Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2002
03/12/2002US6354792 IC receiving tray storage device and mounting apparatus for the same
03/12/2002US6354485 Thermally enhanced packaged semiconductor assemblies
03/12/2002US6354370 Liquid spray phase-change cooling of laser devices
03/12/2002US6354000 Method of creating an electrical interconnect device bearing an array of electrical contact pads
03/12/2002CA2232843C Plastic package, semiconductor device, and method of manufacturing plastic package
03/07/2002WO2002019783A1 Circuit board unit and method of manufacture thereof
03/07/2002WO2002019440A1 Encapsulants for solid state devices
03/07/2002WO2002019430A2 Hybrid substrate with embedded capacitors and methods of manufacture
03/07/2002WO2002019428A1 Cluster globular semiconductor device
03/07/2002WO2002019427A2 Integrated circuit package incorporating camouflaged programmable elements
03/07/2002WO2002019426A1 Method for producing an antifuse and antifuse for allowing selective electrical connection of neighbouring conductive zones
03/07/2002WO2002019425A1 Method for production of a support element for an ic component
03/07/2002WO2002019424A2 Electronic assembly comprising solderable thermal interface and methods of manufacture
03/07/2002WO2002019423A1 Composite
03/07/2002WO2002019422A2 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
03/07/2002WO2002019421A1 Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines
03/07/2002WO2002019416A1 Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps
03/07/2002WO2002019413A1 An exposed paddle leadframe for semiconductor die packaging
03/07/2002WO2002019403A1 Composite structure for electronic microsystems and method for production of said composite structure
03/07/2002WO2002018960A2 Device and method for characterizing the version of integrated circuits and use for controlling operations
03/07/2002WO2001073841A3 Method of preventing bridging between polycrystalline micro-scale features
03/07/2002WO2001069676A3 Method and apparatus for bonding substrates
03/07/2002WO2001061751A3 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor
03/07/2002WO2001056921A3 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
03/07/2002WO2001054232A3 Flexible compliant interconnect assembly
03/07/2002WO2001048819A3 Interconnect structure and method of fabrication therefor
03/07/2002US20020028599 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
03/07/2002US20020028582 Accuracy control of etching using plasma
03/07/2002US20020028580 Substrate polishing method
03/07/2002US20020028579 Low resistivity tantalum
03/07/2002US20020028576 Method and apparatus for forming improved metal interconnects
03/07/2002US20020028575 Method of manufacturing a semiconductor device
03/07/2002US20020028573 Automatic wiring method for semiconductor package enabling design of high-speed wiring for semiconductor package with reduced labor
03/07/2002US20020028572 Method of manufacturing an optical semiconductor module
03/07/2002US20020028571 Transparent and conductive zinc oxide film with low growth temperature
03/07/2002US20020028539 Semiconductor device and method for fabricating the same
03/07/2002US20020028537 Hermetic chip and method of manufacture
03/07/2002US20020028536 Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
03/07/2002US20020028534 Deflectable interconnect
03/07/2002US20020028532 Method of manufacturing a multi-chip semiconductor device effective to improve alignment
03/07/2002US20020028530 High-frequency module and manufacturing method of the same
03/07/2002US20020028528 Alignment marks and method of forming the same
03/07/2002US20020028338 Method and an apparatus for forming an under bump metallization structure
03/07/2002US20020028337 Forming laminate; curing; cladding with copper; printed circuits
03/07/2002US20020028284 Method to embed passive components
03/07/2002US20020028045 Optical coupling structures and the fabrication processes
03/07/2002US20020027773 Sub-package bypass capacitor mounting for an array packaged integrated circuit
03/07/2002US20020027760 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
03/07/2002US20020027298 Semiconductor device and method of manufacturing the same
03/07/2002US20020027297 Semiconductor package
03/07/2002US20020027296 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
03/07/2002US20020027295 Stacked semiconductor device and method of producing the same
03/07/2002US20020027294 Electrical component assembly and method of fabrication
03/07/2002US20020027293 Three dimensional semiconductor integrated circuit device and method for making the same
03/07/2002US20020027292 Semiconductor device having trench interconnection and method of fabricating same
