| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/2002 | US20020000652 Board on chip ball grid array |
| 01/03/2002 | US20020000651 Semiconductor device and method of fabricating the same |
| 01/03/2002 | US20020000650 Semiconductor chip package with interconnect structure |
| 01/03/2002 | US20020000649 Method of fabrication of a microstructure having an internal cavity |
| 01/03/2002 | US20020000648 Thin integrated circuit unit |
| 01/03/2002 | US20020000647 Semiconductor device packaging assembly and method for manufacturing the same |
| 01/03/2002 | US20020000645 Semiconductor module including a plurality of semiconductor devices detachably |
| 01/03/2002 | US20020000644 Insulating layer, semiconductor device and methods for fabricating the same |
| 01/03/2002 | US20020000643 Devices related to electrode pads for p-type group iii nitride compound semiconductors |
| 01/03/2002 | US20020000642 Scribe line structure for preventing from damages thereof induced during fabrication |
| 01/03/2002 | US20020000639 Semiconductor device with inductance element |
| 01/03/2002 | US20020000638 Semiconductor device and method of manufacturing the same |
| 01/03/2002 | US20020000637 Monolithic integrated circuit with several capacitors forming bypass to ground |
| 01/03/2002 | US20020000634 Connection element |
| 01/03/2002 | US20020000627 Method of forming an integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure |
| 01/03/2002 | US20020000625 Semiconductor memory having buried digit lines |
| 01/03/2002 | US20020000615 Multistack 3-dimensional high density semiconductor device and method for fabrication |
| 01/03/2002 | US20020000612 Power-mos transistor |
| 01/03/2002 | US20020000584 Semiconductor structure and device including a monocrystalline conducting layer and method for fabricating the same |
| 01/03/2002 | US20020000579 Semiconductor device having a gate insulation film resistant to dielectric breakdown. |
| 01/03/2002 | US20020000556 Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus |
| 01/03/2002 | US20020000327 Wiring substrate, semiconductor device and package stack semiconductor device |
| 01/03/2002 | US20020000308 Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus |
| 01/03/2002 | US20020000239 Stripping composition: quaternary ammonium base, surfactant and high boiling solvent; environmentally and chemically safe |
| 01/03/2002 | US20020000137 Highly chrystallized; via pyrolysis of metal compound dispersed in inert gas; reducing atmosphere; conductor paste for thick film carmaic electronics |
| 01/03/2002 | US20020000034 Continuous processing of thin-film batteries and like devices |
| 01/03/2002 | DE10104204A1 Halbleiter-Vorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 01/03/2002 | DE10026743C1 Substrat zur Aufnahme einer Schaltungsanordnung Substrate for receiving a circuit arrangement |
| 01/02/2002 | EP1168906A1 Power module with electronic power components and production method thereof |
| 01/02/2002 | EP1168607A2 An on-chip signal filter with bond wire inductors |
| 01/02/2002 | EP1168447A2 Multi-layered semiconductor device and method |
| 01/02/2002 | EP1168446A2 Housing semiconductor chips |
| 01/02/2002 | EP1168444A2 Electronic or opto-electronic device in a package made from plastic and method of variation of the impedance of a connection wiring conductor of such a device |
| 01/02/2002 | EP1168443A2 Process for the manufacture of a dielectric antifuse structure |
| 01/02/2002 | EP1168442A2 Integrated circuit with high-Q inductor and high compactness |
| 01/02/2002 | EP1168441A2 Multi-layer wiring substrate and semiconductor device using the multi-layer wiring substrate |
| 01/02/2002 | EP1168440A1 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same |
| 01/02/2002 | EP1168439A2 Gold bond wire for a semiconductor device |
| 01/02/2002 | EP1168438A2 High thermal conductivity composite material, and method for producing the same |
| 01/02/2002 | EP1168437A2 Semiconductor device |
| 01/02/2002 | EP1168436A2 Polymer and ceramic composite electronic substrates |
| 01/02/2002 | EP1168433A2 A method of manufacturing a wiring structure in a semiconductor device |
| 01/02/2002 | EP1168432A2 Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect |
| 01/02/2002 | EP1168431A2 Process for the manufacture of a wiring for contact holes |
| 01/02/2002 | EP1168430A1 Semiconductor device and method of manufacturing the same |
| 01/02/2002 | EP1168429A1 Integrated circuit chip and method for mounting an integrated circuit chip to a circuit board |
| 01/02/2002 | EP1168426A2 Method of plasma depositing a low dielectric constant insulating film |
