| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/13/2002 | EP1187208A2 Semiconductor device |
| 03/13/2002 | EP1187207A2 Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
| 03/13/2002 | EP1187206A1 Integrated electromagnetic protection device |
| 03/13/2002 | EP1187205A2 Chip scale package with thermally and electrically conductive pad and manufacturing method thereof |
| 03/13/2002 | EP1187204A2 Circuit device and method of manufacturing the same |
| 03/13/2002 | EP1187203A2 A semiconductor device and method of manufacturing the same |
| 03/13/2002 | EP1187202A2 Semiconductor package |
| 03/13/2002 | EP1187201A1 Multiple-chip module |
| 03/13/2002 | EP1187200A2 Semiconductor device with an improved bonding pad structure |
| 03/13/2002 | EP1187199A2 Heatsink for Semiconductor Device, Method of Mannufacturing the same, as well as Molding Die therefore |
| 03/13/2002 | EP1187198A2 Metal-ceramic circuit board and manufacturing method thereof |
| 03/13/2002 | EP1187197A2 Package for a semiconductor chip with a thermally conductive base and resin walls |
| 03/13/2002 | EP1187196A2 Method of manufacturing an optical semiconductor module |
| 03/13/2002 | EP1187192A2 Process for the fabrication of an electrically conductive connection |
| 03/13/2002 | EP1186689A1 Thermally conductive polymer composition and thermally conductive molded article |
| 03/13/2002 | EP1186685A2 Method for forming silicon carbide films |
| 03/13/2002 | EP1186216A1 Composite electronics packages and methods of manufacture |
| 03/13/2002 | EP1186042A1 Integrated circuit with programmable memory element |
| 03/13/2002 | EP1186041A2 Low-inductance semiconductor component |
| 03/13/2002 | EP1186040A1 Improved rf power transistor |
| 03/13/2002 | EP1186039A1 Security method and device for a chip stack with a multidimensional structure |
| 03/13/2002 | EP1186038A1 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics |
| 03/13/2002 | EP1186037A1 Multi-chip module for leads-on-chip (loc) assembly and method for production of the same. |
| 03/13/2002 | EP1186036A1 Electronic device with flexible contacting points |
| 03/13/2002 | EP1186035A1 Electronic component with flexible contact structures and method for the production of said component |
| 03/13/2002 | EP1186034A1 Robust interconnect structure |
| 03/13/2002 | EP1186033A1 Carrier for electronic components and a method for manufacturing a carrier |
| 03/13/2002 | EP1186032A2 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin |
| 03/13/2002 | EP1186031A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring |
| 03/13/2002 | EP1186026A1 Fabrication method for self-aligned cu diffusion barrier in an integrated circuit |
| 03/13/2002 | EP1186022A2 Method and apparatus for enabling conventional wire bonding to copper-based bond pad features |
| 03/13/2002 | EP1186016A1 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices |
| 03/13/2002 | EP1186009A1 Method for removal of sic |
| 03/13/2002 | CN2482222Y Clamp for radiator aluminium base plate |
| 03/13/2002 | CN2482221Y Intelligent radiator |
| 03/13/2002 | CN1340214A Integrated circuit comprising an inductor which prevents latch-up and method for its manufacture |
| 03/13/2002 | CN1340212A Integrated circuit device, electronic module for chip card using said device and method for making same |
| 03/13/2002 | CN1340211A Semiconductor device with deep substrate contacts |
| 03/13/2002 | CN1340082A 环氧树脂组合物 The epoxy resin composition |
| 03/13/2002 | CN1339942A Cooling unit for cooling heating element and electronic equipment mounted with said cooling unit |
| 03/13/2002 | CN1339825A Semiconductor and its design method and design device |
| 03/13/2002 | CN1339824A Semiconductor device and its producing method |
| 03/13/2002 | CN1339823A Heat radiator for electric circuit element |
| 03/13/2002 | CN1339822A Base for producing semiconductor device by using three element alloy |
| 03/13/2002 | CN1339821A Sealing structure for flip chip on carrier |
| 03/13/2002 | CN1339819A Lead wire frame and its producing method |
| 03/13/2002 | CN1339800A MRAM capable of effectively overcoming noise |
| 03/13/2002 | CN1080984C Panel assembly structure |
| 03/13/2002 | CN1080932C Metallic film for sealing semiconductor |
| 03/13/2002 | CN1080931C Techonlogy for production of frame for enclosing semiconductor leadwire |
| 03/13/2002 | CN1080928C Method for planarization of semiconductor device |
| 03/13/2002 | CN1080927C Method for detecting water defects |
| 03/13/2002 | CN1080746C Inorganic filler, epoxy resin composition, and semiconductor device |
