| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/26/2002 | US6350676 Method of forming high-stability metallic contacts in an integrated circuit with one or more metallized layers |
| 02/26/2002 | US6350674 Manufacturing method for semiconductor device having a multilayer interconnect |
| 02/26/2002 | US6350668 Low cost chip size package and method of fabricating the same |
| 02/26/2002 | US6350664 Semiconductor device and method of manufacturing the same |
| 02/26/2002 | US6350659 Process of making semiconductor device having regions of insulating material formed in a semiconductor substrate |
| 02/26/2002 | US6350658 Method for realizing alignment marks on a semiconductor device during a manufacturing process including at least a chemical mechanical polishing process step |
| 02/26/2002 | US6350651 Method for making flash memory with UV opaque passivation layer |
| 02/26/2002 | US6350636 Junction leakage monitor for MOSFETs with silicide contacts |
| 02/26/2002 | US6350634 Semiconductor device having a built-in heat sink and process of manufacturing same |
| 02/26/2002 | US6350633 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
| 02/26/2002 | US6350632 Semiconductor chip assembly with ball bond connection joint |
| 02/26/2002 | US6350631 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same |
| 02/26/2002 | US6350627 Interlevel dielectric thickness monitor for complex semiconductor chips |
| 02/26/2002 | US6350623 Method of forming intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same |
| 02/26/2002 | US6350548 Semiconductors with marks on layers, nesting, measurement targets and layers |
| 02/26/2002 | US6350386 Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly |
| 02/26/2002 | US6350365 Method of producing multilayer circuit board |
| 02/26/2002 | US6350138 Socket for removably mounting electronic parts having a plurality of conductive terminals such as BGA packages |
| 02/26/2002 | US6350137 IC socket and contact pins for IC socket |
| 02/26/2002 | US6349861 Jet solder feeding device and soldering method |
| 02/26/2002 | US6349832 Stud and ride for use on matrix trays |
| 02/26/2002 | US6349762 Heat sink |
| 02/26/2002 | US6349760 Method and apparatus for improving the thermal performance of heat sinks |
| 02/26/2002 | US6349554 Spray cooling system |
| 02/26/2002 | US6349553 Method and system for cooling electrical components |
| 02/26/2002 | US6349465 Controlled bondline thickness attachment mechanism |
| 02/21/2002 | WO2002015423A1 Transmitter and receiver module |
| 02/21/2002 | WO2002015270A2 Seal for authenticating objects and a method for producing and verifying said seal |
| 02/21/2002 | WO2002015269A2 Wiring through terminal via fuse window |
| 02/21/2002 | WO2002015268A2 Cooling device |
| 02/21/2002 | WO2002015267A2 Integrated circuit package including opening exposing portion of an ic |
| 02/21/2002 | WO2002015266A2 Direct build-up layer on an encapsulated die package |
| 02/21/2002 | WO2002015265A2 Vibration and shock resistant heat sink assembly |
| 02/21/2002 | WO2002015264A2 Encapsulated organic-electronic component, method for producing the same and use thereof |
| 02/21/2002 | WO2002015263A1 Semiconductor device and method for manufacturing the same |
| 02/21/2002 | WO2002015256A1 Micromachined sensor with insulating protection of connections |
| 02/21/2002 | WO2002015245A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 02/21/2002 | WO2002015209A2 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic |
| 02/21/2002 | WO2002014576A1 Sputtering target |
| 02/21/2002 | WO2001061746A3 Test structure for metal cmp process control |
| 02/21/2002 | WO2001048870A3 Interconnect for microelectronic structures with enhanced spring characteristics |
| 02/21/2002 | WO2001037323A3 Vertical transformer |
| 02/21/2002 | WO2001020646A3 Fill strategies in the optical kerf |
| 02/21/2002 | US20020022681 For encapsulation of semiconductor devices by potting, chip-on-bonding or screen printing |
| 02/21/2002 | US20020022679 For plastic packaging material for microelectronic applications |
| 02/21/2002 | US20020022402 Method and a circuit system for using equivalent integrated-circuit devices operating at different voltages |
| 02/21/2002 | US20020022386 Socket for BGA package |
| 02/21/2002 | US20020022373 Method for fabricating a wiring plane on a semiconductor chip with an antifuse |
| 02/21/2002 | US20020022362 Buried ground plane for high performance system modules |
