| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/08/2002 | US6337515 Wiring structure in semiconductor device and method for forming the same |
| 01/08/2002 | US6337513 Chip packaging system and method using deposited diamond film |
| 01/08/2002 | US6337512 Semiconductor module |
| 01/08/2002 | US6337511 LOC semiconductor assembled with room temperature adhesive |
| 01/08/2002 | US6337510 Stackable QFN semiconductor package |
| 01/08/2002 | US6337507 Silicide agglomeration fuse device with notches to enhance programmability |
| 01/08/2002 | US6337506 Semiconductor memory device capable of performing stable operation for noise while preventing increase in chip area |
| 01/08/2002 | US6337505 Semiconductor device and method for fabricating the same |
| 01/08/2002 | US6337502 Method and circuit for minimizing the charging effect during manufacture of semiconductor devices |
| 01/08/2002 | US6337445 Composite connection structure and method of manufacturing |
| 01/08/2002 | US6337276 Methods of forming a copper wiring in a semiconductor device using chemical vapor deposition |
| 01/08/2002 | US6337257 Semiconductor device and method of manufacturing the same |
| 01/08/2002 | US6337239 Layer configuration with a material layer and a diffusion barrier which blocks diffusing material components and process for producing a diffusion barrier |
| 01/08/2002 | US6337228 Low-cost printed circuit board with integral heat sink for semiconductor package |
| 01/08/2002 | US6337226 Semiconductor package with supported overhanging upper die |
| 01/08/2002 | US6337151 Semiconductors |
| 01/08/2002 | US6337123 Multilayered ceramic substrate and method of producing the same |
| 01/08/2002 | US6337122 Stereolithographically marked semiconductors devices and methods |
| 01/08/2002 | US6336974 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid |
| 01/08/2002 | US6336973 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid |
| 01/08/2002 | US6336848 Apparatus for polishing leads of a semiconductor package |
| 01/08/2002 | US6336499 CPU heat sink mounting structure |
| 01/08/2002 | US6336498 Leaf piece structure for heat dissipater |
| 01/08/2002 | US6336497 Self-recirculated heat dissipating means for cooling central processing unit |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/08/2002 | US6336262 Process of forming a capacitor with multi-level interconnection technology |
| 01/08/2002 | CA2241530C Conductive elastomers and methods for fabricating the same |
| 01/07/2002 | CA2352513A1 Manufacturing process for a power electronic component, and power electronic component thus obtained |
| 01/03/2002 | WO2002001931A1 Multilayer substrate module and portable wireless terminal |
| 01/03/2002 | WO2002001716A1 Saw device |
| 01/03/2002 | WO2002001648A1 Semiconductor structure, device, circuit, and process |
| 01/03/2002 | WO2002001639A2 Substrate and module |
| 01/03/2002 | WO2002001638A2 Microelectronic packages including reactive components, and methods of fabricating the same |
| 01/03/2002 | WO2002001637A2 Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs |
| 01/03/2002 | WO2002001636A1 Process for the manufacture of printed circuit boards with plated resistors |
| 01/03/2002 | WO2002001635A2 Electronic component |
| 01/03/2002 | WO2002001634A2 System support for semiconductor chips and electronic components and method for producing a system support and electronic components |
| 01/03/2002 | WO2002001633A1 Miniature microdevice package and process for making thereof |
| 01/03/2002 | WO2002001632A2 Interconnection for accomodating thermal expansion for low elastic modulus dielectrics |
| 01/03/2002 | WO2002001630A2 Hermetic high frequency module and method for producing the same |
| 01/03/2002 | WO2002001629A1 Semiconductor device and method of manufacturing |
| 01/03/2002 | WO2002000441A1 Method for marking a device using a green laser |
| 01/03/2002 | WO2001056063A3 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 01/03/2002 | US20020001981 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 01/03/2002 | US20020001973 To form a hydrophobic coating on the film, using a surface modification agent such as oligomer or polymer reactive with silanols on the silica film; dielectric films and integrated circuits |
| 01/03/2002 | US20020001966 Process for producing semiconductor package and structure thereof |
| 01/03/2002 | US20020001960 Material removal method for forming a structure |
| 01/03/2002 | US20020001959 Method of manufacturing semiconductor device, and semiconductor device manufactured thereby |
| 01/03/2002 | US20020001948 Method of manufacturing a semiconductor device |
| 01/03/2002 | US20020001946 Method and fabricating metal interconnection with reliability using ionized physical vapor deposition |
| 01/03/2002 | US20020001939 Method of manufacturing semiconductor devices |