| 03/13/2002 | CN1080616C Solder and soldered electronic component and electric circuit board |
| 03/12/2002 | US6356958 Integrated circuit module has common function known good integrated circuit die with multiple selectable functions |
| 03/12/2002 | US6356453 Electronic package having flip chip integrated circuit and passive chip component |
| 03/12/2002 | US6356446 Slotted rail heat sink retainer clip |
| 03/12/2002 | US6356445 Heat dissipating device for electronic device |
| 03/12/2002 | US6356183 Method of manufacturing an inductor |
| 03/12/2002 | US6356173 High-frequency module coupled via aperture in a ground plane |
| 03/12/2002 | US6355985 Integrated circuit device and synchronous-link dynamic random access memory device |
| 03/12/2002 | US6355984 Input-output circuit cell and semiconductor integrated circuit apparatus |
| 03/12/2002 | US6355983 Surface modified interconnects |
| 03/12/2002 | US6355981 Wafer fabrication of inside-wrapped contacts for electronic devices |
| 03/12/2002 | US6355980 Dual die memory |
| 03/12/2002 | US6355979 Hard mask for copper plasma etch |
| 03/12/2002 | US6355978 Package for accommodating electronic parts, semiconductor device and method for manufacturing package |
| 03/12/2002 | US6355977 Semiconductor chip or device having a connecting member formed on a surface protective film |
| 03/12/2002 | US6355976 Three-dimensional packaging technology for multi-layered integrated circuits |
| 03/12/2002 | US6355975 Semiconductor device and manufacturing method thereof |
| 03/12/2002 | US6355972 Semiconductor device and method of manufacturing same |
| 03/12/2002 | US6355970 Semiconductor device having a high frequency electronic circuit |
| 03/12/2002 | US6355969 Programmable integrated circuit structures and methods for making the same |
| 03/12/2002 | US6355968 Wiring through terminal via fuse |
| 03/12/2002 | US6355967 Semiconductor device and method of manufacturing the same |
| 03/12/2002 | US6355958 Spark gap for hermetically packaged integrated circuits |
| 03/12/2002 | US6355950 Substrate interconnect for power distribution on integrated circuits |
| 03/12/2002 | US6355785 Enzyme inhibitors |
| 03/12/2002 | US6355575 Depositing layer comprising hydrogen silsesquioxane on conductive pattern, forming two dielectric layers, forming photoresist mask on second dielectric layer, etching to form opening exposing first dielectric layer, removing photoresist |
| 03/12/2002 | US6355572 Etching contact holes in insulating film composed of organic spin on glass using resist pattern formed over insulating layer as mask, removing resist pattern by plasma treatment in gas mixture of oxygen and diimide |
| 03/12/2002 | US6355571 Method and apparatus for reducing copper oxidation and contamination in a semiconductor device |
| 03/12/2002 | US6355552 Integrated circuit with stop layer and associated fabrication process |
| 03/12/2002 | US6355551 Integrated circuit having a void between adjacent conductive lines |
| 03/12/2002 | US6355542 Semiconductor device and manufacturing method |
| 03/12/2002 | US6355535 Method and structure of manufacturing a high-Q inductor with an air trench |
| 03/12/2002 | US6355507 Method of forming overmolded chip scale package and resulting product |
| 03/12/2002 | US6355506 Method of forming heat sink and semiconductor chip assemblies |
| 03/12/2002 | US6355502 Semiconductor package and method for making the same |
| 03/12/2002 | US6355500 Semiconductor device and manufacturing method thereof |
| 03/12/2002 | US6355499 Method of making ball grid array package |
| 03/12/2002 | US6355362 Electronics packages having a composite structure and methods for manufacturing such electronics packages |
| 03/12/2002 | US6355340 Low expansion metal matrix composites |
| 03/12/2002 | US6355298 Positioning transferring device relative to surface so that recognizing means disposed on transferring device detects alignment mark on surface; positioning transferring device; aligning one of transferring devices; placing two elements |
| 03/12/2002 | US6355199 Method of molding flexible circuit with molded stiffener |
| 03/12/2002 | US6355131 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/12/2002 | US6355101 Flux transfer apparatus |
| 03/12/2002 | US6354916 Modified plating solution for plating and planarization and process utilizing same |
| 03/12/2002 | US6354902 Method of producing color selection electrode and cathode ray tube |
| 03/12/2002 | US6354859 Cover assembly for an IC socket |
| 03/12/2002 | US6354856 IC socket and contact pin thereof |