Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/28/2013DE112007000966B4 Dielektrischer Abstandhalter für metallische Verbinder und Verfahren, um dieselben zu bilden A dielectric spacer for metallic connector and method to form the same
11/28/2013DE102013105352A1 Mehrchip-Verpackung und Verfahren zu deren Herstellung A multi-chip packaging and processes for their preparation
11/28/2013DE102013105232A1 Chipgehäuse und Verfahren zum Herstellen eines Chipgehäuses Chip package and method of making a chip package
11/28/2013DE102012208730A1 Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices apparatus and method for producing an opto-electronic device components
11/28/2013DE102012104494A1 Leuchtdiodenvorrichtung Light emitting diode device
11/28/2013DE102009019030B4 Halbleiterbauelement mit einem Träger und einem strukturierten Dielektrikum A semiconductor device comprising a carrier and a structured dielectric
11/28/2013DE102008034164B4 Modul mit Leistung-Halbleiterchip und Verfahren Module with a power semiconductor chip and method
11/28/2013DE102006060768B4 Gehäusebaugruppe, DBC-Plantine im Wafermaßstab und Vorrichtung mit einer Gehäusebaugruppe für Geräte mit hoher Leistungsdichte A housing assembly, DBC Plantine wafer-scale device having a housing assembly and for devices with high power density
11/27/2013EP2667422A2 Semiconductor light emitting device
11/27/2013EP2667409A1 Amplifier circuit with a low inductance bond wire arrangement
11/27/2013EP2667408A2 Natural circulation type cooling apparatus
11/27/2013EP2667141A2 Heat dissipation switch
11/27/2013EP2666745A1 Electronic component package and method of manufacturing the same, and electronic component device
11/27/2013EP2666573A1 Brazing method and brazed structure
11/27/2013CN203312298U Image sensor packaging structure and image sensor module
11/27/2013CN203312290U Diode
11/27/2013CN203312289U #-shaped artificial magnetic conductor for 60 GHz on-chip antenna
11/27/2013CN203312288U TSV outcrop structure
11/27/2013CN203312287U Integrated semiconductor display panel
11/27/2013CN203312286U All card payment smart card carrying belt
11/27/2013CN203312285U Bridge rectifier
11/27/2013CN203312284U Intelligent power module
11/27/2013CN203312283U Diode, electronic device and solar energy junction box with diode
11/27/2013CN203312282U COF output end lead wire structure
11/27/2013CN203312281U Chip package structure with graphene layer
11/27/2013CN203312280U Radiator with air curtain blocking mechanism
11/27/2013CN203312279U Diode
11/27/2013CN203312278U Heat radiating ring for diode
11/27/2013CN203312277U Rapidly-dismountable general transistor clamp for avalanche transistor
11/27/2013CN203312276U Semiconductor device for controlling warping in semiconductor packaging
11/27/2013CN203312275U Semiconductor device with formation of embedded SOP fan-out type packaging
11/27/2013CN203312274U Flexible substrate multilayer packaging device
11/27/2013CN203312273U Improved flexible substrate packaging device
11/27/2013CN203312263U Tool for locking and attaching encapsulation transistor
11/27/2013CN103415995A 电子元器件 Electronic Components
11/27/2013CN103415924A Device mounting structure of semiconductor device
11/27/2013CN103415923A Semiconductor device, and process for manufacturing semiconductor device
11/27/2013CN103415920A 半导体器件 Semiconductor devices
11/27/2013CN103415586A Polyester resin composition for electrical / electronic part-sealing material, sealed product and production method therefor
11/27/2013CN103415572A 可固化组合物 The curable composition
11/27/2013CN103413851A Photovoltaic bypass device and protection circuit, junction box and power generation system respectively comprising photovoltaic bypass device
11/27/2013CN103413806A Pyroelectric sensor packaging structure
11/27/2013CN103413803A Hybrid integrated circuit and manufacturing method thereof
11/27/2013CN103413802A High power consumption chip packaging structure
11/27/2013CN103413801A DFN package lead frame
11/27/2013CN103413800A Silicon substrate switchover plate structure for electronic device packaging
11/27/2013CN103413799A Salient point structure
11/27/2013CN103413798A Chip structure and chip packaging structure
11/27/2013CN103413797A Power semiconductor module assembled through three-dimensional structural units
