| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/10/2002 | US20020004297 Advance metallization process |
| 01/10/2002 | US20020004296 Electrical and thermal contact for use in semiconductor devices |
| 01/10/2002 | US20020004288 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
| 01/10/2002 | US20020004283 Method of forming an alignment feature in or on a multi-layered semiconductor structure |
| 01/10/2002 | US20020004279 Capacitor forming methods and capacitor constructions |
| 01/10/2002 | US20020004258 A pendulum motor having a stator and a cantilever beam moveable by an electrostatic force to predetermined positions relative to a supporting structure. A micro electro mechanical system (MEMS) mechanism is formed on a |
| 01/10/2002 | US20020004257 Semiconductor device and process for fabricating the same |
| 01/10/2002 | US20020004251 Method of making a semiconductor radiation emitter package |
| 01/10/2002 | US20020004250 Semiconductor device manufacturing method |
| 01/10/2002 | US20020004167 Device enclosures and devices with integrated battery |
| 01/10/2002 | US20020004163 IC device, circuit board and IC assembly |
| 01/10/2002 | US20020004139 Vapor deposition; overcoating semiconductor substrate |
| 01/10/2002 | US20020003694 Vertical surface mount apparatus with thermal carrier |
| 01/10/2002 | US20020003693 Heat sink |
| 01/10/2002 | US20020003692 Electronic module |
| 01/10/2002 | US20020003691 High performance heat exchange assembly |
| 01/10/2002 | US20020003690 Heat sink capable of having a fan mounted aslant to the lateral side thereof |
| 01/10/2002 | US20020003425 Apparatus and method for testing fuses |
| 01/10/2002 | US20020003310 More robust alignment mark design |
| 01/10/2002 | US20020003309 Semiconductor chip having pads with plural different junction type |
| 01/10/2002 | US20020003308 Semiconductor chip package and method for fabricating the same |
| 01/10/2002 | US20020003307 Semiconductor device and method for fabricating the device |
| 01/10/2002 | US20020003306 Method for reducing stress-induced voids for 0.25u and smaller semiconductor chip technology by annealing interconnect lines and using low bias voltage and low interlayer dielectric deposition rate and semiconductor chip made thereby |
| 01/10/2002 | US20020003305 Semiconductor integrated circuit device including an interlayer insulating film formed under a bonding pad and arranged to prevent peeling of the bonding pad |
| 01/10/2002 | US20020003304 Semiconductor device having multilevel interconnection |
| 01/10/2002 | US20020003303 Multi-layer interconnect |
| 01/10/2002 | US20020003302 Semiconductor device and method for producing the same |
| 01/10/2002 | US20020003301 Method of connecting a die in an integrated circuit module |
| 01/10/2002 | US20020003300 Semiconductor apparatus and electronic system |
| 01/10/2002 | US20020003299 Chip carrier and method of manufacturing and mounting the same |
| 01/10/2002 | US20020003298 High frequency package, wiring board, and high frequency module |
| 01/10/2002 | US20020003297 Vertically integrated semiconductor configuration |
| 01/10/2002 | US20020003295 Support matrix with bonding channel for integrated semiconductors, and method for producing it |
| 01/10/2002 | US20020003294 Semiconductor die assembly having leadframe decoupling characters |
| 01/10/2002 | US20020003293 Semiconductor device and method for fabricating same |
| 01/10/2002 | US20020003292 Preplating of semiconductor small outline no-lead leadframes |
| 01/10/2002 | US20020003291 Semiconductor package with conductor impedance selected during assembly |
| 01/10/2002 | US20020003288 Semiconductor apparatus and method for manufacturing the same |
| 01/10/2002 | US20020003280 Electric fuse whose dielectric breakdown resistance is controlled by injecting impurities into an insulating film of a capacitor structure, and a method for manufacturing the same |
| 01/10/2002 | US20020003278 Semiconductor configuration having an optical fuse |
| 01/10/2002 | US20020003259 Semiconductor device and method of fabricating same |
| 01/10/2002 | US20020003239 Semiconductor structure and device including a carbon film and method of forming the same |
| 01/10/2002 | US20020003238 Structure including cubic boron nitride films and method of forming the same |
| 01/10/2002 | US20020003225 Slurry includes abrasive particles have a small particle size, narrow size distribution and a spherical morphology, and the particles are substantially unagglomerated, selected from silica, alumina, zirconia, ceria etc. and mixture |
| 01/10/2002 | US20020003160 Components with conductive solder mask layers |
| 01/10/2002 | US20020003130 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths |
| 01/10/2002 | US20020003101 Tray for semiconductor integrated circuit device |
| 01/10/2002 | US20020003048 Metal interconnections and active matrix substrate using the same |
