| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/28/2002 | WO2002017692A1 High capacity memory module with higher density and improved manufacturability |
| 02/28/2002 | WO2002017471A1 Portable electronic device with enhanced battery life and cooling |
| 02/28/2002 | WO2002017438A1 Interposer for use in electronic packages |
| 02/28/2002 | WO2002017405A1 Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 02/28/2002 | WO2002017400A1 Power module |
| 02/28/2002 | WO2002017399A1 Semiconductor arrangement and method for production thereof |
| 02/28/2002 | WO2002017398A1 Device for protecting an integrated circuit formed in a substrate |
| 02/28/2002 | WO2002017397A1 Electronic element, method for producing an element of this type and a semiconductor element |
| 02/28/2002 | WO2002017396A1 Substrate for manufacturing a semiconductor device with three element alloy |
| 02/28/2002 | WO2002017395A1 Insulating element |
| 02/28/2002 | WO2002017394A1 Molded shield structures and method for their fabrication |
| 02/28/2002 | WO2002017392A2 Polymer redistribution of flip chip bond pads |
| 02/28/2002 | WO2002017391A2 Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method |
| 02/28/2002 | WO2002017390A2 Refrigeration device and a method for producing the same |
| 02/28/2002 | WO2002017388A2 Method of improving the adhesion of copper |
| 02/28/2002 | WO2002017379A1 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it |
| 02/28/2002 | WO2002017374A1 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof |
| 02/28/2002 | WO2002017362A2 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 02/28/2002 | WO2002016851A2 A cooling system |
| 02/28/2002 | WO2002016473A1 Polyimides for high-frequency applications |
| 02/28/2002 | WO2001080387A3 Over-voltage protection for electronic circuits |
| 02/28/2002 | WO2001075970A3 Element and method for connecting constituents of an electronic assembly |
| 02/28/2002 | WO2001070843A3 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 02/28/2002 | WO2001065599A3 Nitride layer forming methods |
| 02/28/2002 | WO2001063668A3 Method of forming lead-free solder alloys by electrochemical deposition process |
| 02/28/2002 | WO2001059828A3 Building component with constant distorsion-free bonding, and method for bonding |
| 02/28/2002 | US20020026261 Tap connections for circuits with leakage suppression capability |
| 02/28/2002 | US20020025794 High frequency module |
| 02/28/2002 | US20020025690 Semiconductor device and method for manufacturing same |
| 02/28/2002 | US20020025687 Method and apparatus for selective removal of material from wafer alignment marks |
| 02/28/2002 | US20020025675 Electronic devices with diffusion barrier and process for making same |
| 02/28/2002 | US20020025672 Method for forming an integrated circuit interconnect using a dual poly process |
| 02/28/2002 | US20020025671 Method of manufacturing a metal line in a semiconductor device |
| 02/28/2002 | US20020025669 Methods of forming a contact structure in a semiconductor device |
| 02/28/2002 | US20020025668 Wiring pattern formation method and original substrate used for the method |
| 02/28/2002 | US20020025667 Method of forming overmolded chip scale package and resulting product |
| 02/28/2002 | US20020025655 Semiconductor device and manufacturing method thereof |
| 02/28/2002 | US20020025653 Method of forming multilevel interconnection structure having an air gap between interconnects |
| 02/28/2002 | US20020025647 Device formation method for preventing pattern shift caused by glass layer reflow |
| 02/28/2002 | US20020025635 Method for fabricating connection structure between segment transistor and memory cell region of flash memory device |
| 02/28/2002 | US20020025623 Semiconductor device, manufacturing method therefor, and thin film capacitor |
| 02/28/2002 | US20020025610 Method for substrate noise distribution |
| 02/28/2002 | US20020025608 Memory module, method of manufacturing the memory module, and test connector using the memory module |
| 02/28/2002 | US20020025607 Semiconductor device and a method of manufacturing the same |
| 02/28/2002 | US20020025606 Semiconductor device and manufacturing method thereof |
| 02/28/2002 | US20020025605 Suppression recesses; controlled polishing |
| 02/28/2002 | US20020025603 Method for mounting an electronic component |
| 02/28/2002 | US20020025601 Apparatus for packaging semiconductor device and method for packaging the same |
| 02/28/2002 | US20020025599 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 02/28/2002 | US20020025598 Lead frame tooling design for bleed barrier groove |
