| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2002 | US6340844 Semiconductor device having improved contact hole structure, and method of manufacturing the same |
| 01/22/2002 | US6340843 Plasma CVD dielectric film and process for forming the same |
| 01/22/2002 | US6340842 Semiconductor device in a recess of a semiconductor plate |
| 01/22/2002 | US6340841 Build-up board package for semiconductor devices |
| 01/22/2002 | US6340840 Lead frame and production method thereof, and semiconductor device and fabrication method thereof |
| 01/22/2002 | US6340839 Hybrid integrated circuit |
| 01/22/2002 | US6340837 Semiconductor device and method of fabricating the same |
| 01/22/2002 | US6340823 Semiconductor wafer having a multi-test circuit, and method for manufacturing a semiconductor device including multi-test process |
| 01/22/2002 | US6340822 Article comprising vertically nano-interconnected circuit devices and method for making the same |
| 01/22/2002 | US6340806 Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
| 01/22/2002 | US6340797 Printed circuit board having signal patterns of varying widths |
| 01/22/2002 | US6340793 Semiconductor device |
| 01/22/2002 | US6340792 Mold cap for semiconductor device mold package |
| 01/22/2002 | US6340642 Cleaning surface to remove oxide; drying the surface by blowing a non-oxidizing gas thereon; directly applying layer of lacquer onto surface at temperature below 100.degree. c.; drying layer of lacquer; forming conductive structure |
| 01/22/2002 | US6340634 Method of manufacturing an assembly of conductors and a semiconductor device manufactured by means of such an assembly |
| 01/22/2002 | US6340633 Method for ramped current density plating of semiconductor vias and trenches |
| 01/22/2002 | US6340632 Method of manufacturing a semiconductor device |
| 01/22/2002 | US6340631 Method for laying out wide metal lines with embedded contacts/vias |
| 01/22/2002 | US6340618 RF power transistor |
| 01/22/2002 | US6340616 Method for fabricating an integrated electronic circuit and integrated electronic circuit |
| 01/22/2002 | US6340609 Method of forming thin film transistor |
| 01/22/2002 | US6340606 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/22/2002 | US6340435 Integrated low K dielectrics and etch stops |
| 01/22/2002 | US6340056 Flow channel type heat dissipating fin set |
| 01/22/2002 | US6339880 Process for manufacturing heat sink |
| 01/22/2002 | US6339875 Method for removing heat from an integrated circuit |
| 01/22/2002 | CA2077720C Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques |
| 01/21/2002 | CA2353338A1 Folded-fin heat sink manufacturing method and apparatus |
| 01/17/2002 | WO2002005603A1 Multichip module connected to flexible, film-like substrate |
| 01/17/2002 | WO2002005349A1 Electrical passivation of silicon-containing surfaces using organic layers |
| 01/17/2002 | WO2002005347A2 Electronic component and method of manufacture |
| 01/17/2002 | WO2002005346A1 Electronic device with heat conductive encasing device |
| 01/17/2002 | WO2002005345A1 Uv laser system and method for single pulse severing of ic fuses |
| 01/17/2002 | WO2002005317A2 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures |
| 01/17/2002 | WO2002005298A2 Semiconductor inductor and methods for making the same |
| 01/17/2002 | WO2002005294A1 Electrically conductive ink |
| 01/17/2002 | WO2001050198A3 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 01/17/2002 | WO2001047333A3 Integrated convection and conduction heat sink for multiple mounting positions |
| 01/17/2002 | WO2001018860A3 Improved apparatus and methods for integrated circuit planarization |
| 01/17/2002 | US20020007035 Vinyl alcohol modified polydimethylsilanol, dimethyl silandiol-methylsilandiol copolymer, a dimethylvinylsilanol modified polysilicate, a platinum vinylsiloxane, a wetting agent and a thermoconductive filler; enhance heat dissipation |
| 01/17/2002 | US20020006986 Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| 01/17/2002 | US20020006778 RF oscillator apparatus and transceiver apparatus |
| 01/17/2002 | US20020006749 Resin shield circuit device |
| 01/17/2002 | US20020006732 Semiconductor device and method for manufacturing the same |
| 01/17/2002 | US20020006727 Method of forming a metal wiring in a semiconductor device |
| 01/17/2002 | US20020006725 Copper metallurgy in integrated circuits |
| 01/17/2002 | US20020006723 Integrated circuit trenched features and method of producing same |
| 01/17/2002 | US20020006721 Semiconductor Device With Sidewall Spacers Having Minimized Area Contacts |
