| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/2002 | EP1176639A1 Method for contacting a semiconductor chip |
| 01/30/2002 | EP1176638A2 Semiconductor device and packaging method thereof |
| 01/30/2002 | EP1176637A1 Semiconductor integrated circuit and manufacture thereof |
| 01/30/2002 | EP1176635A2 Spring structure and method |
| 01/30/2002 | EP1176226A1 Method of deposition of silicon carbide film in integrated circuit fabrication |
| 01/30/2002 | EP1176159A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 01/30/2002 | EP1175710A1 Wireless article including a plural-turn loop antenna |
| 01/30/2002 | EP1175693A1 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 01/30/2002 | EP1175290A1 Method for manufacturing encapsulated electronical components |
| 01/30/2002 | EP1034555B1 Semiconductor element with defined performance characteristics in the case of failure and method for the production thereof |
| 01/30/2002 | EP0904602B1 Method of manufacturing a carrier element for semiconductor chips |
| 01/30/2002 | EP0760164B1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 01/30/2002 | CN2475141Y Multi-chip encapsulating device |
| 01/30/2002 | CN2475140Y Radiating module |
| 01/30/2002 | CN2475139Y Heat-pipe radiator |
| 01/30/2002 | CN2475138Y Air-cooled flat-type inorganic heat trasfer radiator |
| 01/30/2002 | CN1333921A Semiconductor device, method of manufacture thereof, electronic device |
| 01/30/2002 | CN1333919A Method for protecting an integrated circuit chip |
| 01/30/2002 | CN1333801A Thermally conductive composite material |
| 01/30/2002 | CN1333570A Optical element and making method thereof electronic device |
| 01/30/2002 | CN1333562A Semiconductor module and making method thereof |
| 01/30/2002 | CN1333561A Method for preparing non-electroplating more than two layers of metal convex blocks |
| 01/30/2002 | CN1333560A Semiconductor package and making method thereof |
| 01/30/2002 | CN1333559A Semiconductor and making method, circuit substrate and electronic instrument |
| 01/30/2002 | CN1333526A Photoelectric device, its making method and electronic equipment |
| 01/30/2002 | CN1078741C Method of forming metal wirings on semiconductor substrate by dry etching |
| 01/30/2002 | CN1078738C Composite silicon-on-insulator substrate and method of fabricating the same |
| 01/29/2002 | US6343183 Wafer support system |
| 01/29/2002 | US6343171 Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making |
| 01/29/2002 | US6343030 Semiconductor device and pin arrangement |
| 01/29/2002 | US6343019 Apparatus and method of stacking die on a substrate |
| 01/29/2002 | US6343017 Heat sink assembly |
| 01/29/2002 | US6343016 Heat sink |
| 01/29/2002 | US6343015 Heat sink clip |
| 01/29/2002 | US6343014 CPU cooling arrangement |
| 01/29/2002 | US6343013 Heat sink assembly |
| 01/29/2002 | US6343012 Heat dissipation device with threaded fan module |
| 01/29/2002 | US6342912 Laser marking techniques |
| 01/29/2002 | US6342789 Universal wafer carrier for wafer level die burn-in |
| 01/29/2002 | US6342735 Dual use alignment aid |
| 01/29/2002 | US6342734 Interconnect-integrated metal-insulator-metal capacitor and method of fabricating same |
| 01/29/2002 | US6342733 Structure having thin metal layer on copper surface to reduce susceptibility to electromigration, oxidation, corrosion, stress voiding and delamination during subsequent chip processing and/or chip utilization |
| 01/29/2002 | US6342730 Low-pin-count chip package and manufacturing method thereof |
| 01/29/2002 | US6342729 Tape carrier package |
| 01/29/2002 | US6342728 Semiconductor device and manufacturing method thereof |
| 01/29/2002 | US6342727 Tape carrier device for a tab |
| 01/29/2002 | US6342726 Semiconductor device and manufacturing method thereof |
| 01/29/2002 | US6342724 Thin film capacitor coupons for memory modules and multi-chip modules |
| 01/29/2002 | US6342722 Integrated circuit having air gaps between dielectric and conducting lines |
| 01/29/2002 | US6342577 Between semiconductor and printed circuit; epoxy resin and latent hardener comprising cyanate ester and imidazole |
| 01/29/2002 | US6342455 Process for forming an integrated circuit |
| 01/29/2002 | US6342454 Forming integrated circuits, applying metal films to substrates, lithographically patterns of circuits on substrates, heat resistant dielectric polymer, heating, coupling |
