| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/28/2002 | US20020024110 Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
| 02/28/2002 | US20020024103 Structure of borderless contact and fabricating method thereof |
| 02/28/2002 | US20020024098 Semiconductor device |
| 02/28/2002 | US20020024093 Semiconductor device with self-aligned contact structure employing dual spacers and method of manufacturing the same |
| 02/28/2002 | US20020024053 Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor |
| 02/28/2002 | US20020024050 Method of making SiC semiconductor devices with W/WC/TaC contacts |
| 02/28/2002 | US20020024046 Semiconductor reliability test chip |
| 02/28/2002 | US20020024025 Semiconductor parts and semiconductor mounting apparatus |
| 02/28/2002 | US20020023944 Bondhead lead clamp apparatus and method |
| 02/28/2002 | US20020023940 Bondhead lead clamp apparatus and method |
| 02/28/2002 | US20020023916 Electornic triggering for heating elements |
| 02/28/2002 | US20020023904 Laser trimming program generation apparatus and method, recording medium, and laser trimming apparatus |
| 02/28/2002 | US20020023901 Energy-efficient, laser-based method and system for processing target material |
| 02/28/2002 | US20020023779 Pre-patterned substrate layers for being personalized as needed |
| 02/28/2002 | US20020023774 Singulation methods and substrates for use with same |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/28/2002 | US20020023766 Method and apparatus for polygonal heat slug |
| 02/28/2002 | US20020023765 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device |
| 02/28/2002 | US20020023742 Integrated circuit heat pipe heat spreader with through mounting holes |
| 02/28/2002 | US20020023737 Stacked-type heat dissipating apparatus |
| 02/28/2002 | US20020023733 High-pressure high-temperature polycrystalline diamond heat spreader |
| 02/28/2002 | US20020023732 Heat sink and process and molding tool for production of same |
| 02/28/2002 | US20020023453 Refrigeration system for electronic components having environmental isolation |
| 02/28/2002 | US20020023440 Cryopump system with modular electronics |
| 02/28/2002 | US20020023343 Method of manufacturing multi-layer printed wiring board |
| 02/28/2002 | DE10139166A1 Surface wave element for fitting in communications devices has a metallized electrode positioned above signal electrodes without contact with them or with an insulating joining material |
| 02/28/2002 | DE10120184A1 Herstellung einer Halbleitervorrichtung mit Kupferverdrahtung Manufacturing a semiconductor device having copper wiring |
| 02/28/2002 | DE10100823C1 Sealed chamber for electronic control unit integrated into vehicle engine or gearbox, is based on dished panel with sealed, flexible printed circuit lead-in and adhered covering |
| 02/28/2002 | DE10064979C1 Semiconductor circuit device has base plate mounted on heat sink provided with stamped-out sections supporting mounting substrates for semiconductor components |
| 02/28/2002 | DE10040188A1 Siegel zur Authentifizierung von versiegelten Objekten und Verfahren zur Herstellung und Prüfung der Siegel Seal to authenticate sealed objects and methods of making and testing of the seal |
| 02/28/2002 | DE10039770A1 Kühlvorrichtung Cooler |
| 02/28/2002 | CA2355591A1 Cooling body for semi-conductor components, process for its production and moulding tool for this |
| 02/27/2002 | EP1182914A2 Electronic control for a heating element |
| 02/27/2002 | EP1182704A2 High frequency module |
| 02/27/2002 | EP1182703A2 Semiconductor device having integrated capacitor and/or inductor |
| 02/27/2002 | EP1182702A1 Device for the Protection of an Integrated Circuit |
| 02/27/2002 | EP1182701A1 Method of manufacturing a buffer element for reducing mechanical strain |
| 02/27/2002 | EP1182665A2 MRAM with an effective noise countermeasure |
| 02/27/2002 | EP1181851A1 System for uniformly interconnecting and cooling |
| 02/27/2002 | EP1181720A1 Methods and apparatus for fabricating a multiple modular assembly |
| 02/27/2002 | EP1181717A1 Fabrication of integrated circuit by selective deposition of precursor liquid |
| 02/27/2002 | EP1181125A1 Pipe preparing tool |
| 02/27/2002 | EP0861503B1 Electrostatic discharge protection circuit comprising staggered contacts |
| 02/27/2002 | CN2479716Y Bridging cooling device |
| 02/27/2002 | CN2479645Y Built-in centrifugal cooling device |
| 02/27/2002 | CN1338119A Apparatus and method for an integrated circuit having high Q reactive components |
