| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/13/2002 | CN1335511A Method and apparatus for searching conductor in conductor array with tight space |
| 02/13/2002 | CN1079169C Method of manufacturing semiconductor chip package |
| 02/12/2002 | US6347062 Semiconductor memory device |
| 02/12/2002 | US6347039 Memory module and memory module socket |
| 02/12/2002 | US6347037 Semiconductor device and method of forming the same |
| 02/12/2002 | US6347035 Low profile EMI shield with heat spreading plate |
| 02/12/2002 | US6346820 Characteristics evaluation circuit for semiconductor wafer and its evaluation method |
| 02/12/2002 | US6346749 Semiconductor device |
| 02/12/2002 | US6346748 Electronic circuit structure with photoresist layer that has non-precision openings formed by a laser |
| 02/12/2002 | US6346745 Cu-A1 combined interconnect system |
| 02/12/2002 | US6346744 Integrated RF M×N switch matrix |
| 02/12/2002 | US6346743 Embedded capacitor assembly in a package |
| 02/12/2002 | US6346736 Trench isolated semiconductor device |
| 02/12/2002 | US6346731 Semiconductor apparatus having conductive thin films |
| 02/12/2002 | US6346728 Plural transistor device with multi-finger structure |
| 02/12/2002 | US6346723 Semiconductor memory device having memory cell area and peripheral circuit area |
| 02/12/2002 | US6346721 Integrated circuit having radially varying power bus grid architecture |
| 02/12/2002 | US6346679 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| 02/12/2002 | US6346678 Circuit board and method of manufacturing a circuit board |
| 02/12/2002 | US6346672 Structure for preventing electromagnetic interference of central processing unit |
| 02/12/2002 | US6346489 Precleaning process for metal plug that minimizes damage to low-κ dielectric |
| 02/12/2002 | US6346480 Method for forming aluminum interconnection |
| 02/12/2002 | US6346478 Method of forming a copper wiring in a semiconductor device |
| 02/12/2002 | US6346475 Method of manufacturing semiconductor integrated circuit |
| 02/12/2002 | US6346473 Methods for fabricating microelectronic device interconnects with spun-on glass regions |
| 02/12/2002 | US6346472 Manufacturing method for semiconductor metalization barrier |
| 02/12/2002 | US6346471 Multilayer wiring structure and semiconductor device having the same, and manufacturing method therefor |
| 02/12/2002 | US6346470 Method for reducing electromigration in semiconductor interconnect lines |
| 02/12/2002 | US6346469 Semiconductor device and a process for forming the semiconductor device |
| 02/12/2002 | US6346458 Transposed split of ion cut materials |
| 02/12/2002 | US6346456 Method of improving alignment for semiconductor fabrication |
| 02/12/2002 | US6346435 Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof |
| 02/12/2002 | US6346434 Semiconductor device and manufacturing method |
| 02/12/2002 | US6346432 Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| 02/12/2002 | US6346317 Substrate for ceramic sheets |
| 02/12/2002 | US6346302 Silica film on silicon |
| 02/12/2002 | US6346296 Highly stable packaging substrates |
| 02/12/2002 | US6346152 Method and apparatus for applying adhesives to a lead frame |
| 02/12/2002 | US6345664 Heat sink and information processor using heat sink |
| 02/12/2002 | US6345515 Conditioning and filling system for a spray evaporative cooling working fluid |
| 02/12/2002 | US6345437 Placing an oxidized copper foil one surface side of the ceramic plate and fixing said oxidized copper foil to the plate by heating the plate and the foil; and heating to 1065-108 degrees c. and then cooling to room temperature. |
| 02/07/2002 | WO2002011506A2 Vapor chamber with integrated pin array |
| 02/07/2002 | WO2002011212A1 W/wc/tac ohmic and rectifying contacts on sic |
| 02/07/2002 | WO2002011207A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
| 02/07/2002 | WO2002011206A2 Electronic assembly comprising interposer with embedded capacitors and methods of manufacture |
| 02/07/2002 | WO2002011205A1 Method for contacting a semiconductor component |
| 02/07/2002 | WO2002011204A1 Multiphase low dielectric constant material and method of deposition |
| 02/07/2002 | WO2002011203A2 Plastic encapsulated semiconductor devices with improved corrosion resistance |
| 02/07/2002 | WO2002011202A2 Method and device for producing connection substrates for electronic components |
| 02/07/2002 | WO2002011201A2 Method and device for producing connection substrates for electronic components |