| 01/02/2002 | EP1168425A2 Method for selectively etching a SiOF film |
| 01/02/2002 | EP1168240A2 Connection by depositing a viscous material following the relief shape |
| 01/02/2002 | EP1168207A2 Semiconductor integrated circuit and semiconductor integrated circuit wiring layout method |
| 01/02/2002 | EP1167559A1 Composite material and use thereof |
| 01/02/2002 | EP1167457A2 Heat conductive silicone composition and semiconductor device |
| 01/02/2002 | EP1167423A2 Polyimide silicone resin, solution containing it, and polyimide silicone resin film |
| 01/02/2002 | EP1167291A1 Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus |
| 01/02/2002 | EP1167281A2 Chip scale surface-mountable packaging method for electronic and MEMS devices |
| 01/02/2002 | EP1167068A1 Non-contact data carrier and ic chip |
| 01/02/2002 | EP1166361A1 Apparatus and method for an integrated circuit having high q reactive components |
| 01/02/2002 | EP1166355A1 Multi-chip module |
| 01/02/2002 | EP1166354A1 Cooling system for pulsed power electronics |
| 01/02/2002 | EP1166201A1 Character input device based on a two-dimensional movement sensor |
| 01/02/2002 | EP1165311A1 Multilayer ceramic circuit boards with embedded resistors |
| 01/02/2002 | EP1127838A9 Flip-chip assembly of protected micromechanical devices |
| 01/02/2002 | EP1054844B1 Composite |
| 01/02/2002 | EP0912996B1 Integrated circuit which uses an etch stop for producing staggered interconnect lines |
| 01/02/2002 | EP0856198B1 Polymer stud-matrix housing for microwave circuit arrangements |
| 01/02/2002 | EP0664925B1 Interconnection structure for integrated circuits and method for making same |
| 01/02/2002 | EP0584349B1 Process and device for three-dimensional interconnection of housings for electronic components |
| 01/02/2002 | CN2469555Y Metal integrated radiator with fined folded bottom |
| 01/02/2002 | CN2469554Y Cold energy conducting component of ice-bladder for semiconductor electronic refrigeration |
| 01/02/2002 | CN2469225Y Fluid-guiding type electric fan |
| 01/02/2002 | CN1329755A Semiconductor device, method of manufacture thereof, and electronic device |
| 01/02/2002 | CN1329754A 高频功率晶体管器件 A high frequency power transistor device |
| 01/02/2002 | CN1329752A Semiconductor copper bond pad surface protection |
| 01/02/2002 | CN1329749A A method and apparatus for transport and tracking of electronic component |
| 01/02/2002 | CN1329721A Photoetching contact elements |
| 01/02/2002 | CN1329395A Package sealing method, method for manufacturing module fr electronic device sealing device and packafge element |
| 01/02/2002 | CN1329367A Semiconductor device and manufacturing method thereof |
| 01/02/2002 | CN1329362A Mixed IC device |
| 01/02/2002 | CN1329361A Application of phase transformation material in radiator for electronic element and device |
| 01/02/2002 | CN1329261A Platform and optical module, and producing method and optical transmission device |
| 01/02/2002 | CN1329120A Heat conductive electronic pouring sealant |
| 01/02/2002 | CN1077355C Container mounting structure for oscillator |
| 01/02/2002 | CN1077121C Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith |
| 01/02/2002 | CN1076998C Soft solder and electronic component using the same |
| 01/01/2002 | US6335884 Semiconductor memory device and defect remedying method thereof |
| 01/01/2002 | US6335863 Package for semiconductors, and semiconductor module that employs the package |
| 01/01/2002 | US6335862 Multilayer printed wiring board provided with injection hole for thermally conductive filler |
| 01/01/2002 | US6335669 RF circuit module |
| 01/01/2002 | US6335629 Test fixture having an opening for exposing the back of a semiconductor chip and testing module comprising the same |
| 01/01/2002 | US6335626 Method and device for determining a parameter for a metallization bath |
| 01/01/2002 | US6335571 Semiconductor flip-chip package and method for the fabrication thereof |
| 01/01/2002 | US6335570 Semiconductor device and manufacturing method thereof |
| 01/01/2002 | US6335569 For use in a semiconductor device |
| 01/01/2002 | US6335568 Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment |
| 01/01/2002 | US6335567 Semiconductor device having stress reducing laminate and method for manufacturing the same |
| 01/01/2002 | US6335566 Semiconductor device and an electronic device |
| 01/01/2002 | US6335565 Semiconductor device |
| 01/01/2002 | US6335564 Single Paddle having a semiconductor device and a passive electronic component |
| 01/01/2002 | US6335563 Semiconductor device, method of fabricating the same, circuit board, and electronic device |
| 01/01/2002 | US6335561 Semiconductor device having a passivation film |