Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/03/2013US8598700 Active thermal control for stacked IC devices
12/03/2013US8598699 Semiconductor device having a ground metal layer through which at least one hole is formed, and a ground patch disposed in the at least one hole
12/03/2013US8598697 Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module
12/03/2013US8598696 Multi-surface IC packaging structures
12/03/2013US8598695 Active chip on carrier or laminated chip having microelectronic element embedded therein
12/03/2013US8598694 Chip-package having a cavity and a manufacturing method thereof
12/03/2013US8598693 Die pad package with a concave portion in the sealing resin
12/03/2013US8598692 Semiconductor device and method for manufacturing same
12/03/2013US8598690 Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground
12/03/2013US8598689 Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
12/03/2013US8598686 Electronic device package structure with a hydrophilic protection layer and method for fabricating the same
12/03/2013US8598680 Semiconductor device with electrical fuse
12/03/2013US8598679 Stacked and tunable power fuse
12/03/2013US8598668 Semiconductor device
12/03/2013US8598667 Semiconductor device
12/03/2013US8598634 Graphene-based efuse device
12/03/2013US8598633 Semiconductor device having contact layer providing electrical connections
12/03/2013US8598630 Photo alignment mark for a gate last process
12/03/2013US8598616 Light emitting device and light unit using the same
12/03/2013US8598597 Semiconductor device and method of manufacturing semiconductor device
12/03/2013US8598579 Test structure for ILD void testing and contact resistance measurement in a semiconductor device
12/03/2013US8598471 Electric storage device
12/03/2013US8598458 Electronic device and method of manufacturing the same
12/03/2013US8598048 Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
12/03/2013US8598032 Reduced number of masks for IC device with stacked contact levels
12/03/2013US8597988 System for flash-free overmolding of led array substrates
12/03/2013US8597189 Analyte monitoring device and methods of use
12/03/2013US8596545 Component of wireless IC device and wireless IC device
12/03/2013DE202006021231U1 Leistungshalbleitermodul The power semiconductor module
11/2013
11/28/2013WO2013177541A1 Polymer hot-wire chemical vapor deposition in chip scale packaging
11/28/2013WO2013177445A1 Grid arrays with enhanced fatigue life
11/28/2013WO2013177134A1 Substrate-less stackable package with wire-bond interconnect
11/28/2013WO2013176824A1 Semiconductor constructions and methods of forming semiconductor constructions
11/28/2013WO2013176662A1 Multi-stacked bbul package
11/28/2013WO2013176520A1 Semiconductor package substrate, package system using the same and method for manufacturing thereof
11/28/2013WO2013176519A1 Semiconductor package substrate, package system using the same and method for manufacturing thereof
11/28/2013WO2013176426A1 Semiconductor package, fabrication method therefor, and package-on package
11/28/2013WO2013176238A1 Curable resin composition, and cured product, sealing agent, and optical semiconductor device using same
11/28/2013WO2013175943A1 Composite module
11/28/2013WO2013175744A1 Easily deformable aggregates and process for producing same, thermally conductive resin composition, thermally conductive member and process for producing same, and thermally conductive adhesion sheet
11/28/2013WO2013175714A1 Semiconductor device and method for manufacturing same
11/28/2013WO2013175616A1 Cooling structure for card-type electronic component, and electronic apparatus
11/28/2013WO2013175333A1 Surface mountable semiconductor device
11/28/2013WO2013174418A1 Method for producing an electronic subassembly
11/28/2013WO2013174099A1 Chip stack encapsulation structure
11/28/2013WO2013095147A9 Method of bonding two substrates and device manufactured thereby
11/28/2013WO2013016136A3 A two-part dual-cure adhesive for use on electronics
11/28/2013US20130316526 Voltage switchable dielectric for die-level electrostatic discharge (esd) protection
