| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/24/2002 | US20020009844 Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry |
| 01/24/2002 | US20020009843 Method for repairing pattern by laser and laser-based pattern repair apparatus |
| 01/24/2002 | US20020009826 Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate |
| 01/24/2002 | US20020009815 Semi-conductor device with test element group for evaluation of interlayer dielectric and process for producing the same |
| 01/24/2002 | US20020009624 Reduction and oxidation reactions in positive and negative liquid electrolytes, without gas evolution at the electrodes; batteries |
| 01/24/2002 | US20020009597 Heat curing an epoxy resin, a phenol compound having two or more phenolic hydroxyl groups and a latent curing agent; shrinkage inhibition; used in mounting of semiconductor devices, such as an LSI circuit, on a circuit substrate |
| 01/24/2002 | US20020009584 Encapsulation using microcellular foamed materials |
| 01/24/2002 | US20020009539 Process for screening features on an electronic substrate with a low viscosity paste |
| 01/24/2002 | US20020008966 Microelectronic contacts with asperities and methods of making same |
| 01/24/2002 | US20020008963 Inter-circuit encapsulated packaging |
| 01/24/2002 | US20020008960 Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus |
| 01/24/2002 | US20020008605 Integrated transformer |
| 01/24/2002 | US20020008598 High-frequency interconnection for circuits |
| 01/24/2002 | US20020008597 Semiconductor circuit device having power and ground lines adapted for high-frequency operation |
| 01/24/2002 | US20020008561 Integrated circuit with relative sense inversion of signals along adjacent parallel signal paths |
| 01/24/2002 | US20020008546 Shield circuit and integrated circuit in which the shield circuit is used |
| 01/24/2002 | US20020008438 System and method for array processing of surface acoustic wave devices |
| 01/24/2002 | US20020008327 Semiconductor devices and their manufacture |
| 01/24/2002 | US20020008326 Electrode structure of a carrier substrate of a semiconductor device |
| 01/24/2002 | US20020008325 Functional device unit and method of producing the same |
| 01/24/2002 | US20020008324 Semiconductor device and method of manufacturing same |
| 01/24/2002 | US20020008323 Semiconductor device with dual damascene wiring |
| 01/24/2002 | US20020008322 Enhanced barrier liner formation for via |
| 01/24/2002 | US20020008320 Semiconductor device and method of making the same, circuit board and electronic equipment |
| 01/24/2002 | US20020008319 Commonly housed diverse semiconductor |
| 01/24/2002 | US20020008318 Semiconductor device |
| 01/24/2002 | US20020008317 Micromechanical enclosure |
| 01/24/2002 | US20020008316 Semiconductor device having heat spreader attached thereto and method of manufacturing the same |
| 01/24/2002 | US20020008315 Semiconductor package and method of fabricating the same |
| 01/24/2002 | US20020008314 Semiconductor integrated circuit and printed wiring substrate provided with the same |
| 01/24/2002 | US20020008313 Substrate mounting an integrated circuit pakage with a deformed lead |
| 01/24/2002 | US20020008312 Semiconductor device |
| 01/24/2002 | US20020008311 Semiconductor device and method of manufacturing the same |
| 01/24/2002 | US20020008308 Open-cavity semiconductor die package |
| 01/24/2002 | US20020008307 Substrate film structure |
| 01/24/2002 | US20020008306 Optical package with dual interconnect capability |
| 01/24/2002 | US20020008300 Antifuse structures, methods, and applications |
| 01/24/2002 | US20020008279 Semiconductor device |
| 01/24/2002 | US20020008270 Diffusion barrier layers and methods of forming same |
| 01/24/2002 | US20020008255 Semiconductor device |
| 01/24/2002 | US20020008254 Semiconductor device |
| 01/24/2002 | US20020008236 Electronic device, and method of patterning a first layer |
| 01/24/2002 | US20020008234 Mixed-signal semiconductor structure, device including the structure, and methods of forming the device and the structure |
| 01/24/2002 | US20020008083 Dry etching method |
| 01/24/2002 | US20020007966 Structure for high speed printed wiring boards with multiple differential impedance-controlled layer |
| 01/24/2002 | US20020007965 Module tape with modules for dual-mode data carriers |
| 01/24/2002 | US20020007964 Printed circuit board and electronic package using same |