| 02/27/2002 | CN1338118A Die pad crack absorption integrated circuit chip and fabrication process |
| 02/27/2002 | CN1338117A Multilayer circuit board and semiconductor device |
| 02/27/2002 | CN1337980A Resin composition, molded article therefrom, and utilization thereof |
| 02/27/2002 | CN1337975A Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 02/27/2002 | CN1337843A Master-board device for module mounting |
| 02/27/2002 | CN1337745A Semiconductor device and method for producing same |
| 02/27/2002 | CN1337743A Package uith for semiconductor device and its manufacture |
| 02/27/2002 | CN1337742A Thin finned heated radiator and its manufacture |
| 02/27/2002 | CN1337741A Semiconductor with injectable conductive area and mfg. method thereof |
| 02/27/2002 | CN1337739A Method for producing semi-conductor device |
| 02/27/2002 | CN1337738A Band with injectable conductive area for semiconductor package treatment and mfg. method thereof |
| 02/27/2002 | CN1337737A Method for producing semi-conductor device |
| 02/27/2002 | CN1079991C Lead frame used for mounting semiconductor chips |
| 02/27/2002 | CN1079785C Aluminum nitride sinter and process for production thereof |
| 02/26/2002 | US6351393 Electronic package for electronic components and method of making same |
| 02/26/2002 | US6351391 Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices |
| 02/26/2002 | US6351389 Device and method for packaging an electronic device |
| 02/26/2002 | US6351387 System and method of heat extraction from an integrated circuit die |
| 02/26/2002 | US6351385 Heat sink for integrated circuit packages |
| 02/26/2002 | US6351384 Device and method for cooling multi-chip modules |
| 02/26/2002 | US6351369 Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit |
| 02/26/2002 | US6351194 Electronic component utilizing face-down mounting |
| 02/26/2002 | US6351044 Cooling apparatus for an electronic device integrally formed with a circuit board |
| 02/26/2002 | US6351040 Method and apparatus for implementing selected functionality on an integrated circuit device |
| 02/26/2002 | US6351039 Integrated circuit dielectric and method |
| 02/26/2002 | US6351035 Strain release contact system for integrated circuits |
| 02/26/2002 | US6351034 Clip chip carrier |
| 02/26/2002 | US6351033 Multifunction lead frame and integrated circuit package incorporating the same |
| 02/26/2002 | US6351032 Method and structure for heatspreader attachment in high thermal performance IC packages |
| 02/26/2002 | US6351031 Semiconductor device and method for manufacturing substrate of the same |
| 02/26/2002 | US6351030 Electronic package utilizing protective coating |
| 02/26/2002 | US6351029 Stackable flex circuit chip package and method of making same |
| 02/26/2002 | US6351027 Chip-mounted enclosure |
| 02/26/2002 | US6351026 Multilayered wiring structure and method of manufacturing the same |
| 02/26/2002 | US6351025 Semiconductor chip having an underplate metal layer |
| 02/26/2002 | US6351021 Low temperature coefficient resistor (TCRL) |
| 02/26/2002 | US6351014 Semiconductor device having different field oxide sizes |
| 02/26/2002 | US6351011 Protection of an integrated circuit with voltage variable materials |
| 02/26/2002 | US6350994 Structure of critical dimension bar |
| 02/26/2002 | US6350959 Method for sorting integrated circuit devices |
| 02/26/2002 | US6350957 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board |
| 02/26/2002 | US6350954 Electronic device package, and method |
| 02/26/2002 | US6350953 Method for potting a populated assembly using an anti-vibration potting compound, populated assembly and controller having a populated assembly |
| 02/26/2002 | US6350952 Semiconductor package including heat diffusion portion |
| 02/26/2002 | US6350951 Electric shielding of on-board devices |
| 02/26/2002 | US6350841 Allylamide compounds, curing agents, photoinitiators with fillers |
| 02/26/2002 | US6350840 Underfill encapsulants prepared from allylated amide compounds |
| 02/26/2002 | US6350838 Package encapsulant compositions for use in electronic devices |
| 02/26/2002 | US6350705 Wafer scale packaging scheme |
| 02/26/2002 | US6350704 Heating, drying and/or pyrolyzing oxide and carbon sources; transforming into porous glass dielectric |
| 02/26/2002 | US6350685 Method for manufacturing semiconductor devices |
| 02/26/2002 | US6350684 Graded/stepped silicide process to improve MOS transistor |
| 02/26/2002 | US6350681 Method of forming dual damascene structure |
| 02/26/2002 | US6350680 Pad alignment for AlCu pad for copper process |