| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/17/2002 | US20020005086 High density |
| 01/17/2002 | DE10033352A1 Method of manufacturing electronic module or subassembly, has second conductor path connected via thermally plated-through regions to first conductor path |
| 01/17/2002 | DE10032792A1 Verfahren zur Herstellung einer Verdrahtung für Kontaktlöcher A process for producing a wiring for contact holes |
| 01/17/2002 | DE10032050A1 Kühlvorrichtung für Computer A cooling apparatus for computer |
| 01/17/2002 | DE10031658A1 Microwave module comprising substrate with HF and LF layers forming distribution network structures, includes intervening insulating layer |
| 01/17/2002 | DE10031465A1 Cooling device for circuit arrangement esp. for power semiconductor circuits etc., has heat sink with upper face through which it can mechanically and thermally contact the circuit being cooled |
| 01/17/2002 | DE10031204A1 Systemträger für Halbleiterchips und elektronische Bauteile sowie Herstellungsverfahren für einen Systemträger und für elektronische Bauteile Support system for semiconductor chips and electronic components and manufacturing method for a system and support for electronic components |
| 01/17/2002 | DE10030443A1 Production of a heat deviating surface of a component used in the production of a semiconductor element comprises inserting trenches into the component using an etching process |
| 01/17/2002 | DE10030442A1 Connecting element used in an integrated circuit to activate redundant storage cells in DRAMs has a layer structure formed by a dielectric layer and a silicon layer |
| 01/17/2002 | DE10029269A1 Electronic component used as semiconductor component comprises a housing and a first substrate having at least one integrated circuit with contact surfaces connected to electrodes of the parts of the component via conducting pathways |
| 01/17/2002 | CA2415666A1 Uv laser system and method for single pulse severing of ic fuses |
| 01/16/2002 | EP1172854A2 Semiconductor memory with random access |
| 01/16/2002 | EP1172853A1 Device for shielding electronic circuit for aircraft |
| 01/16/2002 | EP1172852A2 Corrugated matrix heat sink for cooling electronic components |
| 01/16/2002 | EP1172851A2 Semiconductor device having heat spreader attached thereto and method of manufacturing the same |
| 01/16/2002 | EP1172850A2 Semiconductor device having at least three power terminals superposed on each other |
| 01/16/2002 | EP1172846A2 Method of plasma depositing a low dielecric constant insulating film on a copper surface |
| 01/16/2002 | EP1172845A2 Method for treating dielectric layers with low dielectric constant to reduce oxygen diffusion |
| 01/16/2002 | EP1171917A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture |
| 01/16/2002 | EP1171915A1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 01/16/2002 | EP1171914A1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| 01/16/2002 | EP1171913A1 Damascene structure and method for forming a damascene structure |
| 01/16/2002 | EP1171912A1 Method for the vertical integration of electric components by |
| 01/16/2002 | EP1171911A1 Lead frame moisture barrier for molded plastic electronic packages |
| 01/16/2002 | EP1171798A1 Method and apparatus for monitoring electrostatic discharge effects |
| 01/16/2002 | CN2472348Y Fastener for CPU on radiator |
| 01/16/2002 | CN2472347Y Radiating fan for electric device with flow guider |
| 01/16/2002 | CN2472346Y CPU radiating component with approaching outlet |
| 01/16/2002 | CN2472345Y Computer chip radiating structure |
| 01/16/2002 | CN2472344Y Laminated integrated circuit chip constructive arrangement |
| 01/16/2002 | CN2472343Y Thin integrated circuit chip constructive arrangement |
| 01/16/2002 | CN1331841A Windowed non-ceramic package having embedded frame |
| 01/16/2002 | CN1331793A Device for temp control |
| 01/16/2002 | CN1331512A Mfg. method of electronic components |
| 01/16/2002 | CN1331493A Ultra-small integrated circuit of inductive component including high quality factor |
| 01/16/2002 | CN1331492A Semiconductor device protecting layer having reinforced adhesion force to polymeric material |
| 01/16/2002 | CN1331491A Semiconductor integrated circuit and distributing of semiconductor integrated circuit |
| 01/16/2002 | CN1331490A Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method |
| 01/15/2002 | US6339728 Method for marking semiconductor device using a green laser |
| 01/15/2002 | US6339541 Architecture for high speed memory circuit having a relatively large number of internal data lines |
| 01/15/2002 | US6339534 Compliant leads for area array surface mounted components |
| 01/15/2002 | US6339533 Heat dissipating assembly |
| 01/15/2002 | US6339358 Semiconductor integrated circuit |
| 01/15/2002 | US6339261 Semiconductor device and process of producing same |
| 01/15/2002 | US6339260 Wire arrayed chip size package |