| 01/17/2002 | US20020006720 Forming barrier layer; then aluminum, germanium, copper alloy |
| 01/17/2002 | US20020006719 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabricatin |
| 01/17/2002 | US20020006718 Compliant semiconductor chip package with fan-out leads and method of making same |
| 01/17/2002 | US20020006717 Method for manufacturing a semiconductor device |
| 01/17/2002 | US20020006690 Semiconductor device and method of fabricating the same |
| 01/17/2002 | US20020006688 Support matrix for integrated semiconductors, and method for producing it |
| 01/17/2002 | US20020006685 Method of manufacturing an electronic power component, and an electronic power component obtained thereby |
| 01/17/2002 | US20020006503 Composite wiring board and manufacturing method thereof |
| 01/17/2002 | US20020006501 Stereolithographically marked semiconductor devices and methods |
| 01/17/2002 | US20020006497 Disk; for the detection of aberrations in semiconductors |
| 01/17/2002 | US20020006375 Resin additive |
| 01/17/2002 | US20020006350 High strength, low expansion |
| 01/17/2002 | US20020005957 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 01/17/2002 | US20020005805 Method of machining glass substrate and method of fabricating high-frequency circuit |
| 01/17/2002 | US20020005729 Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 01/17/2002 | US20020005594 Semiconductor device and method for manufacturing the same |
| 01/17/2002 | US20020005592 Semiconductor device having substrate with die-bonding area and wire-bonding areas |
| 01/17/2002 | US20020005591 Bumpless flip chip assembly with strips-in-via and plating |
| 01/17/2002 | US20020005589 Semiconductor device and production method thereof |
| 01/17/2002 | US20020005587 Semiconductor device and manufacturing method thereof |
| 01/17/2002 | US20020005586 Connection element |
| 01/17/2002 | US20020005584 Semiconductor device |
| 01/17/2002 | US20020005583 Semiconductor device and fabrication process therefor |
| 01/17/2002 | US20020005582 Pad structure for copper interconnection and its formation |
| 01/17/2002 | US20020005579 Semiconductor apparatus and frame used for fabricating the same |
| 01/17/2002 | US20020005578 Press contact type semiconductor device and converter using same |
| 01/17/2002 | US20020005577 Semiconductor device |
| 01/17/2002 | US20020005576 Semiconductor device and method of manufacturing the same |
| 01/17/2002 | US20020005575 Stack package and method for fabricating the same |
| 01/17/2002 | US20020005574 Methods and apparatus for hermetically sealing electronic packages |
| 01/17/2002 | US20020005573 Surface mounting semiconductor device |
| 01/17/2002 | US20020005571 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/17/2002 | US20020005570 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/17/2002 | US20020005569 Contact terminal element, contact terminal device, manufacture thereof, and method of measuring semiconductor device |
| 01/17/2002 | US20020005568 Semiconductor device and method for manufacturing |
| 01/17/2002 | US20020005567 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device |
| 01/17/2002 | US20020005565 Inductor with magnetic material layers |
| 01/17/2002 | US20020005564 Fuse for use in a semiconductor device, and semiconductor devices including the fuse |
| 01/17/2002 | US20020005563 Fuse structure and application thereof for a CMOS sensor |
| 01/17/2002 | US20020005554 Integrated radio frequency circuits |
| 01/17/2002 | US20020005552 Semiconductor device having different field oxide sizes |
| 01/17/2002 | US20020005551 Semiconductor device and method for fabricating the same |
| 01/17/2002 | US20020005541 Low inductance multilayer chip and method for fabricating same |
| 01/17/2002 | US20020005534 Semiconductor memory device and method of manufacturing the same |
| 01/17/2002 | US20020005520 Semiconductor device |
| 01/17/2002 | US20020005507 Conductive paste and printed wiring board using the same |
| 01/17/2002 | US20020005396 UV laser system and method for single pulse severing of IC fuses |
| 01/17/2002 | US20020005295 Multilayered circuit board and method for producing the same |
| 01/17/2002 | US20020005293 Method of mounting a semiconductor device to a substrate and a mounted structure |
| 01/17/2002 | US20020005292 Bump-attached wiring circuit board and method for manufacturing same |
| 01/17/2002 | US20020005272 Cooling system for multichip module |
| 01/17/2002 | US20020005248 Heat sink having bonded cooling fins |