11/27/2013CN103413796A Substrate/multi-chip-integrated large port interconnection chip and realization method thereof
11/27/2013CN103413795A Semiconductor device packing structure and semiconductor device packing technological process
11/27/2013CN103413794A Radiating packaging structure of semiconductor power device
11/27/2013CN103413793A Cooling fin component applied to CPU
11/27/2013CN103413792A Cooling fin convenient to install
11/27/2013CN103413791A Ceramic copper-coated film heat sink module with good heat dissipation efficiency and manufacturing method thereof
11/27/2013CN103413790A Packaging structure of integrated power control unit
11/27/2013CN103413789A Semiconductor device and method for manufacturing the same
11/27/2013CN103413775A Manufacturing method and device of flexible display device
11/27/2013CN103413767A Packaging-first-etching-second chip upside-upward-installation three-dimensional system-in-package structure and process method
11/27/2013CN103413766A Etching-first-packaging-second upside-upward-installation three-dimensional system-in-package metal circuit board structure and process method
11/27/2013CN103413756A Split gate resistor structure and manufacturing method thereof
11/27/2013CN103413754A Method for processing glass wafer, glass wafer and method for detecting glass wafer
11/27/2013CN102723290B Packaging-first and etching-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
11/27/2013CN102723286B Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
11/27/2013CN102723285B Etching-first and packaging-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
11/27/2013CN102559115B Chip-level bottom filling adhesive and preparation method thereof
11/27/2013CN102376656B Foundation island-free packaging structure without pins on four surfaces and manufacturing method thereof
11/27/2013CN102376590B Chip scale package and production method thereof
11/27/2013CN102231369B High-power heat-dissipation module
11/27/2013CN102217061B Improved wafer level chip scale packaging
11/27/2013CN102195112B Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
11/27/2013CN102176454B Semiconductor device
11/27/2013CN102115833B Gold beryllium alloy material for semiconductor devices and preparation method and application thereof
11/27/2013CN102082107B Method for measuring temperature of chip
11/27/2013CN102034767B Mounting circuit substrate
11/27/2013CN101950754B Image display system
11/27/2013CN101937890B Circuit board having semiconductor chip
11/27/2013CN101872780B Display panel and image display system using same
11/27/2013CN101740579B 垂直型半导体器件 Vertical-type semiconductor device
11/27/2013CN101626003B Semiconductor package and method for packaging semiconductor package
11/26/2013USRE44608 Solder joint flip chip interconnection
11/26/2013US8594756 Superconducting element joint, a process for providing a superconducting element joint and a superconducting cable system
11/26/2013US8593812 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device
11/26/2013US8593805 Portable electronic device and thermal module thereof
11/26/2013US8593770 Protection circuit
11/26/2013US8593582 Active matrix substrate and display device
11/26/2013US8593561 Camera module and method for fabricating the same
11/26/2013US8593001 Patterned semiconductor bases
11/26/2013US8593000 Semiconductor device and manufacturing method thereof
11/26/2013US8592999 Semiconductor chip and method for fabricating the same
11/26/2013US8592998 Thin film wafer level package
11/26/2013US8592997 Molded underfill flip chip package preventing warpage and void
11/26/2013US8592996 Semiconductor device and method of manufacturing the same
11/26/2013US8592995 Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
11/26/2013US8592994 Semiconductor package, core layer material, buildup layer material, and sealing resin composition
11/26/2013US8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
11/26/2013US8592992 Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP
11/26/2013US8592991 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
11/26/2013US8592990 Semiconductor device and method of manufacturing semiconductor device
11/26/2013US8592989 Integrated circuit package system with bump over via
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