| 01/15/2002 | US6339258 Low resistivity tantalum |
| 01/15/2002 | US6339257 Semiconductor device |
| 01/15/2002 | US6339256 Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
| 01/15/2002 | US6339255 Stacked semiconductor chips in a single semiconductor package |
| 01/15/2002 | US6339253 Semiconductor package |
| 01/15/2002 | US6339252 Electronic device package and leadframe |
| 01/15/2002 | US6339250 Semiconductor device |
| 01/15/2002 | US6339231 Gate commutated turn-off thyristor module |
| 01/15/2002 | US6339230 Method for manufacturing a liquid crystal display |
| 01/15/2002 | US6339229 Test structure for insulation-film evaluation |
| 01/15/2002 | US6339210 Circuit and method for heating an adhesive to package or rework a semiconductor die |
| 01/15/2002 | US6339197 Multilayer printed circuit board and the manufacturing method |
| 01/15/2002 | US6339191 Prefabricated semiconductor chip carrier |
| 01/15/2002 | US6339120 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| 01/15/2002 | US6339029 Integrated circuit device; substrate multilayers; etching via through layer for depositing barrier, copper layer; annealing, electrochemical deposition improving etching capability |
| 01/15/2002 | US6339026 Of at least one of rb, sr, fr, and ra; exposure to slurry and a polishing pad; electrolytic substance-containing liquid exposure; electrochemical degradation prevention at array of phs |
| 01/15/2002 | US6339024 Reinforced integrated circuits |
| 01/15/2002 | US6339020 Alternating layers of copper and metal carbide forming a multilayer structure with a cubic or metastable cubic structure |
| 01/15/2002 | US6339019 Method of manufacturing semiconductor device having reduced connection failure between wiring layers |
| 01/15/2002 | US6338985 Making chip size semiconductor packages |
| 01/15/2002 | US6338984 Encaapsulation signal leads, die pad, supports |
| 01/15/2002 | US6338980 Method for manufacturing chip-scale package and manufacturing IC chip |
| 01/15/2002 | US6338976 Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosion |
| 01/15/2002 | US6338973 Semiconductor device and method of fabrication |
| 01/15/2002 | US6338906 Sintering ceramic matrices and interconnecting pore structure |
| 01/15/2002 | US6338903 Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the composition |
| 01/15/2002 | US6338893 Conductive paste and ceramic printed circuit substrate using the same |
| 01/15/2002 | US6338813 Molding method for BGA semiconductor chip package |
| 01/15/2002 | US6338809 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 01/15/2002 | US6338767 Circuit component built-in module and method for producing the same |
| 01/15/2002 | US6338251 Mixed thermoelectric cooling apparatus and method |
| 01/15/2002 | CA2244868C Grafted thermoplastic elastomer barrier layer |
| 01/15/2002 | CA2233481C Integrated circuit device cooling structure |
| 01/15/2002 | CA2213542C Chip size package |
| 01/10/2002 | WO2002003463A2 Electronic package having embedded capacitors and method of fabrication therefor |
| 01/10/2002 | WO2002003461A2 Ball limiting metallurgy for input/outputs and methods of fabrication |
| 01/10/2002 | WO2002003460A2 Semiconductor chip module with a protective film |
| 01/10/2002 | WO2002003457A2 Via first dual damascene process for copper metallization |
| 01/10/2002 | WO2002003456A2 Semiconductor device and method of formation |
| 01/10/2002 | WO2002003446A1 Method and apparatus for applying a protective over-coating to a ball-grid-array (bga) structure |
| 01/10/2002 | WO2002003442A1 Fabrication process of a semiconductor device |
| 01/10/2002 | WO2002003423A2 Capacitor and capacitor contact process for stack capacitor drams |
| 01/10/2002 | WO2002003422A2 Integrated circuits packaging system and method |
| 01/10/2002 | WO2002003421A2 Semiconductor chip package with embedded capacitors |
| 01/10/2002 | WO2002003183A2 Cooling device for a computer |
| 01/10/2002 | WO2001047015A3 Electronic component protection devices and methods |
| 01/10/2002 | WO2001036990A3 Wafer level interposer |
| 01/10/2002 | WO2001015217A3 Method for producing a semiconductor chip with an electrical property that can be adjusted after the silicon process |
| 01/10/2002 | WO2000019490A3 Dummy fill cell for reducing layer-to-layer interaction |
| 01/10/2002 | US20020004930 Semiconductor device having definite size of input/output blocks and its designing method |
| 01/10/2002 | US20020004329 Socket for removably mounting an electronic part |
| 01/10/2002 | US20020004324 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020004310 Method of prefilling of keyhole at the top metal level with photoresist to prevent passivation damage even for a severe top metal rule and device manufactured thereby |
| 01/10/2002 | US20020004299 Method of fabricating a contract structure having a composite barrier layer between a platinium layer and a polysilicon plug |