| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/07/2002 | DE10041694A1 Production of a semiconductor thin housing used for flat displays and mobile telephones comprises fixing a chip on a substrate, contacting a gold wire between an aluminum pad on the substrate and the chip, etc. |
| 03/07/2002 | DE10039927A1 Housing for surface mounted device (SMD) component, has heat slug joined to molded body for supply and removal of heat |
| 03/07/2002 | DE10034878A1 DRAM checking method for quality inspection, involves storing test results in non-volatile memory area of DRAM |
| 03/06/2002 | EP1184979A2 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 03/06/2002 | EP1184967A2 RF oscillator apparatus and transceiver apparatus |
| 03/06/2002 | EP1184910A2 Field plated resistor with enhanced routing area thereover |
| 03/06/2002 | EP1184909A2 Method of manufacturing an integrated circuit |
| 03/06/2002 | EP1184905A1 Power feed and heat dissipating device for power semiconductor devices |
| 03/06/2002 | EP1184904A2 Substrate for manufacturing a semiconductor device with three element alloy |
| 03/06/2002 | EP1184900A2 Battery management circuit with power mosfets and manufacturing method thereof |
| 03/06/2002 | EP1184899A2 Heat conductive adhesive film and manufacturing method thereof and electronic component |
| 03/06/2002 | EP1184896A1 Pattern matching method and device, position determining method and device, position aligning method and device, exposing method and device, and device and its production method |
| 03/06/2002 | EP1184419A2 Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| 03/06/2002 | EP1183740A1 Concentrically leaded power semiconductor device package |
| 03/06/2002 | EP1183734A1 Lateral dmos improved breakdown structure and method |
| 03/06/2002 | EP1183730A2 Improved integrated oscillators and tuning circuits |
| 03/06/2002 | EP1183729A1 Method and apparatus using silicide layer for protecting integrated circuits from reverse engineering |
| 03/06/2002 | EP1183726A1 Method for handling thinned chips for introducing them into chip cards |
| 03/06/2002 | EP1183725A1 Semiconductor device and method of manufacturing same |
| 03/06/2002 | EP1183724A1 A method of manufacturing a semiconductor device |
| 03/06/2002 | EP1183723A1 Circuit suitable for vertical integration and method of producing same |
| 03/06/2002 | EP1183722A1 Apparatus and method for reducing differential sputter rates |
| 03/06/2002 | EP1183719A1 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 03/06/2002 | EP1183642A1 Integrated circuit device which is secured against attacks resulting from controlled destruction of an additional layer |
| 03/06/2002 | EP1015836A4 Heat sink including pedestal |
| 03/06/2002 | EP0938748B1 Power connection for power semiconductor component |
| 03/06/2002 | EP0746875B1 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
| 03/06/2002 | CN2480989Y Suction/exhausting adjustable heat sink assembly |
| 03/06/2002 | CN2480988Y Heat sink |
| 03/06/2002 | CN2480987Y Heat sink assembly |
| 03/06/2002 | CN2480986Y Chip heat conduction and sink module |
| 03/06/2002 | CN1339243A Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| 03/06/2002 | CN1339176A Semiconductor device, method and device for producing same, circuit board and electronic equipment |
| 03/06/2002 | CN1339175A Multiple chip module with integrated RF capabilities |
| 03/06/2002 | CN1339049A Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 03/06/2002 | CN1338890A Electronic elements and manufacture thereof |
| 03/06/2002 | CN1338880A Photoelectric device and electronic apparatus |
| 03/06/2002 | CN1338830A Array-type integrated sensor based on weak-light electromechanical system for emitting or receiving laser |
| 03/06/2002 | CN1338819A Surface wave device |
| 03/06/2002 | CN1338779A 半导体器件 Semiconductor devices |
| 03/06/2002 | CN1338778A Auxiliary fixer of heat sink |
| 03/06/2002 | CN1338777A Thin semiconductor device and its preparing process |
| 03/06/2002 | CN1338775A Semiconductor device and manufacture thereof, substrate of electric circuits and electronic device |
| 03/06/2002 | CN1080458C Mask for detecting defect |
| 03/05/2002 | US6353540 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
| 03/05/2002 | US6353538 Protective cover and packaging for multi-chip memory modules |
| 03/05/2002 | US6353537 Structure for mounting radiating plate |
| 03/05/2002 | US6353420 Wireless article including a plural-turn loop antenna |
| 03/05/2002 | US6353353 Integrated semiconductor circuit with improved power supply control |
| 03/05/2002 | US6353328 Test system with mechanical alignment for semiconductor chip scale packages and dice |