| 01/03/2002 | US20020001938 Process for fabricating semiconductor integrated circuit device having polycide line and impurity region respectively exposed to contact holes different in depth |
| 01/03/2002 | US20020001937 Semiconductor package board using a metal base |
| 01/03/2002 | US20020001936 Semiconductor device and production method for the same |
| 01/03/2002 | US20020001922 Wafer level fabrication and assembly of chip scale packages |
| 01/03/2002 | US20020001908 To reduce the diffusion of fluorine atoms during the anneal, forming a diffusion barrier layer of titanium nitride doped with boron |
| 01/03/2002 | US20020001885 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location, Forming an electrical interconnection with a transistor source/drain region, and integrated circuitry |
| 01/03/2002 | US20020001882 Method for adhering and sealing a silicon chip in an integrated circuit package |
| 01/03/2002 | US20020001880 High-frequency module, method of manufacturing thereof and method of molding resin |
| 01/03/2002 | US20020001879 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 01/03/2002 | US20020001876 Forming a conductive layer, having conductive lines with gaps, over a semiconductor substrate, depositing afluorosilcated glass layer, by high density plasma chemical vapor depositon over patterned conductive layer, filling gap |
| 01/03/2002 | US20020001874 Increased stability and acceptable lumen maintenance over the course of the lamp life, fluorescent lighting |
| 01/03/2002 | US20020001873 Chip scale surface-mountable packaging method for electronic and MEMS devices |
| 01/03/2002 | US20020001872 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
| 01/03/2002 | US20020001865 Antifuse structures with improved manufacturability |
| 01/03/2002 | US20020001747 Solid state electronics |
| 01/03/2002 | US20020001746 Low-temperature fabrication of thin-film energy-storage devices |
| 01/03/2002 | US20020001720 Adhesives; coatings; encapsulation |
| 01/03/2002 | US20020001688 Sheet resin composition and process for manufacturing semiconductor device therewith |
| 01/03/2002 | US20020001670 Low cost electroless plating process for single chips and wafer parts and products obtained thereof |
| 01/03/2002 | US20020001214 Two channel memory system having shared control and address bus and memory modules used therefor |
| 01/03/2002 | US20020001180 Heat sink and memory module with heat sink |
| 01/03/2002 | US20020001178 Semiconductor device and method of forming the same. |
| 01/03/2002 | US20020001177 Power module having electronic power components, and a method of manufacturing such a module |
| 01/03/2002 | US20020001176 Cooling unit for cooling heat generating component and electronic apparatus equipped with the cooling unit |
| 01/03/2002 | US20020000906 Resistor array board |
| 01/03/2002 | US20020000895 Electronic component utilizing face-down mounting |
| 01/03/2002 | US20020000829 Test insert containing vias for interfacing a device containing contact bumps with a test substrate |
| 01/03/2002 | US20020000677 Part maintenance device of semiconductor processing system and method for operating the same |
| 01/03/2002 | US20020000676 Resin-sealed semiconductor device and method of manufacturing the device |
| 01/03/2002 | US20020000674 Semiconductor device and process for production thereof |
| 01/03/2002 | US20020000673 Mask repattern process |
| 01/03/2002 | US20020000672 Plastic-packaged semiconductor device including a plurality of chips |
| 01/03/2002 | US20020000671 Bonding over integrated circuits |
| 01/03/2002 | US20020000669 Device comprising thermally stable, low dielectric constant material |
| 01/03/2002 | US20020000668 Semiconductor device |
| 01/03/2002 | US20020000667 Method of manufacturing an insulation film in a semiconductor device |
| 01/03/2002 | US20020000666 Self-repairing interconnections for electrical circuits |
| 01/03/2002 | US20020000665 Semiconductor device conductive bump and interconnect barrier |
| 01/03/2002 | US20020000664 Silicon nitride composite hdp/cvd process |
| 01/03/2002 | US20020000663 Semiconductor device and its manufacturing method |
| 01/03/2002 | US20020000661 Method for fabricating metal wiring and the metal wiring |
| 01/03/2002 | US20020000660 Contact structure having a diffusion barrier |
| 01/03/2002 | US20020000659 A semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film |
| 01/03/2002 | US20020000658 Semiconductor device and method of manufacturing the same |
| 01/03/2002 | US20020000657 Plated chrome solder dam for high power mmics |
| 01/03/2002 | US20020000656 Ball grid array package and a packaging process for same |
| 01/03/2002 | US20020000655 Semiconductor device and method for manufacturing the same |
| 01/03/2002 | US20020000654 Semiconductor device |
| 01/03/2002 | US20020000653 Method for forming an aluminum contact |