| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/14/2002 | WO2001033629A3 Device for thermal coupling of an electronic component with a cooling element |
| 02/14/2002 | US20020019497 Thermoplastic resin composition |
| 02/14/2002 | US20020019304 Powdered borosilicate glass comprising boron oxide and silicon oxide, and aluminum, calcium, magnesium, and/or barium oxides |
| 02/14/2002 | US20020019155 Printed circuit board with pins for being connected to electronic part mounted thereon |
| 02/14/2002 | US20020019153 Connecting devices and method for interconnecting circuit components |
| 02/14/2002 | US20020019133 Resin for semiconductor wire |
| 02/14/2002 | US20020019131 Manufacture of semiconductor device with copper wiring |
| 02/14/2002 | US20020019129 Semiconductor device and method of manufacturing the same |
| 02/14/2002 | US20020019126 Self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device |
| 02/14/2002 | US20020019125 Methods of forming materials between conductive electrical components, and insulating materials |
| 02/14/2002 | US20020019124 Semiconductor integrated circuit device and method for making the same |
| 02/14/2002 | US20020019122 Methods of making interconnections for semiconductor circuits |
| 02/14/2002 | US20020019091 Method for the fabrication of semiconductor device |
| 02/14/2002 | US20020019090 Method of manufacturing semiconductor device including a step of forming a silicide layer, and semiconductor device manufactured thereby |
| 02/14/2002 | US20020019086 Method for fabricating a semiconductor device |
| 02/14/2002 | US20020019080 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 02/14/2002 | US20020019078 Semiconductor package and method of manufacturing semiconductor package |
| 02/14/2002 | US20020019077 Lead-free (Pb-free); forming an electrical device by connecting a substrate with a semiconductor device having a lead on which an tin-bismuth alloy layer is formed using bismuth silver tin alloy solder |
| 02/14/2002 | US20020019076 Method for fabricating semiconductor package including flex circuit,interconnects and dense array external contact |
| 02/14/2002 | US20020019073 Method for manufacturing a dual chip package |
| 02/14/2002 | US20020019072 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same |
| 02/14/2002 | US20020019069 Optical element and method of manufacturing the same, and electronic instrument |
| 02/14/2002 | US20020019066 Semiconductor device manufacturing method |
| 02/14/2002 | US20020018885 Mixture of aluminum in oil |
| 02/14/2002 | US20020018871 Porous ink receiving layer having interconnecting voids and an ink permeable polyester substrate; simultaneously provides an almost instantaneous ink dry time and good image quality |
| 02/14/2002 | US20020018513 Memory |
| 02/14/2002 | US20020018500 Semiconductor laser unit and semiconductor laser module |
| 02/14/2002 | US20020018338 Insert molded heat sink assembly |
| 02/14/2002 | US20020018337 Electronic apparatus having heat sink for cooling heat generating component |
| 02/14/2002 | US20020018336 Heat sink apparatus |
| 02/14/2002 | US20020018335 Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus |
| 02/14/2002 | US20020018206 Semiconductor structures and manufacturing methods |
| 02/14/2002 | US20020017906 Electromigration early failure distribution in submicron interconnects |
| 02/14/2002 | US20020017730 Semiconductor device |
| 02/14/2002 | US20020017729 Sacrificial bond pads for laser configured integrated circuits |
| 02/14/2002 | US20020017727 Method for manufacturing semiconductor device using group III nitride compound |
| 02/14/2002 | US20020017725 Semiconductor device and method of forming the same |
| 02/14/2002 | US20020017723 Semiconductor memory device and method for the manufacture thereof |
| 02/14/2002 | US20020017722 Semiconductor device and a method of manufacturing the same |
| 02/14/2002 | US20020017721 Array structure of solder balls able to control collapse |
| 02/14/2002 | US20020017720 Semiconductor device |
| 02/14/2002 | US20020017719 Semiconductor device having bonding wires serving as external connection terminals |
| 02/14/2002 | US20020017718 Semiconductor device and semiconductor chip for use therein |
| 02/14/2002 | US20020017717 Semiconductor clamped-stack assembly |
| 02/14/2002 | US20020017716 Tab tape with stiffener and semiconductor device using same |
| 02/14/2002 | US20020017715 Method for bonding heatsink to multiple-height chip |
| 02/14/2002 | US20020017714 Electrically isolated power semiconductor package |
| 02/14/2002 | US20020017713 Microcap wafer-level package |
| 02/14/2002 | US20020017712 Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate |
| 02/14/2002 | US20020017711 Semiconductor package |
| 02/14/2002 | US20020017710 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 02/14/2002 | US20020017708 Method for manufacturing multi-kind and small quantity semiconductor products in a mass-production line and system thereof |