| 02/21/2002 | US20020022361 Metal via contact of a semiconductor device and method for fabricating the same |
| 02/21/2002 | US20020022356 Compatible IC packages and methods for ensuring migration path |
| 02/21/2002 | US20020022343 Semiconductor device and method of manufacturing the same |
| 02/21/2002 | US20020022312 Method of fabricating semiconductor device |
| 02/21/2002 | US20020022311 Semiconductor device and manufacturing method thereof |
| 02/21/2002 | US20020022310 Useful as dielectric layer in integrated circuits and electronic circuit encapsulants; heat resistance, mechanical properties |
| 02/21/2002 | US20020022305 Passivation layer for packaged integrated circuits |
| 02/21/2002 | US20020022304 Semiconductor device, method for fabricating the same, circuit board and electronic device |
| 02/21/2002 | US20020022303 Three-dimensional semiconductor device and method of manufacturing the same |
| 02/21/2002 | US20020022302 Method of fabricating semiconductor device |
| 02/21/2002 | US20020022301 Method for manufacturing a semiconductor package |
| 02/21/2002 | US20020022300 Method for fabricating a stacked semiconductor chip package |
| 02/21/2002 | US20020022282 Method for measurement of electromigration in semiconductor integrated circuits |
| 02/21/2002 | US20020021557 Liquid-cooled electronic apparatus |
| 02/21/2002 | US20020021556 Vapor chamber with integrated pin array |
| 02/21/2002 | US20020021555 System processor heat dissipation |
| 02/21/2002 | US20020021553 Semiconductor device having heat radiating member |
| 02/21/2002 | US20020021452 Technique for determining curvatures of embedded line features on substrates |
| 02/21/2002 | US20020021399 Liquid crystal display device, method for fabricating the same, and portable telephone using the same |
| 02/21/2002 | US20020020940 Semiconductor resin mold and semiconductor resin molding method using the mold |
| 02/21/2002 | US20020020929 Semiconductor device and a method of manufacturing the same |
| 02/21/2002 | US20020020928 Ball grid array package for providing constant internal voltage via a PCB substrate routing configuration |
| 02/21/2002 | US20020020927 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 02/21/2002 | US20020020926 Heat dissipation module for a BGA IC |
| 02/21/2002 | US20020020925 Semiconductor module and producing method therefor |
| 02/21/2002 | US20020020923 Semiconductor device and manufacturing method thereof |
| 02/21/2002 | US20020020920 Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals |
| 02/21/2002 | US20020020919 Semiconductor devices, and semiconductor processing methods |
| 02/21/2002 | US20020020918 Semiconductor device and method of manufacturing the same |
| 02/21/2002 | US20020020917 Semiconductor device and manufacturing process |
| 02/21/2002 | US20020020916 Semiconductor package and method for producing the same |
| 02/21/2002 | US20020020915 Semiconductor integrated circuit device with EMI prevention structure |
| 02/21/2002 | US20020020914 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 02/21/2002 | US20020020913 Method of producing a buffer element to reduce mechanical stresses |
| 02/21/2002 | US20020020912 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple |
| 02/21/2002 | US20020020911 Memory card |
| 02/21/2002 | US20020020910 Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same |
| 02/21/2002 | US20020020909 Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package |
| 02/21/2002 | US20020020907 Semiconductor package |
| 02/21/2002 | US20020020906 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device |
| 02/21/2002 | US20020020905 Crosspoint switch with switch matrix module |
| 02/21/2002 | US20020020904 Semiconductor device |
| 02/21/2002 | US20020020901 Semiconductor device and method for production thereof |
| 02/21/2002 | US20020020899 Semiconductor device and electronic device having the same |
| 02/21/2002 | US20020020898 Microelectronic substrates with integrated devices |
| 02/21/2002 | US20020020897 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 02/21/2002 | US20020020896 Electronic component device and method of manufacturing the same |
| 02/21/2002 | US20020020894 RF passive circuit and RF amplifier with via-holes |
| 02/21/2002 | US20020020879 Semiconductor device and a method of manufacturing thereof |
| 02/21/2002 | US20020020865 MRAM with an effective noise countermeasure |
| 02/21/2002 | US20020020862 Substrate interconnect for power distribution on integrated circuits |