| 01/29/2002 | US6342447 Semiconductor device and production method thereof |
| 01/29/2002 | US6342444 Method of forming diffusion barrier for copper interconnects |
| 01/29/2002 | US6342434 Methods of processing semiconductor wafer, and producing IC card, and carrier |
| 01/29/2002 | US6342426 Method for protecting stepper alignment marks |
| 01/29/2002 | US6342415 Method and system for providing reduced-sized contacts in a semiconductor device |
| 01/29/2002 | US6342412 Having a dram (dynamic random access memory), having a capacity as high as 16 mbits; improve the alpha-ray soft error withstand voltage; misfet |
| 01/29/2002 | US6342407 Low stress hermetic seal |
| 01/29/2002 | US6342401 Test structures for silicon etching |
| 01/29/2002 | US6342399 Testing integrated circuits |
| 01/29/2002 | US6342309 Epoxy resin, curing agent, inorganic filler and catalyst |
| 01/29/2002 | US6342307 Microstructure, interfaces between metal and polymer such as polyamide |
| 01/29/2002 | US6342275 Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head |
| 01/29/2002 | US6341998 Integrated circuit (IC) plating deposition system and method |
| 01/29/2002 | US6341651 Heat sink and method of fabricating same |
| 01/29/2002 | US6341646 Cooling device boiling and condensing refrigerant |
| 01/29/2002 | US6341645 Cooling device boiling and condensing refrigerant |
| 01/29/2002 | US6341644 Heat sink assembly |
| 01/29/2002 | US6341417 Pre-patterned substrate layers for being personalized as needed |
| 01/24/2002 | WO2002007492A2 Overhead cooling system with selectively positioned paths of airflow |
| 01/24/2002 | WO2002007491A1 Reconfigurable system and method for cooling heat generating objects |
| 01/24/2002 | WO2002007490A2 Assembly comprising a structured support element and a substrate functionally linked therewith |
| 01/24/2002 | WO2002007485A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 01/24/2002 | WO2002007312A2 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 01/24/2002 | WO2002007275A1 Semiconductor laser device |
| 01/24/2002 | WO2002007220A1 Semiconductor device |
| 01/24/2002 | WO2002007219A1 Semiconductor device and its manufacturing method |
| 01/24/2002 | WO2002007218A1 Multi-metal layer circuit |
| 01/24/2002 | WO2002007217A1 Flip chip substrate design |
| 01/24/2002 | WO2002007211A2 Multi-layer registration control for photolithography processes |
| 01/24/2002 | WO2002007209A1 Electronic chip component comprising an integrated circuit and a method for producing the same |
| 01/24/2002 | WO2002007208A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| 01/24/2002 | WO2002007204A1 Method and apparatus for manufacturing semiconductor device |
| 01/24/2002 | WO2002006645A2 Reconfigurable system and method for cooling heat generating objects |
| 01/24/2002 | WO2002006548A1 Fe-ni or fe-ni-co or fe-ni-co-cu alloy strip with improved cuttability |
| 01/24/2002 | WO2001037322A3 System and method for product yield prediction using a logic characterization vehicle |
| 01/24/2002 | US20020010288 Copper clad laminates |
| 01/24/2002 | US20020009889 Semiconductor manufacturing process and semiconductor device |
| 01/24/2002 | US20020009880 Diffusion barriers in semiconductors |
| 01/24/2002 | US20020009878 Method for manufacturing a multilayer interconnection structure |
| 01/24/2002 | US20020009877 Method for forming via holes by using retardation layers to reduce overetching |
| 01/24/2002 | US20020009875 Method of producing semiconductor device and system for producing the same |
| 01/24/2002 | US20020009874 Buried conductors |
| 01/24/2002 | US20020009873 Semiconductor device and method of manufacturing the same |
| 01/24/2002 | US20020009872 Fabrication process of a semiconductor device including a CVD process of a metal film |
| 01/24/2002 | US20020009871 Forming titanium layer, refractory metal layer and silicon layer; heating; multilayer stacks connectors |
| 01/24/2002 | US20020009870 Semiconductor device having a nonpeeling electrode pad portion |
| 01/24/2002 | US20020009860 Methods for manufacturing resistors using a sacrificial layer |
| 01/24/2002 | US20020009850 Multi-layer polysilicon plug and method for making the same |