| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/21/2002 | US20020020855 Method for fabricating a semiconductor device |
| 02/21/2002 | US20020020835 A conductive spacer in a via |
| 02/21/2002 | US20020020811 Semiconductor parts and semiconductor mounting apparatus |
| 02/21/2002 | US20020020755 Computer system and method of controlling rotation speed of cooling fan |
| 02/21/2002 | US20020020629 Lead frame and method of manufacturing the lead frame |
| 02/21/2002 | US20020020628 A mask is in spaced relation proximite to but does not contact the top surface of a workpiece, while moving relative to it |
| 02/21/2002 | US20020020554 Multi-layer circuit board and method of manufacturing the same |
| 02/21/2002 | US20020020551 Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
| 02/21/2002 | US20020020523 Radiator with thin fins |
| 02/21/2002 | US20020020517 Geometrical streamline flow guiding and heat dissipating structure |
| 02/21/2002 | US20020020058 Method of mounting a BGA |
| 02/21/2002 | DE19549554C2 Semiconductor device for dynamic random access memory |
| 02/21/2002 | DE10121774A1 Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer |
| 02/21/2002 | DE10114998A1 Einsatz von PCM in Kühlern für elektronische Batterie Use of PCMs in coolers for electronic battery |
| 02/21/2002 | DE10111722A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 02/21/2002 | DE10109174A1 Verfahren zum Strukturentwurf von integrierten Halbleiterschaltungen und Vorrichtung zur Durchführung desselben A method for the same structural design of integrated semiconductor circuits and apparatus for performing |
| 02/21/2002 | DE10041669A1 Authentication method for chip card, involves determining authenticity of chip card by comparing time dependent output signals of chip card with predetermined time dependent reference signals |
| 02/21/2002 | DE10038998A1 Halbleiterbauelement und Verfahren zur Identifizierung eines Halbleiterbauelementes A semiconductor device and method of identifying a semiconductor device |
| 02/21/2002 | DE10038508A1 Elektrische Baugruppe und Verfahren zur Herstellung der elektrischen Baugruppe An electrical assembly and methods for making the electrical assembly |
| 02/21/2002 | DE10038178A1 Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows |
| 02/21/2002 | DE10038161A1 Kühlvorrichtung für elektronische Bauteile und Verfahren zur Herstellung der Kühlvorrichtung A cooling apparatus for electronic components and methods for making the cooling apparatus |
| 02/21/2002 | DE10037821A1 Baugruppe, insbesondere Wafer-Baugruppe Assembly, in particular wafer assembly |
| 02/21/2002 | DE10037292A1 Verfahren zur Herstellung von Anschlußsubstraten für Halbleiterkomponenten A process for the production of substrates for semiconductor connection components |
| 02/21/2002 | DE10026680C1 Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten Electrolyte and process for deposition of tin-silver alloy layers, and use of the electrolyte |
| 02/20/2002 | EP1180801A2 Optical semiconductor module |
| 02/20/2002 | EP1180800A2 Semiconductor integrated circuit device and manufacturing method thereof |
| 02/20/2002 | EP1180798A1 Thermal conductive sheet with conductive foil |
| 02/20/2002 | EP1180792A1 Semiconductor packaging |
| 02/20/2002 | EP0995347B1 Transporter for lead frames and transport assembly |
| 02/20/2002 | CN2478252Y Semiconductor radiator |
| 02/20/2002 | CN2478251Y Air cooling modular in organic heat transfering radiator |
| 02/20/2002 | CN2478250Y Radiator fastening |
| 02/20/2002 | CN2478249Y Radiator |
| 02/20/2002 | CN2478248Y Radiator combination |
| 02/20/2002 | CN1337067A Method for producing a semiconductor component with wiring partly extending in the substrate and semiconductor component produced to said method |
| 02/20/2002 | CN1337066A Electronic component and use of a protective structure contained therein |
| 02/20/2002 | CN1337065A Semiconductor device and method of mfg. the same |
| 02/20/2002 | CN1337064A Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 02/20/2002 | CN1336793A Electromagnetic wave absorber, its mfg. method, and articles equipped with said absorber |
| 02/20/2002 | CN1336790A Multi-layer circuit plate and its mfg. method |
| 02/20/2002 | CN1336787A Ceramic laminated device |
| 02/20/2002 | CN1336687A Semiconductor chip, semiconductor device and mfg. method therefor |
| 02/20/2002 | CN1079582C Electronic package with multilever connections |
| 02/19/2002 | US6349401 Semiconductor integrated circuit, design method and computer-readable medium using a permissive current ratio |
| 02/19/2002 | US6349034 Removable heat sink bumpers on a quad flat package |
| 02/19/2002 | US6349033 Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards |
| 02/19/2002 | US6349032 Electronic chip packaging |
