thereof |
| 12/25/2001 | US6333248 Method of fabricating a semiconductor device |
| 12/25/2001 | US6333233 Semiconductor device with self-aligned contact and its manufacture |
| 12/25/2001 | US6333212 Semiconductor device and manufacturing method thereof |
| 12/25/2001 | US6333211 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps |
| 12/25/2001 | US6333207 Peelable lead structure and method of manufacture |
| 12/25/2001 | US6333206 Process for the production of semiconductor device |
| 12/25/2001 | US6333141 Positioning layer of dielectric material comprising decomposable polymer and an organic polysilica, heating to condense polysilica; decomposing polymer; lithographically patterning dielectric layer; depositing a metallic film |
| 12/25/2001 | US6333136 Carrier film and process for producing the same |
| 12/25/2001 | US6332567 Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators |
| 12/25/2001 | US6332322 Electronic device having a thermally isolated element |
| 12/25/2001 | US6332251 Retaining device for a heat sink |
| 12/24/2001 | CA2341076A1 A heat sink |
| 12/23/2001 | CA2351106A1 Power module with electronic power components and process for manufacturing such a module |
| 12/20/2001 | WO2001097584A2 Encapsulation using microcellular foamed materials |
| 12/20/2001 | WO2001097348A1 Water getter devices for laser amplifiers and process for the manufacture thereof |
| 12/20/2001 | WO2001097333A1 Connector and substrate for electronic circuit fabrication |
| 12/20/2001 | WO2001097285A2 Electronic component consisting of a housing and a substrate |
| 12/20/2001 | WO2001097283A1 Copper interconnects with improved electromigration resistance and low resistivity |
| 12/20/2001 | WO2001063983A3 Thermal management system |
| 12/20/2001 | WO2001022489A3 Control device, particularly for use in automotive engineering |
| 12/20/2001 | US20010053620 Method and apparatus for interconnecting devices using an adhesive |
| 12/20/2001 | US20010053614 Semiconductor device and method of manufacturing the same |
| 12/20/2001 | US20010053605 Apparatus and method for reducing differential sputter rates |
| 12/20/2001 | US20010053603 Method of manufacturing a copper metal wiring in a semiconductor device |
| 12/20/2001 | US20010053598 Semiconductor device having bumps |
| 12/20/2001 | US20010053592 Method of manufacturing semiconductor device |
| 12/20/2001 | US20010053591 Plasma treatment to enhance inorganic dielectric adhesion to copper |
| 12/20/2001 | US20010053586 Enhancing chemical vapor deposition of titanium nitride from tetrakis(dialkylamino)titanium and ammonia; removing hydro-carbon impurities; adding small amount of such as dipropyl-amine |
| 12/20/2001 | US20010053582 Semiconductor device |
| 12/20/2001 | US20010053574 Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method |
| 12/20/2001 | US20010053567 Method of forming a test insert for interfacing a device containing contact bumps with a test substrate |
| 12/20/2001 | US20010053566 Leadframe alteration to direct compound flow into package |
| 12/20/2001 | US20010053565 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/20/2001 | US20010053564 Method of manufacturing semiconductor device |
| 12/20/2001 | US20010053563 Method for manufacturing a chip scale package having slits formed on a substrate |
| 12/20/2001 | US20010053450 Poly (phenylene ether) - polyvinyl thermosetting resin |
| 12/20/2001 | US20010053448 Thermosetting resin composition |
| 12/20/2001 | US20010053426 Sealing agent for liquid crystal display and liquid crystal deisplay using the sealing agent |
| 12/20/2001 | US20010053244 Clamp for pattern recognition |
| 12/20/2001 | US20010053062 Thermal-resistance variable heat sink structure and method of using the same |
| 12/20/2001 | US20010052789 Integrated circuit configuration for testing transistors, and a semiconductor wafer having such a circuit configuration |
| 12/20/2001 | US20010052787 Method and apparatus for die testing on wafer |
| 12/20/2001 | US20010052786 Special contact points for accessing internal circuitry of an integrated circuit |
| 12/20/2001 | US20010052780 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents |
| 12/20/2001 | US20010052653 Semiconductor device and method of producing the same |
| 12/20/2001 | US20010052652 Electronic device having fibrous interface |