03/07/2002US20020027291 Semiconductor device for preventing corrosion of metallic featues
03/07/2002US20020027290 Semiconductor device and method of manufacturing the same
03/07/2002US20020027289 Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding pads
03/07/2002US20020027287 Semiconductor device with copper wiring and its manufacture method
03/07/2002US20020027286 Low leakage current silicon carbonitride prepared using methane, ammonia and silane for copper diffusion barrier, etchstop and passivation applications
03/07/2002US20020027284 Solid-state image pickup device
03/07/2002US20020027283 Hermetically sealed semiconductor power module and large scale module comprising the same
03/07/2002US20020027282 Composite monolithic electronic component
03/07/2002US20020027281 Semiconductor device
03/07/2002US20020027280 Integrated circuit package electrical enhancement
03/07/2002US20020027279 Semiconductor package
03/07/2002US20020027278 Utilization of die active surfaces for laterally extending die internal and external connections
03/07/2002US20020027277 Deflectable interconnect
03/07/2002US20020027276 Circuit device and method of manufacturing the same
03/07/2002US20020027274 Semiconductor device and fabrication method
03/07/2002US20020027273 Semiconductor package and fabricating method thereof
03/07/2002US20020027272 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
03/07/2002US20020027271 Dual LOC semiconductor assembly employing floating lead finger structure
03/07/2002US20020027270 Semiconductor device having a die pad supported by a die pad supporter
03/07/2002US20020027269 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
03/07/2002US20020027268 Resin-encapsulated semiconductor apparatus and process for its fabrication
03/07/2002US20020027267 Thin-type semiconductor device and die pad thereof
03/07/2002US20020027266 Semiconductor device and a method of manufacturing the same
03/07/2002US20020027265 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
03/07/2002US20020027261 Selective Deposition Process For Passivating Top Interface Of Damascene-Type Cu Interconnect Lines
03/07/2002US20020027260 Semiconductor device with isolation insulator, interlayer insulation film, and a sidewall coating film
03/07/2002US20020027252 Dual-gate CMOS semiconductor device and dual-gate CMOS semiconductor device manufacturing method
03/07/2002US20020027251 Semiconductor device
03/07/2002US20020027250 A protective element formed in an soi substrate for preventing a breakdown in an oxide film located below a diffused resistor
03/07/2002US20020027248 Laser fuseblow protection method for silicon on insulator (SOI) transistors
03/07/2002US20020027231 Optical semiconductor device package and optical semiconductor module having the same
03/07/2002US20020027084 Supplying deionized water into an anode cell and a cathode cell of a 3-cell electrolyzer; filling intermediate cell with an electrolytic aqueous solution to perform electrolysis, cells of electrolyzer are divided by ion exchange membranes
03/07/2002US20020027022 Front-and-back electrically conductive substrate and method for manufacturing same
03/07/2002US20020027019 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
03/07/2002US20020027016 Manufacture of dendrites and their use
03/07/2002US20020027011 Multi-chip module made of a low temperature co-fired ceramic and mounting method thereof
03/07/2002US20020027010 Plastic integrated circuit device package having exposed lead surface
03/07/2002US20020026980 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
03/07/2002DE10139755A1 Forming marking for measuring alignment of more than two layers of semiconductor wafer by matching discontinuity in respective patterns
03/07/2002DE10133443A1 Halbleiterschaltungsanordnung mit Energiezufuhr- und Masseleitungen, angepasst für Hochfrequenzbetrieb Semiconductor circuitry with Energiezufuhr- and ground lines adapted for high-frequency operation
03/07/2002DE10132668A1 Halbleitervorrichtung mit definierter Eingangs- /Ausgangsblockgröße und Verfahren zu deren Entwicklung A semiconductor device having a defined input / output block size, and methods for their development
03/07/2002DE10125725A1 Ball-Grid-Array-Packung Ball Grid Array Package
03/07/2002DE10100142A1 Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin
03/07/2002DE10041770A1 Microwave module comprising substrate with HF and LF layers forming distribution network structures, includes intervening insulating layer
03/07/2002DE10041695A1 Capsule construction for flip-chip connected to chip and base has chip stuck onto base using surface adhesive flat encapsulation method, auxiliary chip stuck on to form housing
1 ... 1789 1790 1791 1792 1793 1794 1795 1796 1797 1798 1799 1800 1801 1802 1803 1804 1805 1806 1807 1808 1809 ... 2262