| 01/10/2002 | DE19612760C2 Trägerplatte und Druckkopf mit dieser Trägerplatte Support plate and pressure head with this carrier plate |
| 01/10/2002 | DE10129032A1 HF-Modul RF module |
| 01/10/2002 | DE10107710A1 Halbleitervorrichtung Semiconductor device |
| 01/10/2002 | DE10031843A1 Elektrisches oder opto-elektrisches Bauelement mit einer Verpackung aus Kunststoff und Verfahren zur Variation der Impedanz einer Anschlussleitung eines solchen Bauelements Electrical or opto-electrical device with a plastic package and method for varying the impedance of a terminal lead such a component |
| 01/10/2002 | DE10031762A1 Elektronisches Bauelement Electronic component |
| 01/10/2002 | DE10031407A1 Hermetic high-frequency module and method for producing it has a ceramic casing base and a ceramic casing cover with an adjusting device for positioning in a hollow conductor on the casing base. |
| 01/10/2002 | DE10030445A1 Verbindungselement Connecting element |
| 01/10/2002 | DE10030444A1 Verfahren zur Herstellung einer dielektrischen Antifuse-Struktur A process for producing a dielectric antifuse structure |
| 01/10/2002 | DE10029630A1 Device for protection of electronic modules from electrostatic discharge by provision of leads with stepped surge impedances |
| 01/10/2002 | CA2352722A1 Corrugated matrix heat sink for cooling electronic components |
| 01/09/2002 | EP1170796A2 High frequency carrier with an adapted interconnect structure |
| 01/09/2002 | EP1170795A2 Electronic component with side contacts and associated method of fabrication |
| 01/09/2002 | EP1170794A1 Method of fabricating a power electronic component and power electronic component obtained thereby |
| 01/09/2002 | EP1170793A2 Support matrix with a bonding channel for an integrated circuit and manufacturing method thereof |
| 01/09/2002 | EP1170792A2 Metalization for semiconductor structure and corresponding manufacturing process |
| 01/09/2002 | EP1170789A1 Ion current density measuring method and instrument, and semiconductor device manufacturing method |
| 01/09/2002 | EP1170784A1 Semiconductor device and its production method |
| 01/09/2002 | EP1170335A2 Thermoplastic resin composition |
| 01/09/2002 | EP1169739A1 Semiconductor device with a diode, and method of manufacturing such a device |
| 01/09/2002 | EP1169735A1 Semiconductor radiation emitter package |
| 01/09/2002 | EP1169734A1 Semiconductor device with deep substrate contacts |
| 01/09/2002 | EP1169733A1 Method for filling gaps on a semiconductor wafer |
| 01/09/2002 | EP1169491A1 Low dielectric nano-porous material obtainable from polymer decomposition |
| 01/09/2002 | EP1049905A4 Multi-mode, two-phase cooling module |
| 01/09/2002 | EP1047523B1 Method for producing a lead-free substrate |
| 01/09/2002 | EP1000531B1 Heat sink |
| 01/09/2002 | EP0827632B1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
| 01/09/2002 | CN2470958Y Semiconductor inhibiting grating |
| 01/09/2002 | CN2470957Y Improved array-plastic for net for ball games |
| 01/09/2002 | CN2470956Y Electric-device housing |
| 01/09/2002 | CN1330789A Semiconductor device and production method theref |
| 01/09/2002 | CN1330580A Laser processing |
| 01/09/2002 | CN1330435A Connecting component and its assembling mechanism |
| 01/09/2002 | CN1330405A Semiconductor device and manufacturing method for semiconductor device |
| 01/09/2002 | CN1330404A Gold wire for semiconductor device bonded connecting |
| 01/09/2002 | CN1330403A Polymer-ceramic composite electronic substrate |
| 01/09/2002 | CN1330398A Tube core level encapsulation and manufacturing method thereof |
| 01/09/2002 | CN1330396A Method for dipositing copper on barrier layer |
| 01/09/2002 | CN1330301A Method for making combined heat sink seat and its product using the method |
| 01/09/2002 | CN1330300A Electronic equipment, expanding equipment for extending function of the electronic equipment |
| 01/09/2002 | CN1329956A Tungsten-copper composite powder |
| 01/09/2002 | CN1329955A Tungsten-copper composite powder |
| 01/09/2002 | CN1077524C Power change-over device for electric driven car |
| 01/08/2002 | US6337796 Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device |
| 01/08/2002 | US6337661 High frequency communication device |
| 01/08/2002 | US6337593 Semiconductor integrated circuit |
| 01/08/2002 | US6337521 Semiconductor device and a method of manufacturing the same |
| 01/08/2002 | US6337520 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof |
| 01/08/2002 | US6337519 Semiconductor device having a multilayered interconnection structure |
| 01/08/2002 | US6337518 Integrated circuit interconnect structure comprising substrate with electroconductive layer, layer of non-fluorinated diamond-like carbon, graded layer, layer of amorphous fluorinated carbon, electroconductive layer, metal connector |
| 01/08/2002 | US6337517 Semiconductor device and method of fabricating same |
| 01/08/2002 | US6337516 Technique for extending the limits of photolithography |