| 02/28/2002 | US20020025588 Position detection mark and position detection method |
| 02/28/2002 | US20020025587 Semiconductor device and method for manufacturing the same |
| 02/28/2002 | US20020025585 Metal redistribution layer having solderable pads and wire bondable pads |
| 02/28/2002 | US20020025453 Perovskite mixed oxide |
| 02/28/2002 | US20020025431 Tape automated bonding (TAB); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 02/28/2002 | US20020025417 Novel approach to structurally reinforcing the mechanical performance of silicon level interconnect layers |
| 02/28/2002 | US20020025391 Electrically conductive material is selected from the group of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyphenylenes, polyanilines, polythiophenes, polyphenylene sulfide, polyacetylenes, blends or copolymer |
| 02/28/2002 | US20020024883 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| 02/28/2002 | US20020024857 Multi-layer lead frame for a semiconductor device |
| 02/28/2002 | US20020024856 Semiconductor memory device |
| 02/28/2002 | US20020024833 Memory module for preventing skew between bus lines |
| 02/28/2002 | US20020024801 Integrated circuit pakage substrate integrating with decoupling capacitor |
| 02/28/2002 | US20020024798 Heat sink with alignment and retaining features |
| 02/28/2002 | US20020024797 Heat dissipation device |
| 02/28/2002 | US20020024796 Heat sink |
| 02/28/2002 | US20020024453 Semiconductor device, terminal device and communication method |
| 02/28/2002 | US20020024409 Lead frame set and saw filter using the same |
| 02/28/2002 | US20020024392 High frequency power amplifier system and wireless communication system |
| 02/28/2002 | US20020024351 Method and apparatus for evaluating insulating film |
| 02/28/2002 | US20020024154 Thermoelectric module |
| 02/28/2002 | US20020024151 Multi-chip module with extension |
| 02/28/2002 | US20020024150 Etch stop in damascene interconnect structure and method of making |
| 02/28/2002 | US20020024149 Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
| 02/28/2002 | US20020024148 Semiconductor device, designing method and designing device thereof |
| 02/28/2002 | US20020024147 Low-pin-count chip package and manufacturing method thereof |
| 02/28/2002 | US20020024146 Semiconductor device |
| 02/28/2002 | US20020024145 Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof |
| 02/28/2002 | US20020024144 Bi-level digit line architecture for high density drams |
| 02/28/2002 | US20020024142 Semiconductor device and manufacturing method of the same |
| 02/28/2002 | US20020024141 Semiconductor device including a plurality of interconnection layers, manufacturing method thereof and method of designing semiconductor circuit used in the manufacturing method |
| 02/28/2002 | US20020024140 Semiconductor device |
| 02/28/2002 | US20020024139 Combined capping layer and ARC for CU interconnects |
| 02/28/2002 | US20020024138 Wiring board for high dense mounting and method of producing the same |
| 02/28/2002 | US20020024136 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 02/28/2002 | US20020024133 IC package with dual heat spreaders |
| 02/28/2002 | US20020024132 Semiconductor device with internal heat dissipation |
| 02/28/2002 | US20020024131 Hollow package and method for fabricating the same and solid-state image apparatus provided therewith |
| 02/28/2002 | US20020024130 Electronic component and electronic equipment using the same |
| 02/28/2002 | US20020024128 Method and apparatus for implementing selected functionality on an integrated circuit device |
| 02/28/2002 | US20020024127 Semiconductor device and manufacture method of that |
| 02/28/2002 | US20020024125 Semiconductor device and method for assembling the same |
| 02/28/2002 | US20020024124 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board |
| 02/28/2002 | US20020024123 Low profile ball grid array package |
| 02/28/2002 | US20020024122 Lead frame having a side ring pad and semiconductor chip package including the same |
| 02/28/2002 | US20020024121 A semiconductor package produced by solder plating without solder residue |
| 02/28/2002 | US20020024120 Power module |
| 02/28/2002 | US20020024119 Semiconductor device and method of manufacturing the same |
| 02/28/2002 | US20020024117 Dielectric layer liner for an integrated circuit structure |
| 02/28/2002 | US20020024116 Method and apparatus for magnetic shielding of an integrated circuit |
| 02/28/2002 | US20020024115 Sacrificial structures for arresting insulator cracks in semiconductor devices |