| 01/24/2002 | US20020007962 Submount, electronic assembly and process for producing the same |
| 01/24/2002 | US20020007957 Gold wire for semiconductor element connection and semiconductor element connection method |
| 01/24/2002 | US20020007942 Heat sink |
| 01/24/2002 | US20020007936 Folded-fin heatsink manufacturing method and apparatus |
| 01/24/2002 | US20020007935 Cold plate utilizing fin with evaporating refrigerant |
| 01/24/2002 | US20020007905 Method of producing a lead frame with composite film attached, and use of the lead frame |
| 01/24/2002 | US20020007904 Transferable resilient element for packaging of a semiconductor chip and method therefor |
| 01/24/2002 | US20020007641 Pumped liquid cooling system using a phase change refrigerant |
| 01/24/2002 | US20020007555 Plate type heat pipe, method of manufacturing same and cooling apparatus using plate type heat pipe |
| 01/24/2002 | DE10132024A1 Halbleiter-Bauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/24/2002 | DE10034018A1 Support matrix for integrated semiconductors, has frame, conductor track structures, and flowable silicon structures |
| 01/24/2002 | DE10034006A1 Trägermatrix mit Bondkanal für integrierte Halbleiter und Verfahren zu ihrer Herstellung Carrier matrix with channel bonding for integrated semiconductors and methods for their preparation |
| 01/24/2002 | DE10019812A1 Schaltungsanordnung Circuitry |
| 01/24/2002 | CA2416502A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| 01/23/2002 | EP1175138A2 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 01/23/2002 | EP1175135A1 Liquid-cooled heat sink and manufacturing method thereof |
| 01/23/2002 | EP1175134A1 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
| 01/23/2002 | EP1174932A2 Submount, electronic components and method of manufacturing |
| 01/23/2002 | EP1174922A2 Intergrated circuit package with coplanar transmission lines |
| 01/23/2002 | EP1174921A2 Semiconductor device |
| 01/23/2002 | EP1174920A2 Semiconductor package |
| 01/23/2002 | EP1174907A2 Semiconductor apparatus containing a temperature control |
| 01/23/2002 | EP1174456A2 High tg potting compound |
| 01/23/2002 | EP1174455A1 Epoxy resin composition for encapsulating semiconductor |
| 01/23/2002 | EP1174010A1 Heat sink with an integrated component clamping device |
| 01/23/2002 | EP1173893A2 Polycrystalline silicon germanium films for forming micro-electromechanical systems |
| 01/23/2002 | EP1173888A1 Web process interconnect in electronic assemblies |
| 01/23/2002 | EP1173871A1 Semiconductor power component comprising a safety fuse |
| 01/23/2002 | EP1173859A1 Power electronics component with improved thermal properties |
| 01/23/2002 | EP1042946B1 Hybrid circuit with a heat dissipation system |
| 01/23/2002 | CN2473747Y Silver-tin composite LED leading wire frame |
| 01/23/2002 | CN2473746Y Coated heat radiation member |
| 01/23/2002 | CN2473745Y Base board with static protection |
| 01/23/2002 | CN2473669Y Radiation fin structure |
| 01/23/2002 | CN1332888A Vertically integrated semiconductor system |
| 01/23/2002 | CN1332601A Electronic circuit unit |
| 01/23/2002 | CN1332600A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332599A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332598A Printed-wiring board with cavity for mounting electronic component and manufacture thereof |
| 01/23/2002 | CN1332597A Electronic element apparatus and manufacture thereof |
| 01/23/2002 | CN1332512A Improved modular power source structure |
| 01/23/2002 | CN1332475A Heat sink and its manufacture |
| 01/23/2002 | CN1332471A Method for manufacture of semiconductor device |
| 01/23/2002 | CN1332457A Double-channel storage system and storage module of shared control and address bus |
| 01/23/2002 | CN1332398A Computer system and speed-controlling method of cooling fan |
| 01/23/2002 | CN1332265A Electronic line chip |
| 01/23/2002 | CN1078388C Surface mounting type light emitting diode |
| 01/23/2002 | CN1078385C Improved method of die attach |
| 01/22/2002 | US6341071 Stress relieved ball grid array package |
| 01/22/2002 | US6341070 Wafer-scale packing processes for manufacturing integrated circuit (IC) packages |
| 01/22/2002 | US6341065 Heat sink clip |
| 01/22/2002 | US6340894 Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect |
| 01/22/2002 | US6340846 Making semiconductor packages with stacked dies and reinforced wire bonds |