Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2002
03/14/2002US20020031868 Semiconductor flip-chip package and method for the fabrication thereof
03/14/2002US20020031867 Semiconductor device and process of production of same
03/14/2002US20020031866 Method of pressure curing for reducing voids in a die attach bondline and applications thereof
03/14/2002US20020031865 Method for fabricating a dual-chip package and package formed
03/14/2002US20020031863 For preventing damage to wafer during cutting
03/14/2002US20020031862 Lead frame and production method thereof, and semiconductor device and fabrication method thereof
03/14/2002US20020031859 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property
03/14/2002US20020031858 Semiconductor device comprising a socket and method for forming same
03/14/2002US20020031856 Repairable multi-chip package and high-density memory card having the package
03/14/2002US20020031732 Selecting wafer to be imprinted with wafer-identifying information; forming a resist layer, exposing resist layer, using a mask, to light for forming latent image of wafer-identifying information; forming patterned resist layer
03/14/2002US20020031672 Sealed with silicon gel
03/14/2002US20020031660 Vertical overlapping; sealing electronic structures
03/14/2002US20020031650 Electronic chip package
03/14/2002US20020031642 Method for producing filled vias in electronic components
03/14/2002US20020031566 Method and apparatus for filling a gap between spaced layers of a semiconductor
03/14/2002US20020030979 Circuit board system for optiming contact pin layout in an integrated circuit
03/14/2002US20020030975 Packaged microelectronic die assemblies and methods of manufacture
03/14/2002US20020030972 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
03/14/2002US20020030732 Laser marking techniques
03/14/2002US20020030573 Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device
03/14/2002US20020030445 Chip type light emitting diode and method of manufacture thereof
03/14/2002US20020030290 Semiconductor device and method for manufacturing the same
03/14/2002US20020030289 Wire arrayed chip size package and fabrication method thereof
03/14/2002US20020030288 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/14/2002US20020030284 Method and apparatus for a semiconductor package for vertical surface mounting
03/14/2002US20020030283 Semiconductor device having wires and insulator layers with via-studs
03/14/2002US20020030282 In-situ electroplated oxide passivating film for corrosion inhibition
03/14/2002US20020030280 Semiconductor device having dual damascene line structure and method for fabricating the same
03/14/2002US20020030279 Semiconductor device and method for manufacturing same
03/14/2002US20020030278 Metallization arrangement for semiconductor structure and corresponding fabrication method
03/14/2002US20020030276 Dimple array interconnect technique for semiconductor device
03/14/2002US20020030275 Compositions for improving interconnect metallization performance in integrated circuits
03/14/2002US20020030274 Barrier and electroplating seed layer
03/14/2002US20020030273 Semiconductor device and electron device
03/14/2002US20020030272 Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus
03/14/2002US20020030270 Semiconductor device
03/14/2002US20020030269 Microwave monolithic integrated circuit package
03/14/2002US20020030268 Hybrid integrated circuit device
03/14/2002US20020030267 Compound semiconductor device
03/14/2002US20020030266 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
03/14/2002US20020030265 Integrated-circuit case
03/14/2002US20020030264 Integrated circuit device
03/14/2002US20020030261 Multi-flip-chip semiconductor assembly
03/14/2002US20020030260 Electronic component and method of manufacture
03/14/2002US20020030259 Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof
03/14/2002US20020030258 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
03/14/2002US20020030257 Semiconductor device utiling an encapsulant for locking a semiconductor die to circuit substrate
03/14/2002US20020030256 Memory card
03/14/2002US20020030254 Die paddle clamping method for wire bond enhancement
03/14/2002US20020030253 LOC semiconductor assembled with room temperature adhesive
03/14/2002US20020030252 Semiconductor device and method of making the same, circuit board and electronic equipment
03/14/2002US20020030251 Resin-encapsulated semiconductor device
03/14/2002US20020030250 Thick film millimeter wave transceiver module
03/14/2002US20020030249 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
03/14/2002US20020030248 Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor device
03/14/2002US20020030246 Structure and method for fabricating semiconductor structures and devices not lattice matched to the substrate
03/14/2002US20020030245 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
03/14/2002US20020030242 Integrated inductive circuits
03/14/2002US20020030241 Integrated radio frequency circuits
03/14/2002US20020030239 Semiconductor device with temperature regulation
03/14/2002US20020030238 Semiconductor device
03/14/2002US20020030235 Boron incorporated diffusion barrier material
03/14/2002US20020030219 Side wall contact structure and method of forming the same
03/14/2002US20020030215 Semiconductor device
03/14/2002US20020030213 Semiconductor integrated circuit device and process for manufacturing the same
03/14/2002US20020030212 Semiconductor integrated circuit device
03/14/2002US20020030187 Method of evaluating critical locations on a semiconductor apparatus pattern
03/14/2002US20020030040 Laser marking techniques for bare semiconductor die
03/14/2002US20020029905 Method for manufacturing modular board
03/14/2002US20020029902 Microelectronic assemblies having solder-wettable pads and conductive elements
03/14/2002US20020029894 Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member
03/14/2002US20020029876 Corrugated matrix heat sink for cooling electronic components
03/14/2002US20020029873 Cooling device boiling and condensing refrigerant
03/14/2002US20020029868 Heat sink and information processor using heat sink
03/14/2002US20020029867 Heat sink Assembly
03/14/2002US20020029838 Multilayered board and method for fabricating the same
03/14/2002US20020029743 Method and apparatus for applying adhesives to a lead frame
03/14/2002US20020029742 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
03/14/2002US20020029741 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
03/14/2002US20020029704 Screen printing paste, screen printing method, and baked thick film body
03/14/2002US20020029473 Method of manufacturing a plated electronic termination
03/14/2002DE10136285A1 Integrierte Halbleiterschaltungsvorrichtung und Verfahren zum Anbringen von Schaltungsblöcken in der integrierten Halbleiterschaltungsvorrichtung A semiconductor integrated circuit apparatus and method for attaching of circuit blocks in the semiconductor integrated circuit device
03/14/2002DE10043450A1 Improved method for mounting chips with protuberances in manufacturing process, for use in microelectronics
03/14/2002DE10043137A1 Vorrichtung und Verfahren zur Kennzeichnung der Version bei integrierten Schaltkreisen und Verwendung zur Steuerung von Betriebsabläufen Apparatus and method for identifying the version of integrated circuits and use for the control of operations
03/14/2002DE10042312A1 Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein A process for producing a support element for an IC module
03/14/2002DE10041691A1 Halbleiteranordnung Semiconductor device
03/14/2002DE10041328A1 Verpackungseinheit für Halbleiterchips Package for semiconductor chips
03/14/2002DE10041112A1 Isolierelement Insulating
03/13/2002EP1187523A2 High-frequency module and manufacturing method of the same
03/13/2002EP1187518A2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
03/13/2002EP1187514A2 Printed wiring board
03/13/2002EP1187322A2 Piezoelectric device and method of manufacturing it
03/13/2002EP1187321A2 Piezoelectric device and method of manufacturing it
03/13/2002EP1187320A2 Method for manufacturing radio frequency module components with surface acoustic wave element
03/13/2002EP1187319A2 Lead frame set and saw filter using the same
03/13/2002EP1187258A1 Fuse relay junction block for use in automobiles
03/13/2002EP1187214A2 Semiconductor device with a protection against ESD
03/13/2002EP1187212A2 Display apparatus
03/13/2002EP1187211A2 Stacked Semiconductor Device
03/13/2002EP1187209A2 Electronic device incorporating stacked building blocks and process of manufacturing the same
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