| 03/05/2002 | US6353295 Lamp electronic ballast with a piezoelectric cooling fan |
| 03/05/2002 | US6353267 Semiconductor device having first and second sealing resins |
| 03/05/2002 | US6353266 Semiconductor device having improved pad coupled to wiring on semiconductor substrate |
| 03/05/2002 | US6353265 Semiconductor device |
| 03/05/2002 | US6353263 Semiconductor device and manufacturing method thereof |
| 03/05/2002 | US6353262 Circuit substrate, detector, and method of manufacturing the same |
| 03/05/2002 | US6353261 Method and apparatus for reducing interconnect resistance using an interconnect well |
| 03/05/2002 | US6353259 Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor device |
| 03/05/2002 | US6353258 Semiconductor module |
| 03/05/2002 | US6353257 Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention |
| 03/05/2002 | US6353256 IC package structure for achieving better heat dissipation |
| 03/05/2002 | US6353255 Semiconductor device and manufacturing method thereof |
| 03/05/2002 | US6353243 Process for manufacturing an integrated circuit comprising an array of memory cells |
| 03/05/2002 | US6353235 Plasma damage detector and plasma damage evaluation method |
| 03/05/2002 | US6353189 Wiring board, wiring board fabrication method, and semiconductor package |
| 03/05/2002 | US6353182 Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
| 03/05/2002 | US6352945 Introducing silicon compound having two alkoxy groups or less with no additive gas into reaction chamber for plasma chemical vapor deposition containing semiconductor substrate, activating plasma polymerization to form silicone film |
| 03/05/2002 | US6352940 Semiconductor passivation deposition process for interfacial adhesion |
| 03/05/2002 | US6352935 Method of forming a cover cap for semiconductor wafer devices |
| 03/05/2002 | US6352926 Structure for improving low temperature copper reflow in semiconductor features |
| 03/05/2002 | US6352925 Method of making electrical conductor system for semiconductor device |
| 03/05/2002 | US6352921 Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization |
| 03/05/2002 | US6352917 Reversed damascene process for multiple level metal interconnects |
| 03/05/2002 | US6352916 Method of forming plugs in multi-level interconnect structures by partially removing conductive material from a trench |
| 03/05/2002 | US6352915 Method for manufacturing semiconductor package containing cylindrical type bump grid array |
| 03/05/2002 | US6352914 Interleaved signal trace routing |
| 03/05/2002 | US6352904 Alignment mark strategy for oxide CMP |
| 03/05/2002 | US6352902 Process of forming a capacitor on a substrate |
| 03/05/2002 | US6352882 Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipation |
| 03/05/2002 | US6352880 Semiconductor device and manufacture thereof |
| 03/05/2002 | US6352879 Semiconductor device and method of manufacturing the same |
| 03/05/2002 | US6352782 Reacting a polyphenylene ether containing hydroxy groups that have been capped with a compound containing ethylenically unsaturation with a curable unsaturated monomer capable of reacting with ethylenically unsaturated compound |
| 03/05/2002 | US6352743 Semiconductor copper band pad surface protection |
| 03/05/2002 | US6352741 Planar high temperature superconductive integrated circuits for using ion implantation |
| 03/05/2002 | US6352634 Method for producing a lead-free substrate |
| 03/05/2002 | US6352620 Staged aluminum deposition process for filling vias |
| 03/05/2002 | US6352435 Chip socket assembly and chip file assembly for semiconductor chips |
| 03/05/2002 | US6352422 Method and apparatus for epoxy loc die attachment |
| 03/05/2002 | US6352203 Automated semiconductor identification system |
| 03/05/2002 | US6352195 Method of forming an electronic package with a solder seal |
| 03/05/2002 | US6352189 Ball suction head |
| 03/05/2002 | US6352104 Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
| 03/05/2002 | US6352103 High performance notebook PC cooling system |
| 03/05/2002 | US6351885 Method of making conductive bump on wiring board |
| 03/05/2002 | US6351883 Self align leadframe having resilient carrier positioning means |
| 03/05/2002 | US6351880 Method of forming multi-chip module having an integral capacitor element |
| 03/05/2002 | CA2353356A1 Method of manufacturing an optical semiconductor module |
| 03/05/2002 | CA2086287C Method of manufacturing fusible links in semiconductor devices |
| 03/05/2002 | CA2047486C Semiconductor device and method for manufacturing the same |
| 02/28/2002 | WO2002017698A2 Distributed thermal management system for electronic components |