| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/07/2002 | US20020014695 Semiconductor device having a layered wiring structure |
| 02/07/2002 | US20020014694 Capsule for semiconductor components |
| 02/07/2002 | US20020014693 Molded array package for facilitating device singulation |
| 02/07/2002 | US20020014692 Heat conductive silicone composition and semiconductor device |
| 02/07/2002 | US20020014691 Multiple line grid array package |
| 02/07/2002 | US20020014690 Electric or opto-electric component with a packaging of plastic and method for varying the impedance of a terminal lead of such a component |
| 02/07/2002 | US20020014687 Electronic part and manufacturing method therefor |
| 02/07/2002 | US20020014686 Semiconductor device and a method of manufacturing the same and an electronic device |
| 02/07/2002 | US20020014685 Electronic component with ball bonded pads connected to a plated lead frame |
| 02/07/2002 | US20020014684 Integrated circuit chip package |
| 02/07/2002 | US20020014683 BGA type semiconductor device having a solder-flow damping/stopping pattern |
| 02/07/2002 | US20020014680 Semiconductor device and method of manufacturing the same |
| 02/07/2002 | US20020014673 Method of making membrane integrated circuits |
| 02/07/2002 | US20020014668 Semiconductor device |
| 02/07/2002 | US20020014661 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices |
| 02/07/2002 | US20020014657 Semiconductor device with a thin gate stack having a plurality of insulating layers |
| 02/07/2002 | US20020014651 Scratch protection for direct contact sensors |
| 02/07/2002 | US20020014648 Semiconductor device and method of manufacturing the same |
| 02/07/2002 | US20020014644 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 02/07/2002 | US20020014639 Semiconductor device having heat protection circuits |
| 02/07/2002 | US20020014638 Semiconductor integrated circuit |
| 02/07/2002 | US20020014576 Light emitting element protecting device and method thereof |
| 02/07/2002 | US20020014351 Module-mounting motherboard device |
| 02/07/2002 | US20020014350 Methods of making connections to a microelectronic unit |
| 02/07/2002 | US20020014346 Mounting structure of semiconductor package |
| 02/07/2002 | US20020014324 Spiral copper tube and aluminum fin thermosyphon heat exchanger |
| 02/07/2002 | US20020014289 Physical vapor deposition targets |
| 02/07/2002 | US20020014202 Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| 02/07/2002 | US20020014004 High density integrated circuit apparatus, test probe and methods of use thereof |
| 02/07/2002 | DE19931004C2 Chipmodul, insbesondere BGA-Package, mit einem Interconnect zur stressfreien Lötverbindung mit einer Leiterplatte Chip module, in particular BGA package, with an interconnect for stress-free soldered to a circuit board |
| 02/07/2002 | DE10121896A1 Ball grid array package semiconductor device with improved power line routing, has signal line plane divided into first and second line planes on substrate for formation of lines for first and second power |
| 02/07/2002 | DE10050614C1 Plug-in solar module has metal socket provided with integral cooling ribs for acting as heat sink for protection diodes |
| 02/07/2002 | DE10046296A1 Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zur Herstellung An electronic chip component with an integrated circuit and methods for making |
| 02/07/2002 | DE10035564A1 Mikromechanisches Gehäuse Micromechanical housing |
| 02/07/2002 | DE10035170A1 Ceramic body, for use as substrate of active electronic component, comprises surface sections, thermal through-contacts connecting surface sections to exchange heat between sections, and tempering device |
| 02/07/2002 | DE10034020A1 Metallisierungsanordnung für Halbleiterstruktur und entsprechendes Herstellungsverfahren Metallisierungsanordnung for semiconductor structure and corresponding manufacturing method |
| 02/06/2002 | EP1178714A2 Multilayer board and method for making the same |
| 02/06/2002 | EP1178713A2 Multilayered board and method for fabricating the same |
| 02/06/2002 | EP1178712A2 Structure with blended polymer conformal coating of controlled electrical resistivity |
| 02/06/2002 | EP1178593A1 Semiconductor press stack |
| 02/06/2002 | EP1178530A2 Three-dimensional processor using transferred thin film circuits |
| 02/06/2002 | EP1178529A2 Semiconductor device with a light blocking layer |
| 02/06/2002 | EP1178525A1 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| 02/06/2002 | EP1178500A1 Inductive integrated structure with split values on a semiconductor substrate |
| 02/06/2002 | EP1177641A1 Energy conditioning circuit assembly |
| 02/06/2002 | EP1177621A2 Mos variable gain amplifier |