11/28/2013US20130316500 Method of manufacturing semiconductor device
11/28/2013US20130316496 Method of manufacturing semiconductor package having no chip pad
11/28/2013US20130316494 Chip package and method for forming the same
11/28/2013US20130316153 Constructions Comprising Rutile-Type Titanium Oxide; And Methods of Forming and Utilizing Rutile-Type Titanium Oxide
11/28/2013US20130315782 Biochip and fabrication thereof
11/28/2013US20130315004 Semiconductor device, a method for manufacturing the same, and a system having the same
11/28/2013US20130314968 Offsetting clock package pins in a clamshell topology to improve signal integrity
11/28/2013US20130314877 Semiconductor package and wiring board unit
11/28/2013US20130314150 Method for Detecting Electrical Energy Produced from a Thermoelectric Material contained in an Integrated Circuit
11/28/2013US20130314121 Method and device for protecting an integrated circuit against backside attacks
11/28/2013US20130313727 Multi-stacked bbul package
11/28/2013US20130313726 Low-temperature flip chip die attach
11/28/2013US20130313725 Multilayer interconnect structure and method for integrated circuits
11/28/2013US20130313724 Shielded coplanar line
11/28/2013US20130313723 Semiconductor chip layout with staggered tx and tx data liness
11/28/2013US20130313722 Through-silicon via (tsv) semiconductor devices having via pad inlays
11/28/2013US20130313721 Semiconductor Module with Micro-Buffers
11/28/2013US20130313720 Packaging substrate with reliable via structure
11/28/2013US20130313719 Chip packages and methods for manufacturing a chip package
11/28/2013US20130313718 Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated Circuitry
11/28/2013US20130313717 Spacer for enhancing via pattern overlay tolerence
11/28/2013US20130313716 Substrate-less stackable package with wire-bond interconnect
11/28/2013US20130313715 Component Leg Arrangement
11/28/2013US20130313714 Semiconductor device having enhanced signal integrity
11/28/2013US20130313713 Extremely stretchable electronics
11/28/2013US20130313711 Semiconductor Device And A Method Of Manufacturing Same
11/28/2013US20130313710 Semiconductor Constructions and Methods of Forming Semiconductor Constructions
11/28/2013US20130313708 Semiconductor integrated circuit device
11/28/2013US20130313707 Electrical Interconnections of Semiconductor Devices and Methods for Fabricating the Same
11/28/2013US20130313706 Semiconductor device
11/28/2013US20130313705 Implementing decoupling devices inside a tsv dram stack
11/28/2013US20130313704 Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
11/28/2013US20130313703 Semiconductor device having wafer-level chip size package
11/28/2013US20130313702 Semiconductor device and method for manufacturing the same
11/28/2013US20130313701 High-voltage switch with a cooling device
11/28/2013US20130313700 Cavity-type semiconductor package and method of packaging same
11/28/2013US20130313699 Fan-out high-density packaging methods and structures
11/28/2013US20130313698 Semiconductor package
11/28/2013US20130313697 Semiconductor package
11/28/2013US20130313696 Power semiconductor package and method of manufacturing the same
11/28/2013US20130313695 Semiconductor device
11/28/2013US20130313694 Packaged circuit with a lead frame and laminate substrate
11/28/2013US20130313693 Epoxy-thiol compositions with improved stability
11/28/2013US20130313692 Antenna in package with reduced electromagnetic interaction with on chip elements
11/28/2013US20130313690 Semiconductor device
11/28/2013US20130313689 Semiconductor device
11/28/2013US20130313688 Semiconductor device and method of producing semiconductor device
11/28/2013US20130313687 Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing method
11/28/2013US20130313627 Multi-Level Contact to a 3D Memory Array and Method of Making
11/28/2013US20130313620 Method and structure for radiation hardening a semiconductor device
11/28/2013US20130313574 Semiconductor power module and method of manufacturing the same
11/28/2013US20130313553 Semiconductor fuse with enhanced post-programming resistance
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