| 02/07/2002 | WO2002010661A1 High-efficiency computer thermal management apparatus and method |
| 02/07/2002 | WO2002010660A1 Multi-purpose microchannel micro-component |
| 02/07/2002 | WO2002009936A1 Lead-free alloys with improved wetting properties |
| 02/07/2002 | WO2001078140A3 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier |
| 02/07/2002 | WO2001075961A8 Chip scale surface mounted device and process of manufacture |
| 02/07/2002 | WO2001037621A3 Method for producing a support element for an integrated circuit (ic) component |
| 02/07/2002 | US20020016693 Method for fabricating and checking structures of electronic circuits in a semiconductor substrate |
| 02/07/2002 | US20020016505 Storage media for latent heat storage systems |
| 02/07/2002 | US20020016408 Polyimide silicone resin, its solution composition, and polyimide silicone resin film |
| 02/07/2002 | US20020016398 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 02/07/2002 | US20020016396 Base polymer containing a metal acetylacetonate as curing catalyst dispersed therein; and a ceramic filler; capacitors |
| 02/07/2002 | US20020016095 Spring structure with self-aligned release material |
| 02/07/2002 | US20020016092 High speed and density circular connector for board-to-board interconnection systems |
| 02/07/2002 | US20020016091 Chip socket assembly and chip file assembly for semiconductor chips |
| 02/07/2002 | US20020016085 Method and apparatus for treating low k dielectric layers to reduce diffusion |
| 02/07/2002 | US20020016073 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 02/07/2002 | US20020016070 Power pads for application of high current per bond pad in silicon technology |
| 02/07/2002 | US20020016059 Method of manufacturing a semiconductor device, and a semiconductor device manufactured thereby |
| 02/07/2002 | US20020016058 Microelectronic air-gap structures and methods of forming the same |
| 02/07/2002 | US20020016056 Methods of packaging an integrated circuit |
| 02/07/2002 | US20020016055 Fuse, memory incorporating same and method |
| 02/07/2002 | US20020016053 Methods of forming contacts,methods of contacting lines,methods of operating integrated circuitry , and integrated circuits |
| 02/07/2002 | US20020016052 Method of forming a conductive coating on a semiconductor device |
| 02/07/2002 | US20020016033 Method of fabricating integrated circuits, providing improved so-called saw bows |
| 02/07/2002 | US20020016024 Backside contact for touchchip |
| 02/07/2002 | US20020016023 Method and apparatus for packaging a microelectronic die |
| 02/07/2002 | US20020016022 Semiconductor device and manufacturing method thereof |
| 02/07/2002 | US20020016021 Face to face chip |
| 02/07/2002 | US20020016020 Method of manufacturing an electronic device |
| 02/07/2002 | US20020016019 Process for producing semiconductor device package and organopolysiloxane composition used therefor |
| 02/07/2002 | US20020016018 Method of manufacturing multi-layer printed wiring board |
| 02/07/2002 | US20020016013 Semiconductor device manufacturing method |
| 02/07/2002 | US20020015898 Efficient electrical tests |
| 02/07/2002 | US20020015818 Electroluminescence |
| 02/07/2002 | US20020015340 Method and apparatus for memory module circuit interconnection |
| 02/07/2002 | US20020015293 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 02/07/2002 | US20020015291 Semiconductor device |
| 02/07/2002 | US20020015288 High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications |
| 02/07/2002 | US20020015128 LCD driver IC chip |
| 02/07/2002 | US20020014945 Protective element |
| 02/07/2002 | US20020014915 Semiconductor integrated circuit device and method for mounting circuit blocks in semiconductor integrated circuit device |
| 02/07/2002 | US20020014706 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 02/07/2002 | US20020014705 Semiconductor device and manufacturing method of same |
| 02/07/2002 | US20020014704 Method of making wireless semiconductor device, and leadframe used therefor |
| 02/07/2002 | US20020014703 Semiconductor flip-chip package and method for the fabrication thereof |
| 02/07/2002 | US20020014701 Interconnect structure for semiconductor device and method of fabrication |
| 02/07/2002 | US20020014699 Semiconductor device, function setting method thereof, and evaluation method thereof |
| 02/07/2002 | US20020014698 Semiconductor device |
| 02/07/2002 | US20020014697 Semiconductor device and method for fabricating the same |
| 02/07/2002 | US20020014696 Semiconductor device having a contact struture using aluminum |