| 02/06/2002 | EP1177579A1 Chip holder for a chip module and method for producing said chip module |
| 02/06/2002 | EP1177578A1 Methods of forming local interconnects and conductive lines, and resulting structure |
| 02/06/2002 | EP1097467A4 Ic stack utilizing secondary leadframes |
| 02/06/2002 | EP1001852A4 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 02/06/2002 | EP0953186B1 Chip card module |
| 02/06/2002 | EP0907966B1 Integrated semiconductor circuit |
| 02/06/2002 | EP0840654A4 Manufacturing particles and articles having engineered properties |
| 02/06/2002 | CN2476102Y Radiator for central processing unit |
| 02/06/2002 | CN1335047A Method of applying phase change thermal interface material |
| 02/06/2002 | CN1334964A Circuit assembly with at least one nanoelectronic component and method for producing same |
| 02/06/2002 | CN1334696A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334695A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334604A Twice fuse density in TV window |
| 02/06/2002 | CN1334603A Planar plastic packaged module of integrated circuit |
| 02/06/2002 | CN1334602A Semiconductor device and packaging method |
| 02/06/2002 | CN1334601A Flip-chip semiconductor device and mfg. method thereof |
| 02/06/2002 | CN1334598A Method for forming electronic element sealing device |
| 02/06/2002 | CN1334569A 介电陶瓷组合物 The dielectric ceramic composition |
| 02/06/2002 | CN1334292A Epoxy resin composition for packaging semiconductor and resin packaged semiconductor device |
| 02/06/2002 | CN1334256A Insulation ceramic press block, ceramic laminal substrate and ceramic electronic device |
| 02/05/2002 | USRE37539 Sealed stacked arrangement of semiconductor devices |
| 02/05/2002 | US6344976 Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die |
| 02/05/2002 | US6344971 Retainer for a retaining seat of a radiator |
| 02/05/2002 | US6344961 Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit |
| 02/05/2002 | US6344698 More robust alignment mark design |
| 02/05/2002 | US6344697 Semiconductor device comprising layered positional detection marks and manufacturing method thereof |
| 02/05/2002 | US6344696 Chip size package semiconductor device and method of forming the same |
| 02/05/2002 | US6344695 Semiconductor device to be mounted on main circuit board and process for manufacturing same device |
| 02/05/2002 | US6344694 Titanium silicide film including at least one atom selected from the group consisting of phosphorus, arsenic and antimony |
| 02/05/2002 | US6344693 Semiconductor device and method for manufacturing same |
| 02/05/2002 | US6344691 Barrier materials for metal interconnect in a semiconductor device |
| 02/05/2002 | US6344690 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 02/05/2002 | US6344688 Very thin multi-chip package and method of mass producing the same |
| 02/05/2002 | US6344687 Dual-chip packaging |
| 02/05/2002 | US6344686 Power electronic component including cooling means |
| 02/05/2002 | US6344685 Semiconductor chip-substrate attachment structure |
| 02/05/2002 | US6344684 Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint |
| 02/05/2002 | US6344683 Stacked semiconductor package with flexible tape |
| 02/05/2002 | US6344682 Semiconductor device comprising a semiconductor element mounted on a substrate and covered by a wiring board |
| 02/05/2002 | US6344681 Semiconductor package produced by solder plating without solder residue |
| 02/05/2002 | US6344680 Planar semiconductor device |
| 02/05/2002 | US6344679 Diode with alterable conductivity and method of making same |
| 02/05/2002 | US6344667 Wiring board with reduced radiation of undesired electromagnetic waves |
| 02/05/2002 | US6344663 Silicon carbide CMOS devices |
| 02/05/2002 | US6344609 Electronic unit effectively utilizing circuit board surface |
| 02/05/2002 | US6344424 Low melting point glass, insulating package, and sealing member |
| 02/05/2002 | US6344412 Integrated ESD protection method and system |
| 02/05/2002 | US6344410 Manufacturing method for semiconductor metalization barrier |
| 02/05/2002 | US6344407 Method of manufacturing solder bumps and solder joints using formic acid |
| 02/05/2002 | US6344399 Method of forming conductive lines and method of forming a conductive grid |
| 02/05/2002 | US6344373 Antifuse structure and process |
| 02/05/2002 | US6344372 Semiconductor device with reliable connection between projective electrode and conductive wire of the substrate |
| 02/05/2002 | US6344371 Dimensionally stable core for use in high density chip packages and a method of fabricating same |
| 02/05/2002 | US6344281 Aluminum metallization method and product |