| 02/14/2002 | US20020017707 Multi-layered integrated semiconductor device incorporating electrically connected integrated circuit chips and monitoring pads |
| 02/14/2002 | US20020017706 Lead frame, semiconductor device and manufacturing method therefor, circuit board and electronic equipment |
| 02/14/2002 | US20020017705 Electronic semiconductor device having a thermal spreader |
| 02/14/2002 | US20020017704 Semiconductor device and method of manufacture |
| 02/14/2002 | US20020017702 Methods for manufacturing resistors using a sacrificial layer |
| 02/14/2002 | US20020017700 Multilayer capacitor, semiconductor device, and electrical circuit board |
| 02/14/2002 | US20020017699 High performance chip/package inductor integration |
| 02/14/2002 | US20020017698 Monolithic low dielectric constant platform for passive components and method |
| 02/14/2002 | US20020017692 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 02/14/2002 | US20020017689 Semiconductor device and method of manufacturing same |
| 02/14/2002 | US20020017686 Semiconductor integrated circuit device and manufacturing method thereof |
| 02/14/2002 | US20020017672 Low-capacitance bonding pad for semiconductor device |
| 02/14/2002 | US20020017669 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same |
| 02/14/2002 | US20020017664 Protective layer for integrated circuits and method for the manufacturing thereof |
| 02/14/2002 | US20020017662 Manufacturing methods for defect removable semiconductor devices |
| 02/14/2002 | US20020017658 Process for forming amorphous titanium silicon nitride on substrate |
| 02/14/2002 | US20020017641 Integrated circuit dielectric and method |
| 02/14/2002 | US20020017510 Laser processing |
| 02/14/2002 | US20020017482 Method for sorting integrated circuit devices |
| 02/14/2002 | US20020017453 Titanium or titanium nitride films at larger distances which allows easy accumulation on the bottom surface of a concave and shorter distances which allows easy accumulation on the side surface of the concave |
| 02/14/2002 | US20020017399 Coaxial via hole and process of fabricating the same |
| 02/14/2002 | US20020017398 Method for transforming a substrate with edge contacts into a ball grid array, ball grid array manufactured according to this method, and flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 02/14/2002 | US20020017378 Heat ventilation device |
| 02/14/2002 | US20020017346 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same |
| 02/14/2002 | US20020017177 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/14/2002 | DE10044541C1 Producing electrically conducting layers on through hole walls in substrate involves deep drawing plastic foil with metal layer in substrate, removing foil from metal layer with conical tools |
| 02/14/2002 | DE10038092A1 Verfahren zur elektrischen Verbindung eines Halbleiterbauelements mit einer elektrischen Baugruppe A method for electrically connecting a semiconductor device having an electrical module |
| 02/14/2002 | DE10037819A1 Circuit board manufacture especially for 3-dimensional semiconductor circuits, has circuit boards supported by flush-jointing of first metallic plane, insulating material plane and second metallic plane |
| 02/14/2002 | DE10037446A1 Verfahren zum Aufbringen von Justiermarken auf einer Halbleiterscheibe A method of applying alignment marks on a semiconductor wafer |
| 02/13/2002 | EP1179971A2 Printed circuit board with pins for being connected to electronic part mounted thereon |
| 02/13/2002 | EP1179848A2 Supply pin rearrangement for an I.C. |
| 02/13/2002 | EP1179847A2 Support for integrated circuit chips and method of producing the same |
| 02/13/2002 | EP1179846A2 Package for an electronic device |
| 02/13/2002 | EP1179845A2 Semiconductor device and manufacturing method thereof |
| 02/13/2002 | EP1179844A2 Semiconductor packaging |
| 02/13/2002 | EP1179843A2 Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition |
| 02/13/2002 | EP1179606A2 Silver containing copper alloy |
| 02/13/2002 | EP1080615B1 Multiple printed panel for electronics components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel. |
| 02/13/2002 | EP1012942B1 Circuit arrangement for protecting integrated circuits against electrostatic discharges |
| 02/13/2002 | EP0948815B1 Chip module and manufacturing process |
| 02/13/2002 | CN2476918Y Pressure adjusting device for cooling element |
| 02/13/2002 | CN2476877Y Fin-type air-cooled heat sink |
| 02/13/2002 | CN1335871A Crosslinkable elastomer composition and formed article prepared from said composition |
| 02/13/2002 | CN1335745A Multilayer plate and its producing method |
| 02/13/2002 | CN1335740A Wiring circuit board with projecture and its producing method |
| 02/13/2002 | CN1335674A On-chip signal filter with bonded lead inductance |
| 02/13/2002 | CN1335644A Heat radiator |
| 02/13/2002 | CN1335641A Glass substrate processing method and method for producing high frequency circuit |