| 02/19/2002 | US6348742 Sacrificial bond pads for laser configured integrated circuits |
| 02/19/2002 | US6348741 Semiconductor apparatus and a manufacturing method thereof |
| 02/19/2002 | US6348740 Bump structure with dopants |
| 02/19/2002 | US6348739 Semiconductor device and method of manufacturing the same |
| 02/19/2002 | US6348737 Metallic interlocking structure |
| 02/19/2002 | US6348734 Self-aligned copper interconnect architecture with enhanced copper diffusion barrier |
| 02/19/2002 | US6348732 Amorphized barrier layer for integrated circuit interconnects |
| 02/19/2002 | US6348730 Semiconductor device and fabricating method therefor |
| 02/19/2002 | US6348729 Semiconductor chip package and manufacturing method thereof |
| 02/19/2002 | US6348728 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
| 02/19/2002 | US6348727 High current semiconductor device package with plastic housing and conductive tab |
| 02/19/2002 | US6348726 Multi row leadless leadframe package |
| 02/19/2002 | US6348723 Semiconductor device with a dummy wire positioned to prevent charging/discharging of the parasitic capacitance of a signal wire |
| 02/19/2002 | US6348722 Semiconductor memory with shield layer |
| 02/19/2002 | US6348709 Electrical contact for high dielectric constant capacitors and method for fabricating the same |
| 02/19/2002 | US6348427 High-thermal-expansion glass ceramic sintered product |
| 02/19/2002 | US6348416 Carrier substrate for producing semiconductor device |
| 02/19/2002 | US6348409 Self aligned contact plug technology |
| 02/19/2002 | US6348408 Semiconductor device with reduced number of intermediate level interconnection pattern and method of forming the same |
| 02/19/2002 | US6348403 Sandwiching between layers of aluminum titanium nitride in semiconductors and integrated circuits |
| 02/19/2002 | US6348402 Method of manufacturing a copper interconnect |
| 02/19/2002 | US6348400 Method and apparatus for implementing selected functionality on an integrated circuit device |
| 02/19/2002 | US6348399 Method of making chip scale package |
| 02/19/2002 | US6348398 Method of forming pad openings and fuse openings |
| 02/19/2002 | US6348391 Monolithic inductor with guard rings |
| 02/19/2002 | US6348366 Method of forming conductive lines |
| 02/19/2002 | US6348363 Method for manufacturing a semiconductor package |
| 02/19/2002 | US6348233 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 02/19/2002 | US6348142 While minimizing the amount of surface area of the substrate which is occupied by tie bars and associated conductive elements, particular utility in the fabrication of ball grid array (bga) semiconductor device packages |
| 02/19/2002 | US6347947 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 02/19/2002 | US6347901 Solder interconnect techniques |
| 02/19/2002 | US6347521 Temperature control device and method for manufacturing the same |
| 02/14/2002 | WO2002013585A2 Electrical assembly and method for producing said electrical assembly |
| 02/14/2002 | WO2002013284A2 Memory element and method for production of a memory element |
| 02/14/2002 | WO2002013271A2 Integrated electronic circuit with at least one inductor and method for producing the same |
| 02/14/2002 | WO2002013270A2 Semiconductor component and a method for identifying a semiconductor component |
| 02/14/2002 | WO2002013269A1 Method for electrically connecting a semiconductor component to an electrical subassembly |
| 02/14/2002 | WO2002013268A2 Module, especially a wafer module |
| 02/14/2002 | WO2002013267A1 Power module and power module with heat sink |
| 02/14/2002 | WO2002013266A1 Device and method for placing on and fixing to substrate semiconductor device and heat sink disposed on the semiconductor device |
| 02/14/2002 | WO2002013265A2 Heat sink assembly with evenly distributed compression force |
| 02/14/2002 | WO2002013264A1 Cooling device for electronic components and method for producing said cooling device |
| 02/14/2002 | WO2002013263A1 Heat dissipating device for electronic components |
| 02/14/2002 | WO2002013261A2 Heat spreading die cover |
| 02/14/2002 | WO2002013258A2 Backside contact for integrated circuit and method of forming same |
| 02/14/2002 | WO2002013254A2 Electroplating multi-trace circuit board substrates using single tie bar |
| 02/14/2002 | WO2002013253A1 Microconnectors and method for their production |
| 02/14/2002 | WO2002013212A1 Integrated inductor |
| 02/14/2002 | WO2002012590A1 Beryllium-aluminium composite with microporous surface for impregnating, painting or bonding |
| 02/14/2002 | WO2002012583A1 Silver containing copper alloy |
| 02/14/2002 | WO2002011930A1 Heat-exchanging device |
| 02/14/2002 | WO2001069677A3 Apparatus and method for passive phase change thermal management |
| 02/14/2002 | WO2001054193A3 Flat support for a chip module and method for producing a chip module |